Abstract: A power conversion device may include a first inverter to which a first end of each phase winding is coupled; a second inverter to which a second end of each phase winding is coupled; a plurality of switching elements provided in the first and second inverters; a control circuit structured to perform n-phase conduction control on the first and second inverters; and a detection circuit structured to detect a failure in the switching elements. The control circuit is structured such that, when the detection circuit has detected a failure in any of the plurality of switching elements, the control circuit changes the control of the first and second inverters from the n-phase conduction control to m-phase conduction control using m phases of the n phases different from the phase of a winding coupled to the failed switching element, m being an integer not smaller than two and smaller than n.

Abstract: A power conversion device includes a first inverter connected to first ends of windings of each phase of a motor, a second inverter connected to second ends of the windings of each phase, a phase separation relay circuit to switch between connection and disconnection between the first ends of the windings of each phase and the first inverter, a neutral point relay circuit connected to the first ends of the windings of each phase and to switch between connection and disconnection between the first ends of the windings of each phase, a first switching element to switch between connection and disconnection between the second inverter and a power supply, and a second switching element to switch between connection and disconnection between the second inverter and a ground.

Abstract: A power conversion device according to an embodiment of the present invention includes a first inverter to which one end of each of n phase windings (n is an integer of three or more) included in an electric motor is coupled, a second inverter to which the other end of each phase winding is coupled, and a switch circuit having at least one of: a first switch element that switches between connection and disconnection of the first inverter and ground, and a second switch element that switches between connection and disconnection of the second inverter and ground.

Abstract: A power conversion device may include a first inverter to which a first end of each phase winding is coupled; a second inverter to which a second end of each phase winding is coupled; a plurality of switching elements provided in the first and second inverters; a control circuit structured to perform n-phase conduction control on the first and second inverters; and a detection circuit structured to detect a failure in the switching elements. The control circuit is structured such that, when the detection circuit has detected a failure in any of the plurality of switching elements, the control circuit changes the control of the first and second inverters from the n-phase conduction control to m-phase conduction control using m phases of the n phases different from the phase of a winding coupled to the failed switching element, m being an integer not smaller than two and smaller than n.

Abstract: A power conversion device may include a first inverter to which a first end of each phase winding of the electric motor is coupled; a second inverter to which a second end of each phase winding is couple& a first phase isolation relay circuit structured to switch between connection and disconnection of the one end of each phase winding to and from the first inverter; and a first neutral point relay circuit to which the one end of each phase winding is coupled and which is structured to switch between connection and disconnection of the one end of each phase winding to and from the one end of each other phase winding.

Abstract: A power conversion device may include a first inverter to which one end of each phase winding of a motor is coupled, a second inverter to which the other end of each phase winding is coupled, and a switch circuit having at least one of a first switch element that switches between connection and disconnection of the first inverter to and from a ground, a first protection circuit being coupled in parallel to the first switch element, and a second switch element that switches between connection and disconnection of the second inverter to and from the ground, a second protection circuit being coupled in parallel to the second switch element.

Abstract: An electronic control apparatus configured to control electric power steering and provided integrally with an electric motor is electrically connected to an ignition switch and which assists a rotation operation of a steering column by rotation of the electric motor. A first magnetism detecting element configured to operate using power supplied via the ignition switch to output a first set of rotation angle signals of the electric motor. A second magnetism detecting element configured to operate continuously using continuously supplied power to output a second set of rotation angle signals of the electric motor. A controller configured or programmed to generate rotation angle information about the electric motor based on the first set of rotation angle signals and the second set of rotation angle signals outputted while the ignition switch is stopped and to calculate a position of a steering wheel from the generated rotation angle information.

Abstract: [Problem to be Solved] To provide a vehicle-mounted electronic control unit or a vehicle-mounted mechanically/electrically integrated electric motor, the vehicle-mounted electronic control unit or the vehicle-mounted mechanically/electrically integrated electric motor having high heat radiation efficiency and being small in size. [Solution] A vehicle-mounted electronic control unit includes a motor case 430 capable of accommodating an electric motor 43, a lid body 431 of the motor case 430, a power section 100 including switching circuits FET 1 to FET 6 that supply driving signals to the electric motor 43, and a control section 300 including a control circuit that controls the switching circuits FET 1 to FET 6. The case 430 further accommodates the power section 100 and the control section 300. The lower surface of the lid body 431 is set in contact with the power section 100. Each of the case 430 and the lid body 431 has a heat radiation property. The upper surface of the lid body 431 is exposed.

Abstract: An optical component is fixed precisely on a sensor chip. After a sensor chip including a front surface having a sensor plane with a plurality of light receiving elements is mounted face-up over a wiring substrate, an adhesive is disposed on the front surface of the sensor chip at a plurality of positions, and a plurality of spacers having adherence is formed by curing this adhesive. Then, an adhesive paste is disposed on the front surface of the sensor chip. Then, an optical component held by a bonding tool is disposed on the front surface via the spacer and the adhesive. After that, the bonding tool is separated from the optical component and the optical component is fixed by curing the adhesive in a state in which a load is not applied to the optical component.

Abstract: An electronic control apparatus configured to control electric power steering and provided integrally with an electric motor is electrically connected to an ignition switch and which assists a rotation operation of a steering column by rotation of the electric motor. A first magnetism detecting element configured to operate using power supplied via the ignition switch to output a first set of rotation angle signals of the electric motor. A second magnetism detecting element configured to operate continuously using continuously supplied power to output a second set of rotation angle signals of the electric motor. A controller configured or programmed to generate rotation angle information about the electric motor based on the first set of rotation angle signals and the second set of rotation angle signals outputted while the ignition switch is stopped and to calculate a position of a steering wheel from the generated rotation angle information.

Abstract: An optical component is fixed precisely on a sensor chip. After a sensor chip including a front surface having a sensor plane with a plurality of light receiving elements is mounted face-up over a wiring substrate, an adhesive is disposed on the front surface of the sensor chip at a plurality of positions, and a plurality of spacers having adherence is formed by curing this adhesive. Then, an adhesive paste is disposed on the front surface of the sensor chip. Then, an optical component held by a bonding tool is disposed on the front surface via the spacer and the adhesive. After that, the bonding tool is separated from the optical component and the optical component is fixed by curing the adhesive in a state in which a load is not applied to the optical component.

Abstract: An optical component is fixed precisely on a sensor chip. After a sensor chip including a front surface having a sensor plane with a plurality of light receiving elements is mounted face-up over a wiring substrate, an adhesive is disposed on the front surface of the sensor chip at a plurality of positions, and a plurality of spacers having adherence is formed by curing this adhesive. Then, an adhesive paste is disposed on the front surface of the sensor chip. Then, an optical component held by a bonding tool is disposed on the front surface via the spacer and the adhesive. After that, the bonding tool is separated from the optical component and the optical component is fixed by curing the adhesive in a state in which a load is not applied to the optical component.

Abstract: A side buffer includes a bottom portion on which a FOUP may be placed, a restriction portion, an article receiving portion, and a link portion. The restriction portion is movable between a restricting position and a retracted position. At the restricting position, the restriction portion restricts an inclination of the FOUP on the bottom portion. At the retracted position, the restriction portion allows the FOUP to move between the bottom portion and a position directly above the bottom portion. The article receiving portion is disposed so as to receive a force from the FOUP placed on the bottom portion. The link portion moves the restriction portion from the retracted position to the restricting position with the received force.

Abstract: An engine balancer includes a pair of balancer shafts and a balancer housing for housing the balancer shafts, and is placed in an oil pan at the bottom of an engine. The balancer housing includes a pair of front and rear bearing walls respectively supporting the balancer shafts with rolling bearings interposed therebetween. The bearing walls of the balancer housing are attached to bearing walls for a crankshaft. The housing body has an aperture at the top thereof. The aperture of the housing body is covered with a plate-shaped cover member thinner than a member forming the housing body.

Abstract: A side buffer includes a bottom portion on which a FOUP may be placed, a restriction portion, an article receiving portion, and a link portion. The restriction portion is movable between a restricting position and a retracted position. At the restricting position, the restriction portion restricts an inclination of the FOUP on the bottom portion. At the retracted position, the restriction portion allows the FOUP to move between the bottom portion and a position directly above the bottom portion. The article receiving portion is disposed so as to receive a force from the FOUP placed on the bottom portion. The link portion moves the restriction portion from the retracted position to the restricting position with the received force.

Abstract: An optical component is fixed precisely on a sensor chip. After a sensor chip including a front surface having a sensor plane with a plurality of light receiving elements is mounted face-up over a wiring substrate, an adhesive is disposed on the front surface of the sensor chip at a plurality of positions, and a plurality of spacers having adherence is formed by curing this adhesive. Then, an adhesive paste is disposed on the front surface of the sensor chip. Then, an optical component held by a bonding tool is disposed on the front surface via the spacer and the adhesive. After that, the bonding tool is separated from the optical component and the optical component is fixed by curing the adhesive in a state in which a load is not applied to the optical component.

Abstract: A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

Abstract: After a wiring substrate having, on its lower surface, an opening and terminals arranged therearound is provided, a sealing material is supplied to the lower surface of the wiring substrate, and a sensor chip is flip-chip mounted on the lower surface of the wiring substrate. The sensor chip has, on its front surface, a sensor surface and bump electrodes, and each bump electrode is thermocompression-bonded onto each terminal of the wiring substrate and the sensor surface is exposed from the opening. The sensor chip has, in its outer peripheral portion of the front surface, a first region where the bump electrodes are arranged and a second region where no bump electrode is arranged. The sealing material is supplied to a region planarly overlapped with the first region when the sensor chip is mounted later, and no sealing material is supplied to a region planarly overlapped with the second region.

Abstract: After a wiring substrate having, on its lower surface, an opening and terminals arranged therearound is provided, a sealing material is supplied to the lower surface of the wiring substrate, and a sensor chip is flip-chip mounted on the lower surface of the wiring substrate. The sensor chip has, on its front surface, a sensor surface and bump electrodes, and each bump electrode is thermocompression-bonded onto each terminal of the wiring substrate and the sensor surface is exposed from the opening. The sensor chip has, in its outer peripheral portion of the front surface, a first region where the bump electrodes are arranged and a second region where no bump electrode is arranged. The sealing material is supplied to a region planarly overlapped with the first region when the sensor chip is mounted later, and no sealing material is supplied to a region planarly overlapped with the second region.

Abstract: A safety frame is provided to face a lid at a position where an article is held by an overhead traveling vehicle. A lower frame of the safety frame is movable upwardly relative to an upper frame of the safety frame. Further, an optical axis of a photoelectric sensor is provided between the lower frame and the upper frame.