Abstract: An inkjet printhead structure comprises novel resistor circuitry that is fabricated on two different substrate layers. The dual layer circuitry reduces the required substrate surface area and printhead shelf length to increase the printer operating frequency and print density. In one embodiment of the invention, heating resistors are spread out over portions of the substrate surface area and conductors are attached to opposite ends of the heater resistors in a novel configuration. To simplify routing, the circuitry is configured so that multiple heater resistors are coupled to the same conductor return path located on a second conductive layer. In a second embodiment of the invention, the heater resistors are dimensioned in the shape of a trapezoid to provide uniform heating. Alternative resistor shapes are then introduced to provide consistent heat dissipation for variances in resistor/conductor sheet resistance.

Abstract: A printhead includes a substrate with an ink feed aperture extending from a first surface to a second surface and a plurality of heater resistors disposed on it. Primitive groupings of the resistors are coupled to associated group power sources. An ink barrier layer is deposited on the substrate to create ink firing chambers for each resistor. One wall of the ink barrier has a constricted opening through which ink is supplied from the ink feed aperture. A plurality of transistors are disposed in the substrate with each transistor output coupled to an associated one of the resistors and each input coupled to one of a plurality of addressing signal lines. The number of addressing signal lines is equal to the number of resistors in a primitive grouping.

Abstract: We describe an integrated thermal ink jet printhead and manufacturing process therefor which includes the successive build-up of an orifice plate, a first barrier layer, heater resistors, a second barrier layer, and an ink reservoir-defining layer on top of a reusable or "dummy" substrate. Lead-in conductors are formed integral with the heater resistors by controlling the cross-sectional areas of these components, and openings (passageways) are formed between ink reservoirs and the orifice plate to provide for ink flow under control of the heater resistors. The dummy substrate is stripped away from the adjacent orifice plate, and the ink reservoir defining layer may be secured to an ink supply tank which supplies ink to the individual ink reservoirs. Thus, the orifice plate, heater resistors and ink flow paths of the printhead are self aligned, and the heater resistors are removed from direct cavitational forces from ink ejected from the orifice plate.

Abstract: A process for forming a dielectric patterned layer of any desired geometry on a selected substrate which includes vapor depositing selected reactants on said substrate only in areas thereon which are coextensive with the surface area of an adjacent metal electrode pattern.

Abstract: The specification describes thermal ink jet (TIJ) processes and device structures produced thereby wherein either heater resistors or heater resistor-diode combinations are constructed vertically upward from a common supporting substrate. A lower or first metal level conductor pattern provides one part of an X-Y matrix multiplex connection to the resistor/diode components, and a second, upper metal level conductor pattern forms the second part of the X-Y matrix multiplex connection. In this manner, the multiplex drive circuitry for the TIJ printhead resistors/diodes may be fabricated (integrated) directly on the thin film resistor (TFR) printhead substrate. Additionally, the second level metal conductors which overlie the resistive heater and diode elements also serve as a barrier shield to ink corrosion and cavitation wear.