Patents by Inventor Eike Ruttkowski

Eike Ruttkowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7733698
    Abstract: A memory device having an array portion including memory cells, and a peripheral portion including conductive lines is disclosed. In one embodiment, portions of the conductive lines adjoin a surface of a semiconductor carrier.
    Type: Grant
    Filed: March 21, 2007
    Date of Patent: June 8, 2010
    Assignee: Qimonda AG
    Inventors: Joachim Deppe, Dominik Olligs, Christoph Kleint, Eike Ruttkowski, Ricardo Mikalo
  • Patent number: 7649779
    Abstract: Embodiments of the present invention relate generally to integrated circuits, methods for manufacturing an integrated circuit, memory modules, and computing systems.
    Type: Grant
    Filed: May 15, 2007
    Date of Patent: January 19, 2010
    Assignees: Qimonda AG, Qimonda Flash GmbH
    Inventors: Eike Ruttkowski, Detlev Richter, Michael Specht, Joseph Willer, Dirk Manger, Kenny Oisin, Steffen Meyer, Klaus Knobloch, Holger Moeller, Doris Keitel Schulz, Jan Gutsche, Gert Koebernik, Christoph Friederich
  • Publication number: 20080285344
    Abstract: Embodiments of the present invention relate generally to integrated circuits, methods for manufacturing an integrated circuit, memory modules, and computing systems.
    Type: Application
    Filed: May 15, 2007
    Publication date: November 20, 2008
    Inventors: Eike Ruttkowski, Detlev Richter, Michael Specht, Joseph Willer, Dirk Manger, Kenny Oisin, Steffen Meyer, Klaus Knobloch, Holger Moeller, Doris Keitel Schulz, Jan Gutsche, Gert Koebernik, Christoph Friederich
  • Publication number: 20080232170
    Abstract: A memory device having an array portion including memory cells, and a peripheral portion including conductive lines is disclosed. In one embodiment, portions of the conductive lines adjoin a surface of a semiconductor carrier.
    Type: Application
    Filed: March 21, 2007
    Publication date: September 25, 2008
    Applicant: QIMONDA AG
    Inventors: Joachim Deppe, Dominik Olligs, Christoph Kleint, Eike Ruttkowski, Ricardo Mikalo
  • Publication number: 20050239272
    Abstract: Process for producing a multilayer arrangement having a metal layer, in which a metal layer is applied to a surface of a first wafer and at least one interlayer is applied to the metal layer. Furthermore, a second wafer is applied to the interlayer and then the first wafer is removed, so that the metal layer is uncovered.
    Type: Application
    Filed: August 16, 2004
    Publication date: October 27, 2005
    Applicant: Infineon Technologies AG
    Inventors: Eike Ruttkowski, Gurkan Ilicali, Richard Luyken, Franz Hofmann, Manuela Bueno
  • Publication number: 20050029660
    Abstract: Semiconductor device having a substrate, at least one adhesion promoter core, which is deposited on a part of the substrate, and a deposit, which completely surrounds the adhesion promoter core, of a material of poor adhesion which is different than the adhesion promoter material and is in direct contact with the substrate, as well as methods-for the production thereof.
    Type: Application
    Filed: July 26, 2004
    Publication date: February 10, 2005
    Applicant: Infineon Technologies AG
    Inventors: Eike Ruttkowski, Franz Hofmann, Bjorn-Oliver Eversmann