Abstract: A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.

Abstract: A laser radar device performs control to make a focus distance of transmission light equal to a measurement distance by switching a plurality of laser light sources that emit beams of oscillation light having wavelengths different from each other to switch emission directions of the transmission light while maintaining the focus position of optical antennas, and changing the wavelength of the beams of oscillation light according to the measurement distance.

Abstract: An electrical junction box includes a housing, a bus bar, a nut, and an insulating cap. A through hole of the housing has a first end side and a second end side, and the first end side is opened in a bus bar placement surface of the housing. The bus bar is placed on the bus bar placement surface and is fixed to the housing such that a first bolt hole of the bus bar and the through hole communicate with each other. The cap is attached to the housing. A terminal having a second bolt hole is fixed to the bus bar by fastening a bolt inserted into the second bolt hole and the first bolt hole in this order to the nut so as to sandwich the bus bar and the terminal.

Abstract: An electrical junction box includes a housing, a bus bar including a first flat plate portion having a first bolt hole, a plate having a window portion, a plate-shaped terminal including a second flat plate portion having a second bolt hole and configured to be assembled to the plate so as to close the window portion, and a fastening member configured to be inserted into the first bolt hole and the second bolt hole to fasten and fix the bus bar and the terminal together to the housing. The housing and the plate are configured such that the first flat plate portion and the second fiat plate portion are stacked to each other and the first bolt hole and the second bolt hole are coaxially arranged by assembling the plate to the housing to which the bus bar is assembled.

Abstract: An electrical junction box includes a housing, a bus bar, a nut, and an insulating cap. A through hole of the housing has a first end side and a second end side, and the first end side is opened in a bus bar placement surface of the housing. The bus bar is placed on the bus bar placement surface and is fixed to the housing such that a first bolt hole of the bus bar and the through hole communicate with each other. The cap is attached to the housing. A terminal having a second bolt hole is fixed to the bus bar by fastening a bolt inserted into the second bolt hole and the first bolt hole in this order to the nut so as to sandwich the bus bar and the terminal.

Abstract: A planarization processing device for polishing a substrate, e.g., a semiconductor wafer, includes two planarization processing sections (SP1, SP2) that each include a holder (62) for holding a workpiece (W), a drive motor (71) that rotates the holder (62), a support plate (4) holds a pad (5), a linear guide (3) that guides reciprocal movement of the support plate (4) in a direction parallel to the surface of the pad (5), and a drive cylinder (72) that advances the holder (62) or the support plate (4) in a direction that intersects the surface of the workpiece W or the pad (5) to cause the opposing surfaces of the workpiece and the pad (5) to be at least proximal to each other. A primary driver (PD) causes the support plates (4) of the planarization processing sections (SP1, SP2) to reciprocate along the same straight line in opposite phases.

Abstract: A method for planarizing a workpiece includes bringing a surface of the workpiece and a surface of a pad having a catalyst layer at least on the surface thereof into contact with or proximal to each other, rotating a first one of the workpiece and the pad in a plane of the surface of the first one around a central axis that intersects the surface of the first one while supplying a liquid that supports a catalytic reaction between the surface of the workpiece and the catalyst layer on the surface of the pad, and simultaneously reciprocally moving a second one of the workpiece and the pad in a direction parallel to the surface of the second one by at least an amount that makes possible planarization of the surface of the workpiece based on the catalytic reaction.

Abstract: A method for planarizing a workpiece includes bringing a surface of the workpiece and a surface of a pad having a catalyst layer at least on the surface thereof into contact with or proximal to each other, rotating a first one of the workpiece and the pad in a plane of the surface of the first one around a central axis that intersects the surface of the first one while supplying a liquid that supports a catalytic reaction between the surface of the workpiece and the catalyst layer on the surface of the pad, and simultaneously reciprocally moving a second one of the workpiece and the pad in a direction parallel to the surface of the second one by at least an amount that makes possible planarization of the surface of the workpiece based on the catalytic reaction.

Abstract: A planarization processing device for polishing a substrate, such as a semiconductor wafer, includes a drive motor that rotates the substrate about a rotational axis. A support plate holds a pad for polishing the substrate such that the surface of the pad faces the surface of the substrate. The surface of the pad contains a catalyst, e.g., composed of a transition metal compound. A liquid that supports a catalytic reaction for polishing the substrate is supplied between the surfaces of the substrate and the pad. A reciprocating drive device causes the support plate to undergo reciprocating motion in a direction parallel to the surface of the pad by at least an amount that makes possible planarization of the substrate based on the catalytic reaction.

Abstract: A planarization processing device for polishing a substrate, e.g., a semiconductor wafer, includes two planarization processing sections (SP1, SP2) that each include a holder (62) for holding a workpiece (W), a drive motor (71) that rotates the holder (62), a support plate (4) holds a pad (5), a linear guide (3) that guides reciprocal movement of the support plate (4) in a direction parallel to the surface of the pad (5), and a drive cylinder (72) that advances the holder (62) or the support plate (4) in a direction that intersects the surface of the workpiece W or the pad (5) to cause the opposing surfaces of the workpiece and the pad (5) to be at least proximal to each other. A primary driver (PD) causes the support plates (4) of the planarization processing sections (SP1, SP2) to reciprocate along the same straight line in opposite phases.

Abstract: A planarization processing device for polishing a substrate, such as a semiconductor wafer, includes a drive motor that rotates the substrate about a rotational axis. A support plate holds a pad for polishing the substrate such that the surface of the pad faces the surface of the substrate. The surface of the pad contains a catalyst, e.g., composed of a transition metal compound. A liquid that supports a catalytic reaction for polishing the substrate is supplied between the surfaces of the substrate and the pad. A reciprocating drive device causes the support plate to undergo reciprocating motion in a direction parallel to the surface of the pad by at least an amount that makes possible planarization of the substrate based on the catalytic reaction.

Abstract: A substrate polishing apparatus includes a retainer for holding a substrate and substrate rotating device that spins the retainer around a first rotational axis perpendicular to a to-be-polished surface of the substrate. A platen includes an abrasive pad disposed opposite of the to-be-polished surface of the substrate. A platen rotating device spins the platen around a second rotational axis perpendicular to the abrasive pad. A liquid storage chamber includes a wall portion surrounding the outer periphery of the substrate. One end of the wall portion is positionable in a liquid-tight manner with the abrasive pad to define a liquid storage space for retaining a polishing liquid around the outer periphery of the substrate.

Abstract: A polishing pad auxiliary plate including: a lower auxiliary plate overlapping a top surface of a rotating surface plate of a polishing device; a first adhering member adhering the lower auxiliary plate to the rotating surface plate; an upper auxiliary plate with a pad support surface on which the polishing pad is overlapped and adhered, while overlapping a top surface of the lower auxiliary plate; a second adhering member adhering the upper auxiliary plate to the lower auxiliary plate; and an alignment member for mutually aligning the lower and upper auxiliary plates and matching center axes thereof. By removing the upper auxiliary plate from the lower auxiliary plate, the polishing pad is removed from the rotating surface plate while being adhered to the pad support surface of the upper auxiliary plate, and the removed upper auxiliary plate is reattached and aligned to the lower auxiliary plate by the alignment member.

Abstract: A policy selection system that enables selection of a policy that reflects a change in public opinion after an election in a timely manner is provided.

Abstract: A construction of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling it from the rotation table is offered.

Abstract: A method of regenerating a polishing pad for polishing semiconductor wafers is described wherein the polishing pad is removably stacked, aligned and fixed by a fitting ring to a polishing pad supporting surface of a polishing pad sub plate mounted on a central surface of a sub plate main body on an upper surface of a polisher rotation table and wherein the regeneration may include dressing, as well as cleaning, or regrooving the polishing pad surface.

Abstract: A substrate polishing apparatus includes a retainer for holding a substrate and substrate rotating device that spins the retainer around a first rotational axis perpendicular to a to-be-polished surface of the substrate. A platen includes an abrasive pad disposed opposite of the to-be-polished surface of the substrate. A platen rotating device spins the platen around a second rotational axis perpendicular to the abrasive pad. A liquid storage chamber includes a wall portion surrounding the outer periphery of the substrate. One end of the wall portion is positionable in a liquid-tight manner with the abrasive pad to define a liquid storage space for retaining a polishing liquid around the outer periphery of the substrate.

Abstract: A polishing pad auxiliary plate including: a lower auxiliary plate overlapping a top surface of a rotating surface plate of a polishing device; a first adhering member adhering the lower auxiliary plate to the rotating surface plate; an upper auxiliary plate with a pad support surface on which the polishing pad is overlapped and adhered, while overlapping a top surface of the lower auxiliary plate; a second adhering member adhering the upper auxiliary plate to the lower auxiliary plate; and an alignment member for mutually aligning the lower and upper auxiliary plates and matching center axes thereof. By removing the upper auxiliary plate from the lower auxiliary plate, the polishing pad is removed from the rotating surface plate while being adhered to the pad support surface of the upper auxiliary plate, and the removed upper auxiliary plate is reattached and aligned to the lower auxiliary plate by the alignment member.

Abstract: A method for use of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling it from the rotation table is offered, makes possible the convenient, effective and practical regeneration of polishing pads using a reforming tool.

Abstract: A construction of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling it from the rotation table is offered.