Abstract: A semiconductor static random access memory having a high .alpha.-ray immunity and a high packing density is provided which is also capable of high-speed operation. A semiconductor memory device comprises static random access memory cells each including a flip-flop circuit. Storage nodes of each flip-flop circuit have respective pn-junctions formed at regions sandwiched between gate electrodes of first insulated gate field effect transistors and gate electrodes of second insulated gate field effect transistors, respectively. The pn-junction has an area smaller than that of a channel portion of the first or second insulated gate field effect transistor.

Abstract: A semiconductor device, such as an FET or a charge coupled device, is provided having a channel or a charge coupled portion formed in a thin semiconductor layer which is substantially perpendicular to the substrate. Necessary electrodes, such as the gate electrode, and necessary insulating layers can be added at the thin semiconductor layer, and can maintain the necessary amount of electric current by securing the height of the semiconductor layer. The structure has the advantage that it can have its plane size reduced. Further, the semiconductor memory device using the above semiconductor device is suitable to high integration and has excellent electric characteristics.

Abstract: Herein disclosed is a semiconductor device of high density. The semiconductor device having a high density and a microstructure is required to have a high breakdown voltage and a high speed even with a low supply voltage. The semiconductor device comprises: a semiconductor body; a gate insulating film formed over the body; and a MOS transistor having a source/drain region formed in the body and a gate electrode film formed over the gate insulating film. The gate electrode film is composed of two or more films having different etching rates. The gate etching is stopped at the interface of the composite film to form an inverse-T gate electrode structure; and in that an electric conduction is observed between the component films. Thus, the overlap between the gate and the drain can be controlled.

Abstract: A semiconductor device having a CMIS structure for forming a static random access memory is disclosed which device can increase the packing density of the memory and reduce the stand-by power thereof. In this semiconductor device, a first MISFET of a first conductivity type is formed on and a substrate, a second MISFET of a second conductivity type is formed over the first MISFET with a first insulating film therebetween to form a stacked CMIS structure. The second MISFET is made up of a first conductive film, a second insulating film and a second conductive film, with the source, drain and channel regions of the second MISFET being formed in the first conductive film. A first resistive drain region is formed between the channel and drain regions of the first conductive film so that an impurity of the second conductivity type is contained in the first resistive drain region at a lower concentration than in the drain region, or the first resistive drain region is substantially undoped.

Abstract: A semiconductor field effect transistor is provided which permits controlling of the phase of carriers between a source region and a drain region formed in a first semiconductor layer. Such control can be used to modulate characteristics such as the electric conductivity and drain current of the transistor. To accomplish this control, a gate electrode is formed over a portion of said first semiconductor layer between the source and drain regions. The gate electrode splits to form first and second branches at a first location adjacent to the source region. These first and second branches subsequently rejoin one another at a second location adjacent to said drain region. When a potential is applied to the gate electrode, it will produce first and second two-dimensional carriers conduction paths at a surface of the portion of the first semiconductor layer under the first and second branches.

Abstract: A very highly integrated semiconductor memory which enables the dynamic random access memory to develop less soft error and to eliminate margin for aligning the masks, that hinders the device from being highly integrated. The memory cell capacitor is constituted by a trench which is provided at a position defined by an insulator formed on the side of gate electrode of a MOS transistor that constitutes the memory cell. Therefore, the MOS transistor and the trench capacitor are self-aligned, and no margin is required for alignment.

Abstract: An insulated gate field effect transistor is formed in one surface of a semiconductor substrate. The surface portion of a channel has an impurity distribution of the conduction type opposite to that of the substrate, which the deeper portion of the channel has an impurity distribution of the same conduction type as that of the substrate. Moreover, at least one of a source and a drain is formed of such an impurity layer of the conduction type opposite to that of the substrate as has its impurity distribution gently sloped by double diffusion processes.

Abstract: A programmable semiconductor integrated circuitry including a circuit programming element is disclosed. The circuit programming element can be activated in a short-circuit mode by the irradiation of a laser or electron beam or by ion implantation so that it is converted from its original nonconductive state into a conductive or conductable state, thereby providing electrical connection between circuits and/or circuit elements of the integrated circuitry for a desired circuit programming such as circuit creation, circuit conversion or circuit substitution.