Abstract: A surface acoustic wave device includes a piezoelectric substrate made of LiTaO3 or LiNbO3 having an electromechanical coefficient of about 15% or more, at least one electrode which is disposed on the piezoelectric substrate and which is a laminate film having a metal layer defining a primary metal layer primarily composed of a metal having a density higher than that of Al or an alloy of the metal and a metal layer which is laminated on the primary metal layer and which is composed of another metal, and a first SiO2 layer which is disposed in a remaining area other than that at which the at least one electrode is located and which has a thickness approximately equivalent to that of the electrode. In the surface acoustic wave device described above, the density of the electrode is at least about 1.5 times that of the first SiO2 layer.

Abstract: A surface acoustic wave device includes a piezoelectric substrate made of LiTaO3 or LiNbO3 having an electromechanical coefficient of about 15% or more, at least one electrode which is disposed on the piezoelectric substrate and which is a laminate film having a metal layer defining a primary metal layer primarily composed of a metal having a density higher than that of Al or an alloy of the metal and a metal layer which is laminated on the primary metal layer and which is composed of another metal, and a first SiO2 layer which is disposed in a remaining area other than that at which the at least one electrode is located and which has a thickness approximately equivalent to that of the electrode. In the surface acoustic wave device described above, the density of the electrode is at least about 1.5 times that of the first SiO2 layer.

Abstract: A surface acoustic wave device includes a piezoelectric substrate made of LiTaO3 or LiNbO3 having an electromechanical coefficient of about 15% or more, at least one electrode which is disposed on the piezoelectric substrate and which is a laminate film having a metal layer defining a primary metal layer primarily composed of a metal having a density higher than that of Al or an alloy of the metal and a metal layer which is laminated on the primary metal layer and which is composed of another metal, and a first SiO2 layer which is disposed in a remaining area other than that at which the at least one electrode is located and which has a thickness approximately equivalent to that of the electrode. In the surface acoustic wave device described above, the density of the electrode is at least about 1.5 times that of the first SiO2 layer.

Abstract: A method for manufacturing an electronic component includes the steps of forming an electrode layer including ?-tungsten on a substrate at a substrate temperature of about 100° C. to about 300° C. by a sputtering process, processing the electrode layer so as to have a desired shape, and heat-treating the electrode layer. An electronic component includes a substrate and an electrode layer that is disposed on the substrate directly or indirectly, includes ?-tungsten, and has a specific resistance of about 15 ??.cm or less and a warpage of about 120 ?m or less. A surface acoustic wave filter includes a piezoelectric substrate and an electrode layer, disposed on the piezoelectric substrate, including ?-tungsten.

Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.

Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.

Abstract: A method for manufacturing an electronic component includes the steps of forming an electrode layer including &agr;-tungsten on a substrate at a substrate temperature of about 100° C. to about 300° C. by a sputtering process, processing the electrode layer so as to have a desired shape, and heat-treating the electrode layer. An electronic component includes a substrate and an electrode layer that is disposed on the substrate directly or indirectly, includes &agr;-tungsten, and has a specific resistance of about 15 &mgr;&OHgr;.cm or less and a warpage of about 120 &mgr;m or less. A surface acoustic wave filter includes a piezoelectric substrate and an electrode layer, disposed on the piezoelectric substrate, including &agr;-tungsten.

Abstract: A method for producing a surface acoustic wave device, includes the steps of preparing a piezoelectric substrate, forming a thin film electrode on the piezoelectric substrate, etching the thin film electrode for forming an IDT, trimming at least one of the piezoelectric substrate and the IDT to adjust an operation frequency of the surface acoustic wave device, and rapidly altering the surface of the IDT for stabilizing the surface of the IDT.

Abstract: An in-line sputtering apparatus includes a deposition chamber, a target installed inside the deposition chamber, a substrate holder to hold a substrate, a substrate holder transferring mechanism which transfers the substrate holder relative to the target such that a thin film made of a material of the target that is formed on the substrate held by the substrate holder, first and second thickness distribution correcting members and a plate driving mechanism. The first and second thickness distribution correcting members are provided above the target, and each of the first and second thickness distribution correcting members has a plurality of movable plates. The plate driving mechanism is linked to the first and second thickness distribution correcting members and moves the corresponding movable plates of the first and second distribution correcting plates, symmetrically.

Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.

Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.

Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.

Abstract: An angular velocity sensor includes a support body, a plurality of beams individually supported by the support body, and a coupling part with which a plurality of the beams are commonly coupled, and a vibrating weight formed on the coupling part, wherein each beam comprises a wide beam part and a narrow beam part narrower than the wide beam part.

Abstract: An in-line sputtering apparatus includes a deposition chamber, a target installed inside the deposition chamber, a substrate holder to hold a substrate, a substrate holder transferring mechanism which transfers the substrate holder relative to the target such that a thin film made of a material of the target that is formed on the substrate held by the substrate holder, first and second thickness distribution correcting members and a plate driving mechanism. The first and second thickness distribution correcting members are provided above the target, and each of the first and second thickness distribution correcting members has a plurality of movable plates. The plate driving mechanism is linked to the first and second thickness distribution correcting members and moves the corresponding movable plates of the first and second distribution correcting plates, symmetrically.

Abstract: A downsized angular velocity sensor is disclosed in which the detection sensitivity is improved. An oscillator oscillatably supported by support beams along two horizontal axes is formed of two rod-like members extending along the Y axis and an interconnecting portion. A hollow region is formed between each of the rod-like members and the interconnecting portion. Displacement detecting sections are disposed in the hollow regions. The displacement detecting sections are each constructed of an antenna-like electrode array, so that a greater amount of change in capacitance generated between the antenna-like electrodes can be obtained.

Abstract: In an angular velocity sensor for sensing angular velocities about two axes or an X-axis and a Y-axis which are perpendicular to each other, a frame-shaped oscillator 26 is disposed to the respective support portions 24 fixed on a substrate 22 through support beams 25 and a columnar electrode 33 is disposed in the oscillator 26 by being fixed to the substrate 22 . X-axis displacement sensing units 31, 31 are formed on the right and left sides of the oscillator 26 and Y-axis displacement sensing units 32, 32 are formed to the forward and rearward sides thereof. When an oscillation drive signal is imposed between the oscillator 26 and the columnar electrode 33, an electrostatic attracting force is generated therebetween and the oscillator 26 is oscillated in a Z-axis direction. When an angular velocity .OMEGA.

Abstract: A liquid sensor for detecting, in a non-contact manner, whether an electrolyte solution is flowing through a pipeline. A pair of electrodes, on which an AC voltage is impressed, are mounted on the outer surface of a pipeline formed of a material having a high dielectric constant, such as a ceramic, and a discrimination between the presence and the absence of the electrolyte solution in the pipeline is made based on variations in capacitance between the electrodes. In the presence of the electrolyte solution flowing through the pipeline, the capacitance between the electrodes is high because of the conductivity of the electrolyte solution. In the absence of the electrolyte solution flowing through the pipeline, the capacitance is determined by air and is, therefore, low. Since the electrodes are maintained in a non-contact relation with the electrolyte solution, degradation of characteristics due to corrosion is obviated.

Abstract: In a frost and dew sensor composed of two thermosensitive resistors, a power source and an arithmetic circuit, frost or dew is detected from the change of a differential temperature between the two thermosensitive resistors as two different currents from the power source are supplied to the respective thermosensitive resistors. In an alternative form, the sensor has a single thermosensitive resistor, which is energized as two different currents are alternately supplied from the power source so that frost or dew is detected by comparison of the time-lags between the two outputs from the thermosensitive resistor.

Abstract: In a frost and dew sensor composed of two thermosensitive resistors, a power source and an arithmetic circuit, frost or dew is detected from the change of a differential temperature between the two thermosensitive resistors as two different currents from the power source are supplied to the respective thermosensitive resistors. In an alternative form, the sensor has a single thermosensitive resistor, which is energized as two different currents are alternately supplied from the power source so that frost or dew is detected by comparison of the time-lags between the two outputs from the thermosensitive resistor.