Abstract: A chip package device comprises on its outside surface a plurality of wire bonding electrodes adjacent a plurality of facedown electrodes. The chip package device comprises an IC chip having a plurality of chip electrodes on its face surface and a contact sheet having an inside surface on the face surface and comprising on the outside surface a plurality of conductor patterns which comprises portions extending through the contact sheet to the chip electrodes, respectively, and defines the facedown and the wire bonding electrodes. Such chip package devices can be mounted on a printed circuit board in whichever of a facedown and a wire bonding manner when primary and secondary pads are formed on the board for mechanical and electrical connection to the facedown electrodes, respectively, and for electric connection by bonding wires to the wire bonding electrodes, respectively.

Abstract: A chip package device comprises on its outside surface a plurality of wire bonding electrodes adjacent a plurality of facedown electrodes. The chip package device comprises an IC chip having a plurality of chip electrodes on its face surface and a contact sheet having an inside surface on the face surface and comprising on the outside surface a plurality of conductor patterns which comprises portions extending through the contact sheet to the chip electrodes, respectively, and defines the facedown and the wire bonding electrodes. Such chip package devices can be mounted on a printed circuit board in whichever of a facedown and a wire bonding manner when primary and secondary pads are formed on the board for mechanical and electrical connection to the facedown electrodes, respectively, and for electric connection by bonding wires to the wire bonding electrodes, respectively.

Abstract: An insulating film has conductive layers on a first surface and conductive protrusions on a second surface. The conductive layers are connected to the conductive protrusions via through holes provided in the insulating film. A semiconductor chip having pads is adhered by an adhesive layer to the insulating film. Then, the conductive layers are locally pressured, so that the conductive layers are electrically connected to respective ones of the pads.

Abstract: An insulating film has conductive layers on a first surface and conductive protrusions on a second surface. The conductive layers are connected to the conductive protrusions via through holes provided in the insulating film. A semiconductor chip having pads is adhered by an adhesive layer to the insulating film. Then, the conductive layers are locally pressured, so that the conductive layers are electrically connected to respective ones of the pads.