Abstract: A first wiring substrate has a first wiring substrate main body and a first wiring pattern provided on a first surface of the first wiring substrate main body. A first electronic component is surface-mounted on the first wiring pattern. A second wiring substrate has a second wiring substrate main body and a second wiring pattern provided on a first surface of the second wiring substrate main body. The second wiring substrate is arranged under the first wiring substrate such that the first surface of the first wiring substrate main body opposes to the first surface of the second wiring substrate main body. A second electronic component is surface-mounted on the second wiring pattern, and arranged to oppose to the first electronic component. A resin member seals a space between the first wiring substrate and the second wiring substrate.

Abstract: An electronic device wherein an electronic element is electrically connected to a substrate through an interposer and a method of manufacturing the same are disclosed. The electronic device comprises an electronic element and an interposer including an interposer base to which the electronic element is joined and plural post electrodes connected to corresponding electrodes of the electronic element. In the electronic device, the electronic element and the interposer base are integrated with each other by being brought into direct contact with each other, and the post electrodes are formed directly on the corresponding electrodes of the electronic element.

Abstract: A first wiring substrate has a first wiring substrate main body and a first wiring pattern provided on a first surface of the first wiring substrate main body. A first electronic component is surface-mounted on the first wiring pattern. A second wiring substrate has a second wiring substrate main body and a second wiring pattern provided on a first surface of the second wiring substrate main body. The second wiring substrate is arranged under the first wiring substrate such that the first surface of the first wiring substrate main body opposes to the first surface of the second wiring substrate main body. A second electronic component is surface-mounted on the second wiring pattern, and arranged to oppose to the first electronic component. A resin member seals a space between the first wiring substrate and the second wiring substrate.

Abstract: An electronic parts packaging structure including an insulating layer acting as a flexible substrate, an electronic parts buried in the insulating layer in a state that a whole electronic parts is covered with the insulating layer, and a wiring layer buried in the insulating layer and connected electrically to a connection pad of the electronic parts. A structure body in which a plurality of electronic parts are buried in the insulating layer may be folded and electronic parts may be connected electrically.

Abstract: An insulating layer having an opening from which an electrode pad of a device is exposed is formed on the surface of a semiconductor substrate having the device fabricated therein, and an external terminal pad defined by a portion of a conductor layer formed on the insulating layer is connected to the electrode pad by means of a bonding wire. Further, a conductor post is formed on the external terminal pad, and an encapsulation resin layer is formed to coat a region on the semiconductor substrate in which the conductor post is formed, and to expose a top portion of the conductor post. An external connecting terminal is bonded to the top portion of the conductor post.

Abstract: An electronic component built-in board including an electronic component having an electrode; a conductive material part arranged in an identical plane to the electronic component; and a resin member configured to support the electronic component and the conductive material part in a state where an upper side and a bottom side of the electronic component and an upper side and a bottom side of the conductive material part are exposed.

Abstract: An insulating layer having an opening from which an electrode pad of a device is exposed is formed on the surface of a semiconductor substrate having the device fabricated therein, and an external terminal pad defined by a portion of a conductor layer formed on the insulating layer is connected to the electrode pad by means of a bonding wire. Further, a conductor post is formed on the external terminal pad, and an encapsulation resin layer is formed to coat a region on the semiconductor substrate in which the conductor post is formed, and to expose a top portion of the conductor post. An external connecting terminal is bonded to the top portion of the conductor post.

Abstract: There is provided a semiconductor device. The semiconductor device includes: a board, a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first front face, a first back face, and first external connection terminals provided on the first front face. The first semiconductor chip is mounted on the board via the first external connection terminals by flip-chip bonding. The second semiconductor chip has a second front face, a second back face, and second external connection terminals. The second semiconductor chip is mounted on the first semiconductor chip. The second front face has a contact region contacting the first back face of the first semiconductor chip. The second external connection terminals are provided on the second front face except the contact region. The second semiconductor chip is mounted on the board via the second external connection terminals by flip-chip bonding.

Abstract: An electronic component device includes a wiring substrate having a wiring pattern, an electronic component mounted on the wiring pattern of the wiring substrate and provided with an electrode arranged on a side surface thereof, and a gold bump provided on the wiring pattern in side neighborhood of the electrode of the electronic component and bonded to the electrode of the electronic component and the wiring pattern, and the electrode of the electronic component is electrically connected to the wiring pattern through the gold bump, and the gold bump is formed by a wire bump method.

Abstract: In a semiconductor device 10, an electrode terminal 18 of a semiconductor element 14 embedded in an insulating layer 12 formed by a resin forming a substrate and a land portion 20 forming an external connecting terminal are electrically connected to each other through a wiring pattern 22 formed on the insulating layer 12. The wiring pattern 22 including the land portion 20 is formed by a plating metal 26. A metallic wire 24 having one of ends connected to the electrode terminal 18 is provided in the plating metal 26 along the wiring pattern 22.

Abstract: An electronic device wherein an electronic element is electrically connected to a substrate through an interposer and a method of manufacturing the same are disclosed. The electronic device comprises an electronic element and an interposer including an interposer base to which the electronic element is joined and plural post electrodes connected to corresponding electrodes of the electronic element. In the electronic device, the electronic element and the interposer base are integrated with each other by being brought into direct contact with each other, and the post electrodes are formed directly on the corresponding electrodes of the electronic element.

Abstract: An electronic parts packaging structure of the present invention, includes an insulating layer acting as a flexible substrate, an electronic parts buried in the insulating layer in a state that a whole electronic parts is covered with the insulating layer, and a wiring layer buried in the insulating layer and connected electrically to a connection pad of the electronic parts, also, a structure body in which a plurality of electronic parts are buried in the insulating layer may be folded and electronic parts may be are connected electrically.

Abstract: There is provided a semiconductor device having a wafer-level package structure in which CSP structures are formed at a wafer level, which comprises a semiconductor substrate, an electrode pad formed over the semiconductor substrate, and a tail terminal formed to have an area that is smaller than the electrode pad and connected electrically to the electrode pad.

Abstract: An inductor device includes first and second spiral conductors. First and second external connection terminals are formed in inner peripheral ends of the first and second spiral conductors, respectively. A third conductor connects an outer peripheral end of the first spiral conductor and that of the second spiral conductor to each other.

Abstract: An inductor device includes first and second spiral conductors. First and second external connection terminals are formed in inner peripheral ends of the first and second spiral conductors, respectively. A third conductor connects an outer peripheral end of the first spiral conductor and that of the second spiral conductor to each other.

Abstract: There is provided a semiconductor device having a wafer-level package structure in which CSP structures are formed at a wafer level, which comprises a semiconductor substrate, an electrode pad formed over the semiconductor substrate, and a tail terminal formed to have an area that is smaller than the electrode pad and connected electrically to the electrode pad.

Abstract: A semiconductor device provided with transistors or other semiconductor elements formed on a semiconductor substrate, external connection terminals connecting these elements to an external circuit, and interconnection patterns connecting electrodes of the semiconductor elements to the external connection terminals, wherein the external connection terminals are formed by wires comprised of a conductive material and the parts of the wires bonded to the interconnection patterns are buried in the metal layer forming the interconnection patterns. A method of production of the semiconductor device is also disclosed.

Abstract: The disk drive unit is capable of fully preventing vibration of magnetic heads, which are caused by turbulent air streams. The disk drive unit includes: an enclosure; a shaft being provided in the enclosure and capable of rotatably holding a disk; and a screen member being provided on an inner face of the enclosure, enclosing the shaft and being extended in parallel to the shaft. In the disk drive unit, a space is formed between the screen member and an inner bottom face of the enclosure.

Abstract: A semiconductor device provided with transistors or other semiconductor elements formed on a semiconductor substrate, external connection terminals connecting these elements to an external circuit, and interconnection patterns connecting electrodes of the semiconductor elements to the external connection terminals, wherein the external connection terminals are formed by wires comprised of a conductive material and the parts of the wires bonded to the interconnection patterns are buried in the metal layer forming the interconnection patterns. A method of production of the semiconductor device is also disclosed.

Abstract: The disk drive unit is capable of fully preventing vibration of magnetic heads, which are caused by turbulent air streams. The disk drive unit comprises: an enclosure; a shaft being provided in the enclosure and capable of rotatably holding a disk; and a screen member being provided on an inner face of the enclosure, enclosing the shaft and being extended in parallel to the shaft. In the disk drive unit, a space is formed between the screen member and an inner bottom face of the enclosure.