Patents by Inventor Eiji Yamanaka

Eiji Yamanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120243772
    Abstract: According to one embodiment, a method includes acquiring information about a two-dimensional distribution of secondary electron intensity for a measurement target pattern, extracting, by a first method, an edge position of an edge for correction value acquisition, extracting, by a second method, an edge position of the edge for correction value acquisition, acquiring a difference between the edge positions extracted by the first and second methods, as a correction value, extracting, by the second method, an edge position of a desired edge based on the information about the two-dimensional distribution, and correcting the edge position of the desired edge based on the correction value.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 27, 2012
    Inventor: Eiji YAMANAKA
  • Publication number: 20120148791
    Abstract: Disclosed is a pressure-sensitive adhesive tape or sheet having an adhesive face which includes two or more different pressure-sensitive adhesives each capable of acting on an adherend and exhibits adhesiveness and debonding capability both at high levels. The pressure-sensitive adhesive tape or sheet has an adhesive face being substantially smooth and including at least on region composed of a first pressure-sensitive adhesive and at least one region composed of a pressure-sensitive adhesive other than the first pressure-sensitive adhesive. In the pressure-sensitive adhesive tape or sheet, the region composed of the first pressure-sensitive adhesive and the region composed of the other pressure-sensitive adhesive than the first pressure-sensitive adhesive preferably are preferably in the form of stripes extending in the longitudinal direction.
    Type: Application
    Filed: December 9, 2011
    Publication date: June 14, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Eiji YAMANAKA, Naoaki HIGUCHI, Tooru NAKASHIMA
  • Publication number: 20120040177
    Abstract: Provided is a heat-expandable removable acrylic pressure-sensitive adhesive tape that has high normal-state adhesive power when bonded independently of whether the adherend has or does not have irregular surface and permits easy separation when the bonded region is separated and disassembled by lowering the adhesive power by heating, that permits easily separation-decomposition, even after long-term storage at high temperature. The heat-expandable removable acrylic pressure-sensitive adhesive tape or sheet according to the present invention is a heat-expandable removable acrylic pressure-sensitive adhesive tape or sheet having a heat expanding agent-containing pressure-sensitive adhesive layer on or above at least one face of a bubble-bearing microparticle-containing viscoelastic material, characterized in that the heat expanding agent contains a heat-expandable microsphere having a shell-substance glass transition temperature of 92° C. or higher.
    Type: Application
    Filed: April 15, 2010
    Publication date: February 16, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tooru Nakashima, Eiji Yamanaka, Naoaki Higuchi
  • Publication number: 20120034447
    Abstract: Provided is a heat-expandable removable acrylic pressure-sensitive adhesive tape that has high normal-state adhesive power when bonded independently of whether the adherend has or does not have irregular surface and permits easy separation when the bonded region is separated and disassembled by lowering the adhesive power by heating, that permits easily separation-decomposition, even after long-term storage at high temperature. The heat-expandable removable acrylic pressure-sensitive adhesive tape or sheet according to the present invention includes at least a heat expanding agent-containing pressure-sensitive adhesive layer, and the tape or sheet has an initial 90° peel adhesive strength to a polycarbonate plate as adherend of 10 N/25 mm or more and a 90° peel adhesive strength after storage in an atmosphere at 80° C. for 2 months as bonded to the polycarbonate adherend and after heat expansion treatment of less than 10 N/25 mm.
    Type: Application
    Filed: April 15, 2010
    Publication date: February 9, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naoaki Higuchi, Yasuyuki Tokunaga, Tooru Nakashima, Eiji Yamanaka
  • Publication number: 20120034407
    Abstract: An object of the present invention is to provide a heat-expandable/peelable acrylic pressure-sensitive adhesive tape that maintains a high adhesion force, and can be easily separated or debonded at the bonded part by heating, regardless of the material constituting the adherend. Disclosed is a heat-expandable/peelable acrylic pressure-sensitive adhesive tape or sheet which includes at least a pressure-sensitive adhesive layer containing a blowing agent, a peelable or peel-assisting film layer, and a viscoelastic substrate containing microparticles, in which at least the peelable or peel-assisting film layer and the microparticle-containing viscoelastic substrate constitute a multilayer structure, and the multilayer structure is arranged on or above at least one side of the pressure-sensitive adhesive layer so that the blowing agent-containing pressure-sensitive adhesive layer is in contact with the peelable or peel-assisting film layer with or without the interposition of another layer.
    Type: Application
    Filed: October 15, 2008
    Publication date: February 9, 2012
    Applicants: NITTO EUROPE NV, NITTO DENKO CORPORATION
    Inventors: Eiji Yamanaka, Tooru Nakashima, Greet Bossaert, Bart Forier, Walter Eevers
  • Publication number: 20110250446
    Abstract: A pressure-sensitive adhesive composition or an acrylic pressure-sensitive adhesive tape in which peeling-off property or tearing-off property occurring by heating is improved while the high adhesiveness to a metallic material is being maintained, will be provided. The pressure-sensitive adhesive composition contains: an acrylic polymer (A); a (meth)acrylic polymer (B) whose mass average molecular weight (Mw) is such that 1000?Mw<30000; and a heat-expandable microsphere (C).
    Type: Application
    Filed: April 8, 2011
    Publication date: October 13, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naoaki HIGUCHI, Tooru NAKASHIMA, Eiji YAMANAKA
  • Publication number: 20110151249
    Abstract: A pressure-sensitive adhesive tape is provided with a pressure-sensitive adhesive layer and a water-repellent layer formed on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer. The water-repellent layer is formed by using a water repellent exhibiting the water repellency in which a contact angle with water is greater than or equal to 140°. The water-repellent layer may have hydrophobic fine particles. The hydrophobic fine particle may contain a hydrophobic fine silica compound. The hydrophobic fine silica compound may be modified with hexamethyldisilazane.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 23, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Eiji Yamanaka, Tsuyoshi Hiramatsu, Naoaki Higuchi
  • Patent number: 7831085
    Abstract: According to an aspect of the invention, there is provided a method comprising detecting a defect of a pattern formed on the photo mask, acquiring a pattern image of a first region on the photo mask, extracting a pattern contour from the pattern image to acquire pattern contour extracted data, producing first graphic data based on the pattern contour extracted data and a pixel size, acquiring pattern data including the first region and corresponding to a second region from design data, producing second graphic data from the pattern data, replacing the second graphic data with the first graphic data to produce third graphic data only in a region where the first graphic data is superimposed upon the second graphic data, producing transfer patterns of pattern shapes represented by the second and third graphic data, and comparing the transfer patterns to judge whether or not the defect needs to be corrected.
    Type: Grant
    Filed: October 16, 2008
    Date of Patent: November 9, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takashi Hirano, Eiji Yamanaka
  • Publication number: 20100242025
    Abstract: A processing apparatus, which contains a processor that executes a program includes a series of instructions, includes a log recording unit configured to record an operation log of the processing apparatus; a managing unit configured to control a recording operation performed by the log recording unit and read the operation log recorded in the log recording unit; an input unit configured to detect, from among the series of instructions of the executed program; a start instruction that starts a process for delivering a control instruction destined for the managing unit to the managing unit and deliver the control instruction to the managing unit in response to the start instruction; and an output unit configured to receive the operation log read by the managing unit.
    Type: Application
    Filed: March 17, 2010
    Publication date: September 23, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Iwao Yamazaki, Michiharu Hara, Eiji Yamanaka
  • Publication number: 20100215947
    Abstract: Disclosed is a heat-expandable/peelable acrylic pressure-sensitive adhesive tape or sheet which maintains a high adhesion force but the bonded part can be easily separated/debonded regardless of whether the surface of the adherend is uneven. The heat-expandable/peelable acrylic pressure-sensitive adhesive tape or sheet includes a viscoelastic body containing both bubbles and microparticles, and on at least one side thereof, a pressure-sensitive adhesive layer containing a blowing agent. The heat-expandable/peelable acrylic pressure-sensitive adhesive tape or sheet preferably contains bubbles in an amount of 3 to 30 percent by volume based on the total volume of the viscoelastic body.
    Type: Application
    Filed: October 14, 2008
    Publication date: August 26, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Eiji Yamanaka, Kunio Nagasaki, Akira Hirao, Tooru Nakashima
  • Publication number: 20100116807
    Abstract: The present invention relates to a disassemblable structure including: a double-coated pressure-sensitive adhesive tape or a double-coated pressure sensitive adhesive sheet including a substrate and pressure-sensitive adhesive layers formed on both surfaces of the substrate, at least one of the pressure-sensitive adhesive layers being a thermal foaming agent-containing pressure-sensitive adhesive layer; a heating element which foams the thermal foaming agent-containing pressure-sensitive adhesive layer by heating; and a pair of adherends joined to each other through the pressure-sensitive adhesive tape or sheet and the heating element.
    Type: Application
    Filed: November 10, 2009
    Publication date: May 13, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Eiji YAMANAKA, Michirou KAWANISHI, Masahiko ANDO, Yasuyuki TOKUNAGA, Tooru NAKASHIMA
  • Patent number: 7673281
    Abstract: A pattern evaluation method for evaluating a mask pattern includes generating desired wafer pattern data corresponding to the evaluation position of a mask pattern, generating mask pattern contour data based on an image of the mask pattern, and performing a lithography/simulation process based on the mask pattern contour data and generating predicted wafer pattern data when the mask pattern is transferred to a wafer. Further, it includes deriving positional offset between the mask pattern contour data and mask pattern data, correcting a positional error between the desired wafer pattern data and the predicted wafer pattern data based on the positional offset, and comparing the desired wafer pattern data with the predicted wafer pattern data with the positional error corrected.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: March 2, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Eiji Yamanaka, Masamitsu Itoh, Mitsuyo Asano, Shinji Yamaguchi
  • Publication number: 20090087081
    Abstract: According to an aspect of the invention, there is provided a method comprising detecting a defect of a pattern formed on the photo mask, acquiring a pattern image of a first region on the photo mask, extracting a pattern contour from the pattern image to acquire pattern contour extracted data, producing first graphic data based on the pattern contour extracted data and a pixel size, acquiring pattern data including the first region and corresponding to a second region from design data, producing second graphic data from the pattern data, replacing the second graphic data with the first graphic data to produce third graphic data only in a region where the first graphic data is superimposed upon the second graphic data, producing transfer patterns of pattern shapes represented by the second and third graphic data, and comparing the transfer patterns to judge whether or not the defect needs to be corrected.
    Type: Application
    Filed: October 16, 2008
    Publication date: April 2, 2009
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takashi HIRANO, Eiji Yamanaka
  • Publication number: 20080311388
    Abstract: The object of the invention is to provide a pressure-sensitive adhesive sheet for identification, which is obtained by easy thick film coating in formation of a pressure-sensitive adhesive agent layer; which can be used even if the surface of a collection subject is wet with moisture; which is obtained without using an organic solvent in production steps; and which causes few damages on the surface of the collection subject, and a production method thereof.
    Type: Application
    Filed: June 11, 2008
    Publication date: December 18, 2008
    Inventors: Masanori Uesugi, Eiji Yamanaka
  • Patent number: 7454051
    Abstract: According to an aspect of the invention, there is provided a method comprising detecting a defect of a pattern formed on the photo mask, acquiring a pattern image of a first region on the photo mask, extracting a pattern contour from the pattern image to acquire pattern contour extracted data, producing first graphic data based on the pattern contour extracted data and a pixel size, acquiring pattern data including the first region and corresponding to a second region from design data, producing second graphic data from the pattern data, replacing the second graphic data with the first graphic data to produce third graphic data only in a region where the first graphic data is superimposed upon the second graphic data, producing transfer patterns of pattern shapes represented by the second and third graphic data, and comparing the transfer patterns to judge whether or not the defect needs to be corrected.
    Type: Grant
    Filed: April 21, 2005
    Date of Patent: November 18, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takashi Hirano, Eiji Yamanaka
  • Publication number: 20080028361
    Abstract: A pattern evaluation method for evaluating a mask pattern includes generating desired wafer pattern data corresponding to the evaluation position of a mask pattern, generating mask pattern contour data based on an image of the mask pattern, and performing a lithography/simulation process based on the mask pattern contour data and generating predicted wafer pattern data when the mask pattern is transferred to a wafer. Further, it includes deriving positional offset between the mask pattern contour data and mask pattern data, correcting a positional error between the desired wafer pattern data and the predicted wafer pattern data based on the positional offset, and comparing the desired wafer pattern data with the predicted wafer pattern data with the positional error corrected.
    Type: Application
    Filed: July 20, 2007
    Publication date: January 31, 2008
    Inventors: Eiji Yamanaka, Masamitsu Itoh, Mitsuyo Asano, Shinji Yamaguchi
  • Patent number: 7313781
    Abstract: An image data correction method includes preparing correction data for correcting a distortion of an image obtained by an image acquiring section, acquiring outline data of a desired pattern obtained by the image acquiring section, and correcting the outline data of the desired pattern using the correction data.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: December 25, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Mitsuyo Asano, Masamitsu Itoh, Eiji Yamanaka, Shinji Yamaguchi
  • Publication number: 20060266380
    Abstract: According to the present invention, of the both surfaces of a cleaning sheet, a contact face to be rubbed against a cleaning object is a concave convex plane containing a convex part 1 and a concave part 2. By rubbing this concave convex plane against a cleaning object, a removal target (e.g., paste accumulated on the back of screen printing plate) attached to a cleaning object can be effectively removed.
    Type: Application
    Filed: May 24, 2006
    Publication date: November 30, 2006
    Inventors: Eiji Yamanaka, Masanobu Yoneda, Takahiro Yatagai, Osamu Degawa
  • Patent number: 7075163
    Abstract: In a semiconductor bare chip (57) on the front surface whereof is formed an integrated circuit, a magnetic loss film 55 is formed on the back surface of that semiconductor bare chip.
    Type: Grant
    Filed: April 4, 2001
    Date of Patent: July 11, 2006
    Assignee: NEC TOKIN Corporation
    Inventors: Shigeyoshi Yoshida, Hiroshi Ono, Yoshio Awakura, Michio Nemoto, Eiji Yamanaka, Masahiro Yamaguchi, Yutaka Shimada
  • Publication number: 20050265592
    Abstract: An image data correction method includes preparing correction data for correcting a distortion of an image obtained by an image acquiring section, acquiring outline data of a desired pattern obtained by the image acquiring section, and correcting the outline data of the desired pattern using the correction data.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 1, 2005
    Inventors: Mitsuyo Asano, Masamitsu Itoh, Eiji Yamanaka, Shinji Yamaguchi