Abstract: Embodiments of the present apparatus and methods for post CMP clean. More particularly, embodiments provide apparatus and methods for removing nano sized particles. One embodiment provides a method for cleaning a substrate. The method includes exposing the substrate to a viscoelastic fluid to remove small particles from the substrate. The viscoelastic fluid comprising a viscosity adjustor and an aqueous base.

Abstract: In some embodiments, a module is provided that is configured to clean, rinse and dry a substrate. The module includes (1) a tank having an upper tank region positioned above a lower tank region, the upper tank region having (a) an opening through which a substrate is removed from the tank; (b) a first fluid supply configured to supply a first fluid to a surface of a substrate being removed from the tank; and (c) a first suction mechanism, positioned below the first fluid supply, wherein the first suction mechanism is configured to suction fluid supplied from the first fluid supply so as to deter the suctioned fluid from reaching the lower tank region; and (2) a drying vapor supply positioned above the first fluid supply and configured to supply a drying vapor to a surface of a substrate being removed from the tank. Numerous other aspects are provided.