Patents by Inventor Eiji Kono
Eiji Kono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9751219Abstract: An umbilical member clamping device includes a base member attached to a body of a robot, an elastic body provided so as to surround a periphery of an umbilical member bundle including umbilical members, a clamp member secured to the base member so as to press the umbilical member bundle to the base member via the elastic body, and an insert member inserted to a corner portion of a space which receives the umbilical member bundle and which is defined by the clamp member and the base member when the clamp member is secured to the base member.Type: GrantFiled: August 31, 2015Date of Patent: September 5, 2017Assignee: Fanuc CorporationInventors: Eiji Kono, Hidenori Kurebayashi
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Publication number: 20160067870Abstract: An umbilical member clamping device includes a base member attached to a body of a robot, an elastic body provided so as to surround a periphery of an umbilical member bundle including umbilical members, a clamp member secured to the base member so as to press the umbilical member bundle to the base member via the elastic body, and an insert member inserted to a corner portion of a space which receives the umbilical member bundle and which is defined by the clamp member and the base member when the clamp member is secured to the base member.Type: ApplicationFiled: August 31, 2015Publication date: March 10, 2016Applicant: FANUC CORPORATIONInventors: Eiji Kono, Hidenori Kurebayashi
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Patent number: 8760582Abstract: System and method for changing a current input terminal of a user device. In one embodiment of the invention, a method includes receiving an input terminal change request, requesting that a current input terminal be changed from a first input terminal to a second input terminal. The method may further include determining if an external device is connected to the second input terminal. In one embodiment of the invention, the second input terminal includes a connection detection switch. The method may also include switching to the second input terminal when the connection detection switch indicates an external device connection and skipping the second input terminal when the connection detection switch indicates no external device connected according to one embodiment of the invention.Type: GrantFiled: February 6, 2007Date of Patent: June 24, 2014Assignees: Sony Corporation, Sony Electronics Inc.Inventors: Peter Shintani, Eiji Kono
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Publication number: 20140140004Abstract: A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins.Type: ApplicationFiled: February 27, 2013Publication date: May 22, 2014Applicants: SHOWA DENKO K.K., KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Hidehito KUBO, Masahiko Kimbara, Keiji Toh, Kota Otoshi, Eiji Kono, Katsufumi Tanaka, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi
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Publication number: 20140092305Abstract: A circuit for detection of an HDMI source device to an HDMI sink device through an HDMI sink connector without regard for the activity state of the HDMI source device has a pull-up resistor connecting a DC power source to the DDC/CEC ground node. The node is readable as a binary signal to indicate the presence of a source device to the HDMI sink connector, where the node exhibits a logic low signal when either the node is grounded by the DDC/CEC GROUND pin connection to a source device or when a switching device is switched on. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.Type: ApplicationFiled: December 4, 2013Publication date: April 3, 2014Applicants: SONY ELECTRONICS INC., SONY CORPORATIONInventors: PAUL DOYLE, EIJI KONO, TETSUYA NOMURA, PETER RAE SHINTANI
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Patent number: 8625029Abstract: A circuit for detection of an HDMI source device to an HDMI sink device through an HDMI sink connector without regard for the activity state of the HDMI source device has a pull-up resistor having first and second terminals with the first terminal coupled to a DC power source. A switching device is coupled between the pull-up resistor's second terminal and ground at a circuit node. The switching device is switched on to couple the circuit node to ground when power is applied to a control terminal thereof from the HDMI sink connector power pin, and being switched off otherwise. The circuit node is coupled to a DDC/CEC GROUND pin of the HDMI sink connector. The circuit node is readable as a binary signal to indicate the presence of a source device to the HDMI sink connector, wherein the node exhibits a logic low signal when either the node is grounded by the DDC/CEC GROUND pin connection to a source device or when the switching device is switched on.Type: GrantFiled: December 17, 2007Date of Patent: January 7, 2014Assignees: Sony Corporation, Sony Electronics Inc.Inventors: Paul Doyle, Eiji Kono, Tetsuya Nomura, Peter Rae Shintani
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Patent number: 8411438Abstract: A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.Type: GrantFiled: June 27, 2006Date of Patent: April 2, 2013Assignees: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K.Inventors: Hidehito Kubo, Masahiko Kimbara, Keiji Toh, Kota Otoshi, Eiji Kono, Katsufumi Tanaka, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi
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Patent number: 8387685Abstract: A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50.Type: GrantFiled: April 19, 2006Date of Patent: March 5, 2013Assignees: Kabushiki Kaisha Toshiba Jidoshokki, Showa Denko K.K.Inventors: Masahiko Kimbara, Keiji Toh, Hidehito Kubo, Katsufumi Tanaka, Kota Otoshi, Eiji Kono, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi
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Patent number: 8391011Abstract: A cooling device includes a heat sink having a top plate, a bottom plate spaced from the top plate and fins between the top and bottom plates, a first metal member laminated to the side of the top plate that is opposite from the fins, and a first insulator laminated to the first metal member. The top plate, the bottom plate and the first metal member are each made of a clad metal that is composed of a base metal and a brazing metal, so that the fins are brazed to the top and bottom plates, the first metal member is brazed to the top plate, and the first insulator is brazed to the first metal member.Type: GrantFiled: March 23, 2011Date of Patent: March 5, 2013Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Shogo Mori, Eiji Kono
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Patent number: 8299606Abstract: A semiconductor device is provided that may include an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, and a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate. The heat sink may include a housing that is made of a metal sheet and radiating fins that are fixed in the housing and made of aluminum. The metal sheet may have a coefficient of thermal expansion between those of the insulating substrate and the radiating fin.Type: GrantFiled: January 30, 2012Date of Patent: October 30, 2012Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Shogo Mori, Eiji Kono, Keiji Toh
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Patent number: 8283773Abstract: A semiconductor device includes an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate and at least one anti-warping sheet disposed on at least one surface of the heat sink. The anti-warping sheet is made of a metal sheet having a coating layer and has coefficient of thermal expansion between those of the insulating substrate and the heat sink.Type: GrantFiled: February 2, 2010Date of Patent: October 9, 2012Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Shogo Mori, Eiji Kono, Keiji Toh
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Patent number: 8198539Abstract: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.Type: GrantFiled: July 5, 2006Date of Patent: June 12, 2012Assignees: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K.Inventors: Kota Otoshi, Eiji Kono, Keiji Toh, Katsufumi Tanaka, Yuichi Furukawa, Shinobu Yamauchi, Ryoichi Hoshino, Nobuhiro Wakabayashi, Shintaro Nakagawa
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Publication number: 20120126390Abstract: A semiconductor device is provided that may include an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, and a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate. The heat sink may include a housing that is made of a metal sheet and radiating fins that are fixed in the housing and made of aluminum. The metal sheet may have a coefficient of thermal expansion between those of the insulating substrate and the radiating fin.Type: ApplicationFiled: January 30, 2012Publication date: May 24, 2012Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Shogo MORI, Eiji KONO, Keiji TOH
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Publication number: 20110235279Abstract: A cooling device includes a heat sink having a top plate, a bottom plate spaced from the top plate and fins between the top and bottom plates, a first metal member laminated to the side of the top plate that is opposite from the fins, and a first insulator laminated to the first metal member. The top plate, the bottom plate and the first metal member are each made of a clad metal that is composed of a base metal and a brazing metal, so that the fins are brazed to the top and bottom plates, the first metal member is brazed to the top plate, and the first insulator is brazed to the first metal member.Type: ApplicationFiled: March 23, 2011Publication date: September 29, 2011Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Shogo MORI, Eiji KONO
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Patent number: 7923833Abstract: A semiconductor module 10 includes a ceramic substrate having a front surface on which a semiconductor element 12 is mounted and a rear surface on the opposite side of the front surface, a front metal plate 15 joined to the front surface, a rear metal plate 16 joined to the rear surface, and a heat sink 13 joined to the rear metal plate 16. The rear metal plate 16 includes a joint surface 16b that faces the heat sink 13. The joint surface 16b includes a joint area and a non-joint area. The non-joint area includes recesses 18 which extend in the thickness direction of the rear metal plate 16. The joint area of the rear metal plate 16 is in a range from 65% to 85% of the total area of the joint surface 16b on the rear metal plate 16. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.Type: GrantFiled: December 11, 2006Date of Patent: April 12, 2011Assignees: Showa Denko K.K., Kabushiki Kaisha Toyota JidoshokkiInventors: Yuichi Furukawa, Shinobu Yamauchi, Nobuhiro Wakabayashi, Shintaro Nakagawa, Keiji Toh, Eiji Kono, Kota Otoshi, Katsufumi Tanaka
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Patent number: 7923242Abstract: The objective of the present invention is to provide a simple microorganism detection apparatus that reduces detection time and that provides improved detection sensitivity, especially for gram-negative bacteria. The microorganism detection apparatus of the present invention includes: a detection target introduction portion, into which a sample and reagents are to be introduced; a detector, for detecting the color tone of the reagent introduced into the detection target introduction portion; a sample holder, for holding the sample to be introduced into the detection target introduction portion; a culture solution holder, for holding a culture solution used for microorganism culturing; and reagent holders, for holding the reagents to be introduced into the detection target introduction portion, wherein the presence/absence of microorganisms in the sample is determined based on the detected color tone.Type: GrantFiled: February 3, 2006Date of Patent: April 12, 2011Assignee: Sanyo Electric Co., Ltd.Inventors: Eiji Kono, Hironobu Sekine, Yasuhiko Yokoi, Akihumi Iwama
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Publication number: 20100193941Abstract: A semiconductor device includes an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate and at least one anti-warping sheet disposed on at least one surface of the heat sink. The anti-warping sheet is made of a metal sheet having a coating layer and has coefficient of thermal expansion between those of the insulating substrate and the heat sink.Type: ApplicationFiled: February 2, 2010Publication date: August 5, 2010Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Shogo MORI, Eiji KONO, Keiji TOH
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Publication number: 20090314474Abstract: A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50.Type: ApplicationFiled: April 19, 2006Publication date: December 24, 2009Applicants: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, SHOWA DENKO K.K.Inventors: Masahiko Kimbara, Keiji Toh, Hidehito Kubo, Katsufumi Tanaka, Kota Otoshi, Eiji Kono, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi
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Publication number: 20090302458Abstract: A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.Type: ApplicationFiled: June 27, 2006Publication date: December 10, 2009Inventors: Hidehito Kubo, Masahiko Kimbara, Keiji Toh, Kota Otoshi, Eiji Kono, Katsufumi Tanaka, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi
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Publication number: 20090200065Abstract: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.Type: ApplicationFiled: July 5, 2006Publication date: August 13, 2009Applicants: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K.Inventors: Kota Otoshi, Eiji Kono, Keiji Toh, Katsufumi Tanaka, Yuichi Furukawa, Shinobu Yamauchi, Ryoichi Hoshino, Nobuhiro Wakabayashi, Shintaro Nakagawa