Abstract: According to one embodiment, a semiconductor memory device includes a memory, and a data transfer section configured to perform data transfer from and to the memory, and having a first mode to transfer data with a first bit width and a second mode to transfer data with a second bit width. The data transfer section includes a first latch circuit configured to hold first data read from the memory, a second latch circuit configured to hold second data having the first bit width of the first data in the first mode, and to hold third data having the second bit width of the first data in the second mode, and data bus connecting the first latch circuit to the second latch circuit and shared by the first and second modes.

Abstract: A fault after an assembling process is saved by using a tester. An error detector circuit compares read data from a memory cell and data from an external input/output terminal by means of a comparator circuit, thereby determining whether a memory cell is good or faulty. The error detector circuit outputs a sense signal COMPERR in the case where the memory cell is faulty. A self fuse program circuit causes a latch circuit LAi to latch an external address as a save address upon receipt of the sense signal COMPERR. By a counter Ci and a switch circuit SW, programming of a save address is carried out by transferring the save address latched at the latch circuit LAi to a fuse program circuit FPi on one bit by one bit basis.

Abstract: A semiconductor device that generates a desired internal power supply by using, as a reference potential, a potential obtained by adjusting a preset standard potential, the semiconductor device comprises; a reference potential selection circuit selecting the reference potential on the basis of digital data from among a plurality of potentials of different levels which are obtained by dividing a power supply voltage, and outputting the reference potential instead of the standard potential; a first decision circuit deciding bits of the digital data; a second decision circuit deciding the bits of the digital data, separately from the first decision circuit; and a data transfer circuit transferring to the reference potential selection circuit the digital data which is decided by either one of the first and second decision circuits.

Abstract: A semiconductor device that generates a desired internal power supply by using, as a reference potential, a potential obtained by adjusting a preset standard potential, the semiconductor device comprises; a reference potential selection circuit selecting said reference potential on the basis of digital data from among a plurality of potentials of different levels which are obtained by dividing a power supply voltage, and outputting said reference potential in place of said standard potential; a first decision circuit deciding bits of said digital data; a second decision circuit deciding the bits of said digital data, separately from said first decision circuit; and a data transfer circuit transferring to said reference potential selection circuit said digital data which is decided by either one of said first and second decision circuits.

Abstract: A fault after an assembling process is saved by using a tester. An error detector circuit compares read data from a memory cell and data from an external input/output terminal by means of a comparator circuit, thereby determining whether a memory cell is good or faulty. The error detector circuit outputs a sense signal COMPERR in the case where the memory cell is faulty. A self fuse program circuit causes a latch circuit LAi to latch an external address as a save address upon receipt of the sense signal COMPERR. By a counter Ci and a switch circuit SW, programming of a save address is carried out by transferring the save address latched at the latch circuit LAi to a fuse program circuit FPi on one bit by one bit basis.

Abstract: The output terminal of a voltage generation circuit is connected to one end portion of a fuse circuit. A transistor is connected to the other end portion of the fuse circuit. In program mode, a voltage generated from the voltage generation circuit is applied to the fuse circuit and a current flows through the fuse circuit and the transistor. In verify mode, a current generated from the voltage generation circuit flows into a pad through a selected fuse circuit and a detection circuit.

Abstract: The output terminal of a voltage generation circuit is connected to one end portion of a fuse circuit. A transistor is connected to the other end portion of the fuse circuit. In program mode, a voltage generated from the voltage generation circuit is applied to the fuse circuit and a current flows through the fuse circuit and the transistor. In verify mode, a current generated from the voltage generation circuit flows into a pad through a selected fuse circuit and a detection circuit.

Abstract: A semiconductor integrated circuit can precisely identify the level of an external input signal by stably supplying an internally stepped down voltage.

Abstract: Normal and reverse IC patterns are each a mirror image of the other. The normal and reverse IC patterns are simultaneously formed on a semiconductor wafer and are simultaneously tested. The wafer with these IC patterns is cut into chips, which are packaged. The normal and reverse IC packages show identical parasitic impedance and uniform performance.

Abstract: A semiconductor memory device has a plurality of memory cell arrays; input and output sections each provided so as to correspond to each of the memory cell arrays; and an allocating section provided between the memory cell arrays and the input and output sections, for allocating one of the memory cell arrays to one of the input output sections in ordinary mode, and a plurality of the memory cell arrays to one of the input and output sections in test mode. In the operation test mode, since only a part of the input and output sections are used, it is possible to decrease the number of chips connected to the I/O pins (whose maximum number is limited) of the tester so as to be testable simultaneously, so that the number of chips whose operation tests can be implemented simultaneously can be increased, thus reducing the time required for the operation test of the memory device as a whole.

Abstract: A semiconductor memory device is adapted for storing, as a unit of memory information, multiple-bit data constituted by signal data comprised of bit data of 2.sup.n bits (n is a natural number) and remainder data comprised of bit data of C bits (C is a natural number, C<2.sup.n). This semiconductor memory device includes a plurality of circuit blocks comprising, e.g., two memory cell groups each comprised of a plurality of memory cells, and a row decoder and a column decoder adapted for allowing respective desired ones of the memory cells within the memory cell groups to be selectively active. Thus, the row decoder and the column decoder become operative so that the bit data serving as the signal data is assigned to one or plural circuit blocks by one bit or plural bits, and the bit data serving as the remainder data is assigned to any circuit block in which bit assignment has been made.

Abstract: In a semiconductor device including a semiconductor chip, a lead frame with a die pad and plural leads, and a sealing body. The die pad is divided into a plurality of small pieces, and at least one of the plural divided pieces is electrically connected to at least one lead to which a potential is applied. Since the divided die pad is used as a wiring lead, the inductance and resistance of the voltage supply line or the ground line within the chip can be reduced, thus reducing the occurrence of supply voltage and output noise for prevention of erroneous operation.