Abstract: A method for manufacturing a multilayer wiring board is disclosed. The Method comprises a step (I) of preparing printed wiring boards having both electrical connection pads for establishing an electrical connection between the boards and non-connection pads for not establishing an electrical connection between the boards on the same plane; and a lamination step (II) of overlaying the boards so that the electrical connection pads face each other, and laminating the boards so that the boards are bonded to each other through a conductive material provided between the facing electrical connection pads. In the step (I), to at least one of surfaces faced when the boards are overlaid in the step (II), an insulating film having through holes formed in positions corresponding to the electrical connection pads on the surface is attached (Ia), and the conductive material is provided in the through holes (Ib).

Abstract: A method for manufacturing a multilayer wiring board is disclosed. The method includes steps of preparing printed wiring boards having both electrical connection pads for establishing an electrical connection between the boards and non-connection pads for not establishing an electrical connection between the boards on the same plane, overlaying the boards so that the electrical connection pads face each other, and laminating the boards so that the boards are bonded to each other through a conductive paste provided between the facing electrical connection pads. To prepare the printed wiring boards, attach an insulating film to at least one of surfaces faced when the boards are overlaid in the overlaying, bore holes in the insulating film so that the electrical connection pads are exposed, and provide a conductive paste in the holes.

Abstract: A method for manufacturing a multilayer wiring board is disclosed. The method comprises a printed wiring board manufacturing step (I) of preparing printed wiring boards having both electrical connection pads for establishing an electrical connection between the boards and non-connection pads for not establishing an electrical connection between the boards on the same plane; and a lamination step (II) of overlaying the boards so that the electrical connection pads face each other, and laminating the boards so that the boards are bonded to each other through a conductive paste provided between the facing electrical connection pads. In the step (I), (Ia) an insulating film is attached to at least one of surfaces faced when the boards are overlaid in the lamination step (II), (Ib) holes are bored in the insulating film so that the electrical connection pads are exposed, and (Ic) a conductive paste is provided in the holes.

Abstract: A method for manufacturing a multilayer wiring board is disclosed. The Method comprises a step (I) of preparing printed wiring boards having both electrical connection pads for establishing an electrical connection between the boards and non-connection pads for not establishing an electrical connection between the boards on the same plane; and a lamination step (II) of overlaying the boards so that the electrical connection pads face each other, and laminating the boards so that the boards are bonded to each other through a conductive material provided between the facing electrical connection pads. In the step (I), to at least one of surfaces faced when the boards are overlaid in the step (II), an insulating film having through holes formed in positions corresponding to the electrical connection pads on the surface is attached (Ia), and the conductive material is provided in the through holes (Ib).

Abstract: An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the condensation resin has a cyclohexane ring.

Abstract: An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.; and (2) the condensation resin has a polyoxyalkanediyl group.

Abstract: An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A). and the monomer (B) is liquid at 25° C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the monomer (A) contains an isophthalic acid.

Abstract: An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A). and the monomer (B) is liquid at 25° C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the monomer (A) contains an isophthalic acid.

Abstract: An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.; and (2) the condensation resin has a polyoxyalkanediyl group.

Abstract: An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the condensation resin has a cyclohexane ring.

Abstract: Provided is a method for manufacturing a multilayer wiring board, by which interlayer connection is efficiently performed and a non-penetrating hole having a hollow structure or a through hole can be formed at the same time without damaging a plated portion on the inner wall of the through hole. A first printed board (1) is provided with a wiring, which has a wiring section and a bump mounting pad (14), and a substrate section. The method is provided with a step of forming a solder bump (3) on at least a bump mounting pad on the first printed board or a pad section of a second printed board (2) having the pad section (15) by using a solder paste, and a step of bonding the first printed board and the second printed board in layers by having an insulating adhesive (4) between the first printed board and the second printed board and electrically connecting the first printed board with the second printed board.

Abstract: Provided is a method for manufacturing a multilayer wiring board, by which interlayer connection is efficiently performed and a non-penetrating hole having a hollow structure or a through hole can be formed at the same time without damaging a plated portion on the inner wall of the through hole. A first printed board (1) is provided with a wiring, which has a wiring section and a bump mounting pad (14), and a substrate section. The method is provided with a step of forming a solder bump (3) on at least a bump mounting pad on the first printed board or a pad section of a second printed board (2) having the pad section (15) by using a solder paste, and a step of bonding the first printed board and the second printed board in layers by having an insulating adhesive (4) between the first printed board and the second printed board and electrically connecting the first printed board with the second printed board.

Abstract: An adhesive composition including (a) a polyamide-imide resin preferably having a molecular weight of 80,000 or more and (b) a thermosetting component preferably including an epoxy resin and a curing agent and/or a curing accelerator therefor is used for providing an insulating adhesive layer having a storage elastic modulus at 300.degree. C. of 30 MPa or more and a glass transition temperature of 180.degree. C. or higher. The insulating adhesive is suitable for use in wire scribed circuit boards, multilayer printed circuit boards, and circuit boards for chip carriers.

Abstract: A multiple wire printed circuit board including printed conductor circuit layers, adhesive layers with wires having insulating coating embedded and fixed therein, insulating layers, and connecting through-holes formed at locations where connections will be made, wherein the conductor circuit layers are insulated from other circuit conductors, and the difference in glass transition point between each adhesive layer and the adjoining insulating layer is within the range of 60.degree. C., remains free of peel and voids despite heat history applied to the board, and is capable of high-density wiring, multiplication of circuit layers and a reduction of the number of the manufacturing steps.

Abstract: A heat resistant resin composition comprising (a) a polyamide-imide resin and (b) a thermosetting resin component, said composition giving a cured product having a storage elastic modulus at 300.degree. C. of 30 MPa or more, provides an adhesive sheet showing excellent solder heat resistance.

Abstract: A multiple wire printed circuit board including printed conductor circuit layers, adhesive layers with wires having insulating coating embedded and fixed therein, insulating layers, and connecting through-holes formed at locations where connections will be made, wherein the conductor circuit layers are insulated from other circuit conductors, and the difference in glass transition point between each adhesive layer and the adjoining insulating layer is within the range of 60.degree. C., remains free of peel and voids despite heat history applied to the board, and is capable of high-density wiring, multiplication of circuit layers and a reduction of the number of the manufacturing steps.

Abstract: An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

Abstract: An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

Abstract: An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.