Abstract: An insensitive pellet ignitor utilizes a slapper type detonator to initiate an insensitive explosive material. The insensitive explosive material is retained in a high strength housing which confines and dissipates the explosion. The insensitive explosive material is retained in a collar placed in a chamber having an orifice leading to propellant. The orifice does not allow the shockwave from the insensitive explosive to prematurely expel the propellant so that the propellant is ignited from the hot gases and particles resulting from the explosion which are ported through the orifice to the propellant.

Abstract: A detonator device for a primary or secondary explosive comprising an integrated circuit consisting of a silicon wafer substrate on which an epitaxial layer of a desired thickness is first grown, followed by a covering insulating oxide layer. Metal contacts are deposited on the oxide layer in a photolithographic masking process to form a regular pattern of contact pairs. These contact pairs are joined together by a bridge element which may be made from the same metal as the contacts, a higher density metal, from heavily doped polysilicon. The substrate is back-etched beneath the bridge members up to the epitaxial layer to form a barrel through which the flyer may travel. After the wafer is diced, the individual dies have a counter mass face-plate bonded atop the bridge and contacts.

Abstract: A switch device for one-time use in conducting very high currents comprising a silicon substrate on which is deposited a amorphous silicon or polysilicon strip extending as a bridge between first and second spaced-apart metal contacts deposited on the silicon substrate. Also deposited on the same substrate on opposite sides of the bridge and spaced from it are a set of high voltage contacts. When a high voltage is applied across the contacts, no current flows until a trigger current is made to flow through the bridge, the trigger current being sufficiently large to vaporize the bridge creating a plasma cloud. The plasma, being highly conductive, allows a very large current to flow between the high voltage contacts. The device of the present invention finds special application as part of a detonation system for high explosive ammunitions. This specification discloses various modifications to the above structure to achieve desired performance characteristics.

Abstract: An explosive detonator consisting of an integrated circuit chip having a silicon substrate on which is formed an amorphous or polysilicon bridge, the bridge extending between two metal wire-bonding pads also on the substrate. The integrated circuit chip is disposed in close proximity to a primary charge such that when the bridge is energized by an electric current, it heats to the point where the charge is ignited. By back-etching the silicon substrate under the bridge, parasitic heat conduction is avoided. Further, by bonding a pyrex tube to the chip with the tube's bore surrounding the bridge, it is possible to pack the bore with an explosive train in fabricating the detonator assembly.

Abstract: A proximity monitor for movement at a selected distance from a surface, including a first microwave sensor having an antenna pattern directed toward the surface, the principal component of the pattern parallel to the surface being in the direction of the movement, a second microwave sensor having a second antenna pattern directed toward the surface, the principal component of the second pattern parallel to the surface being at a direction opposite to that of the movement, and the patterns being mutually spaced at the surface in the direction of movement, a magnetic anomaly sensor giving an output representative of the presence at the surface of a magnetic anomaly located between the patterns, and apparatus connected to the sensors for performing a control function when the signals from the sensors are above predetermined levels in a predetermined time relationship.

Abstract: A microwave element is disclosed that is fabricated from a dielectric material wherein the antenna, the iris, and a microwave cavity portion are formed generally from a single piece of relatively high dielectric constant material. The microwave cavity portion is converted into an actual microwave resonant cavity by covering the microwave cavity portion with a conductive material.