Patents by Inventor Eisaku Tanaka

Eisaku Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240173947
    Abstract: A member supplying sheet includes two or more protective cover members each configured to be placed on a face of an object that has an opening on the face; and a substrate sheet with the two or more protective cover members arranged on a surface thereof. The protective cover members each include a laminate including: a protective membrane shaped to cover the opening when the protective cover member is placed on the face; and a carrier film. The substrate sheet includes a substrate layer and an adhesive layer laminated on the substrate layer. The carrier film is adhered to the substrate layer via the adhesive layer. The surface free energy of the carrier film on a surface thereof on the side closer to the substrate sheet is 20 mJ/m2 or more. The adhesive layer has a tack force of 100 mN/mm2 or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: May 30, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takeo INOUE, Eisaku TANAKA, Bunta HIRAI, Tomohiro KONTANI
  • Publication number: 20240068066
    Abstract: There is provided a steel sheet having a chemical composition comprising, in mass %, C: 0.05 to 0.25%, Si: 0.2 to 2.0%, Mn: 1.2 to 3.0%, P: 0.030% or less, S: 0.050% or less, Al: 0.01 to 0.55%, N: 0.0100% or less, and Ti: 0.010 to 0.250%, with the balance: Fe and impurities, wherein a random intensity ratio of a texture in a near-surface portion of the steel sheet is 8.0 or less, and a minimum angle formed between a maximum strength orientation in a {110} pole figure of the texture and a normal direction of a rolled surface of the steel sheet is 10° or less.
    Type: Application
    Filed: February 22, 2022
    Publication date: February 29, 2024
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Yasuaki TANAKA, Shohei YABU, Hiroshi SHUTO, Koutarou HAYASHI, Takashi YASUTOMI, Eisaku SAKURADA
  • Patent number: 7352562
    Abstract: A solid electrolytic capacitor includes a capacitor element 2, an anode lead terminal 3 electrically connected to an anode of the capacitor element, a cathode lead terminal 4 electrically connected to a cathode of the capacitor element, and a package 5 which is made of synthetic resin and hermetically seals the capacitor element. The lead terminals are embedded in the bottom 5a of the package with the lower surfaces of the lead terminals exposed at the bottom surface of the package. The anode lead terminal and the cathode lead terminal are respectively formed with standing pieces 8 and 9 at portions corresponding to side surfaces 5b, 5c of the package, and the standing pieces have respective outer surfaces exposed at the side surfaces of the package. This structure enhances the soldering strength and facilitates the visual inspection of the quality of the soldering.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: April 1, 2008
    Assignee: Rohm Co., Ltd.
    Inventor: Eisaku Tanaka
  • Publication number: 20070081301
    Abstract: A solid electrolytic capacitor includes a capacitor element 2, an anode lead terminal 3 electrically connected to an anode of the capacitor element, a cathode lead terminal 4 electrically connected to a cathode of the capacitor element, and a package 5 which is made of synthetic resin and hermetically seals the capacitor element. The lead terminals are embedded in the bottom 5a of the package with the lower surfaces of the lead terminals exposed at the bottom surface of the package. The anode lead terminal and the cathode lead terminal are respectively formed with standing pieces 8 and 9 at portions corresponding to side surfaces 5b, 5c of the package, and the standing pieces have respective outer surfaces exposed at the side surfaces of the package. This structure enhances the soldering strength and facilitates the visual inspection of the quality of the soldering.
    Type: Application
    Filed: September 17, 2004
    Publication date: April 12, 2007
    Applicant: Rohm.co.,Ltd
    Inventor: Eisaku Tanaka
  • Patent number: 5461539
    Abstract: An electronic component is provided which comprises a resin package for enclosing inside parts. The package has a heat sensitive surface portion provided with a heat sensitive material which irreversibly discolors at a temperature higher than the soldering temperature for the electronic component. The component may be a solid tantalum capacitor, solid aluminum capacitor, diode or transistor which generates heat under abnormal operating conditions.
    Type: Grant
    Filed: February 10, 1995
    Date of Patent: October 24, 1995
    Assignee: Rohm Co., Ltd.
    Inventors: Chojiro Kuriyama, Eisaku Tanaka
  • Patent number: 5363272
    Abstract: A capacitor apparatus incorporating a fuse incorporates a capacitor device having a first electrode and a second electrode; a fuse whose one end is connected to the first electrode; a first lead terminal connected to the other end of the fuse; a second lead terminal connected to the second electrode; and resin in which the capacitor device, fuse, and a part of the first and second lead terminals are molded. According to such features, fuming and ignition of the capacitor device due to an excessive current therethrough can be prevented without fail.
    Type: Grant
    Filed: November 25, 1991
    Date of Patent: November 8, 1994
    Assignee: Rohm Co., Ltd.
    Inventors: Eisaku Tanaka, Choujirou Kuriyama