Patents by Inventor Eiichi Murakoshi

Eiichi Murakoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package socket
    Patent number: 7871283
    Abstract: A semiconductor package socket (1, 101) has a socket base (10, 110) including a package rest (11, 111) on which a semiconductor package (50) having gull-wing leads (52) is put, a cover member (20, 120) movably attached on the socket base, and a plurality of contacts (30, 130) each including a first contact piece (31, 131) capable of making contact, from above, with a horizontal shoulder portion of the lead, a second contact piece (32, 132) capable of making contact, laterally, with a vertical leg portion of the lead and a fixed portion, and formed to advance onto or retract from the package rest due to vertical movement of the cover member. The package rest is formed with a dam wall that allows the leads to be lied thereover, wherein the first and the second contact pieces each have an elastic deforming portion to determine a contact pressure.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: January 18, 2011
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Eiichi Murakoshi, Hideki Sato, Hideki Sagano
  • SEMICONDUCTOR PACKAGE SOCKET
    Publication number: 20100261370
    Abstract: A semiconductor package socket (1, 101) has a socket base (10, 110) including a package rest (11, 111) on which a semiconductor package (50) having gull-wing leads (52) is put, a cover member (20, 120) movably attached on the socket base, and a plurality of contacts (30, 130) each including a first contact piece (31, 131) capable of making contact, from above, with a horizontal shoulder portion of the lead, a second contact piece (32, 132) capable of making contact, laterally, with a vertical leg portion of the lead and a fixed portion, and formed to advance onto or retract from the package rest due to vertical movement of the cover member. The package rest is formed with a dam wall that allows the leads to be lied thereover, wherein the first and the second contact pieces each have an elastic deforming portion to determine a contact pressure.
    Type: Application
    Filed: December 3, 2007
    Publication date: October 14, 2010
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Eiichi Murakoshi, Hideki Sato, Hideki Sagano
  • Cartridge for contact terminals and semiconductor device socket provided with the same
    Patent number: 7563144
    Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: July 21, 2009
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Shuuji Kunioka, Katsumi Suzuki, Eiichi Murakoshi
  • Cartridge for contact terminals and semiconductor device socket provided with the same
    Patent number: 7556507
    Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: July 7, 2009
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Shuuji Kunioka, Katsumi Suzuki, Eiichi Murakoshi
  • Cartridge for contact terminals and semiconductor device socket provided with the same
    Publication number: 20080160797
    Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.
    Type: Application
    Filed: December 20, 2007
    Publication date: July 3, 2008
    Inventors: Shuuji Kunioka, Katsumi Suzuki, Eiichi Murakoshi
  • Cartridge for contact terminals and semiconductor device socket provided with the same
    Publication number: 20080113528
    Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.
    Type: Application
    Filed: December 20, 2007
    Publication date: May 15, 2008
    Inventors: Shuuji Kunioka, Katsumi Suzuki, Eiichi Murakoshi
  • Cartridge for contact terminals and semiconductor device socket provided with the same
    Patent number: 7335030
    Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.
    Type: Grant
    Filed: March 9, 2006
    Date of Patent: February 26, 2008
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Shuuji Kunioka, Katsumi Suzuki, Eiichi Murakoshi
  • Cartridge for contact terminals and semiconductor device socket provided with the same
    Publication number: 20060205247
    Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.
    Type: Application
    Filed: March 9, 2006
    Publication date: September 14, 2006
    Inventors: Shuuji Kunioka, Katsumi Suzuki, Eiichi Murakoshi