Patents by Inventor Eleanor van Andel

Eleanor van Andel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5212625
    Abstract: A semiconductor module with provisions for improved cooling and interconnection so as to allow for maximum chip packaging density. Air cooling is brought about by a zig-zag arrangement of groups of thin wire cooling fins mounted on a heat dissipating conductor unit also providing the necessary mechanical rigidity of the module.The interconnection comprises a layer containing grains, preferably diamond, leaving high electrically insulating and high thermally conductive properties.
    Type: Grant
    Filed: November 5, 1991
    Date of Patent: May 18, 1993
    Assignee: Akzo NV
    Inventors: Eleanor van Andel, Carolina A. M. C. Dirix