Abstract: A method and an apparatus for adjusting a process controller based upon a fault detection analysis. A process step upon a workpiece is performed using a processing tool. Manufacturing data relating to processing of the workpiece is acquired. The manufacturing data may include metrology data relating to the processed workpiece and/or tool state data relating to the tool state of a processing tool. A metrology/tool state data integration process is performed based upon the acquired manufacturing data. The metrology/tool state data integration process includes performing an assessment of a tool health related to the processing tool and adjusting an emphasis of the metrology data based upon the assessment of the tool health.

Abstract: The invention is, in its various aspects, a method and apparatus for dynamically generating trace data reports in a semiconductor fabrication process employing fault detection control. The method comprises specifying data including at least one of a parameter, a trigger, and a frequency, for a trace data report; automatically generating from a fault detection controller a request including the specified data to a report generator; formulating the trace data report responsive to the request; and returning the formulated trace data report from the report generator based on the request.

Abstract: A method includes receiving incoming fault detection and correction (FDC) data. The incoming FDC data is stored in a real-time database, A first subscriber list designating a first subscriber for at least a portion of the incoming FDC data is provided. The portion of the incoming FDC data designated in the first subscriber list is sent to the first subscriber. A system includes at least one data collection source, a real-time database, and a database management unit. The data collection source is configured to generate incoming fault detection and correction (FDC) data. The database management unit is configured to store the incoming FDC data in the real-time database, provide a first subscriber list designating a first subscriber for at least a portion of the incoming FDC data, and send the portion of the incoming FDC data designated in the first subscriber list to the first subscriber.

Abstract: A method and apparatus for controlling wafer thickness uniformity in a multi-zone vertical furnace is provided. The multi-zone furnace bakes a plurality of wafers within each zone for a first bake time. A film thickness of at least one wafer baked in each zone of the furnace is measured using a metrology tool. A film thickness optimization unit determines a deposition rate for the at least one wafer within each zone, with the deposition rate being determined as a function of the film thickness of the wafer and the first bake time. The film thickness optimization unit then determines a second bake time to bake a subsequent set of wafers, and the subsequent set of wafers is baked in the furnace for the second bake time.

Abstract: A method and an apparatus for adjusting a rate of data flow based upon a tool state. A processing step is performed on a workpiece using a processing tool. A dynamic data rate adjustment process is performed to determine a data rate for acquiring data relating to the process performed upon the workpiece. The dynamic data rate adjustment process includes adjusting the data rate based upon an operation parameter relating to the processing tool.

Abstract: A method and an apparatus for performing process control based upon a metrology delay. A process step is performed upon a first workpiece. Metrology data related to the first workpiece is acquired. A control adjustment based upon the metrology data is determined. A magnitude of the control adjustment is modified based upon a time period. The time period is defined by a first time frame relating to processing the first workpiece and a second time frame relating to acquiring metrology data related to the first workpiece.

Abstract: A method and system for monitoring a performance of at least one system component of a manufacturing system. At least one event that can occur within the system is defined. It is determined whether the at least one event has occurred within the system, and altering a frequency at which the at least one system component is monitored providing the at least one event has occurred within the system.

Abstract: The present invention is generally directed to method of dynamically enabling additional sensors based upon initial sensor data, and a system for accomplishing same. In one illustrative embodiment, the method comprises initiating a process operation in a process tool, determining if an abnormal process event has occurred in the process operation based upon data sensed by at least one control sensor, enabling at least one additional sensor to acquire additional data related to the process operation if an abnormal process event is determined to have occurred and obtaining data from the enabled additional sensor.

Abstract: A method and apparatus for determining a possible cause of a fault in a semiconductor fabrication process. The method includes determining a first fault in a first processing tool executing under first operating conditions and determining a second fault in a second processing tool executing under second operating conditions. The method further includes identifying a possible source of the second fault based on at least the first operating conditions of the first processing tool.

Abstract: A method and apparatus is provided for identifying a cause of a fault based on controller output. The method comprises processing at least one workpiece under a direction of the controller and detecting a fault associated with the processing of the at least one workpiece. The method further includes determining a plurality of possible causes of the detected fault, identifying a more likely possible cause out of the plurality of possible causes, providing fault information associated with the identified more likely possible cause to the controller. The method further includes providing fault information associated with the identified more likely possible cause to the controller. The method further comprises adjusting the processing of one or more workpieces to be processed next based on the fault information provided to the controller.

Abstract: The present invention is generally directed to various methods of processing substrates based upon the substrate orientation. In one embodiment, the method comprises determining a defective die pattern of a process tool based upon an orientation of a semiconducting substrate in the tool during processing operations, positioning at least one subsequently processed semiconducting substrate in the process tool at an orientation selected to minimize defective die produced by the process tool, the selected orientation being based upon the determined defective die pattern of the process tool, and performing processing operations in the process tool on at least one subsequently processed substrate while at least one substrate is positioned in the process tool at the selected orientation.

Abstract: A method and apparatus is provided for operating a processing tool in a degraded mode upon detecting a fault and in accordance with one or more business rules. The method comprises detecting a fault associated with a processing tool capable of processing one or more workpieces and operating the processing tool in a degraded mode in response to detecting the fault.

Abstract: A method and an apparatus for the determination of a process flow based upon fault detection. A process step upon a workpiece is performed. Fault detection analysis based upon the process step performed upon the workpiece is performed. A workpiece routing process is performed based upon the fault detection analysis. The wafer routing process includes using a controller to perform one or a rework process routing, a non-standard process routing, a fault verification process routing, a normal process routing, or a termination process routing, based upon the fault detection analysis.

Abstract: A method and apparatus for providing fault detection in an Advanced Process Control (APC) framework. A first interface receives operational state data of a processing tool related to the manufacture of a processing piece. The state data is sent from the first interface to a fault detection unit. A fault detection unit determines if a fault condition exists with the processing tool based upon the state data. A predetermined action is performed on the processing tool in response to the presence of a fault condition. In accordance with one embodiment, the predetermined action is to shutdown the processing tool so as to prevent further production of faulty wafers.

Abstract: A method and a system for managing the movement of material lots through a semiconductor fabrication facility. In an example embodiment of the method, the movement of the material lots is tracked and a business rules module is accessed that generates material movement directives as a function of event changes on the line and externally provided directives that change the material lot movement sequence. Material lots are then rearranged in the material handling system as a function of a carrier code and the directive indicating a change. The result is a fabrication process that is more responsive and flexible with respect to internal or external changing conditions.

Abstract: Tracking the movement of individual wafers in a semiconductor processing system is improved by using an apparatus to axially rotate a wafer and using both the rotation angle and the wafer's location in the processing system as tracking coordinates. In an example embodiment, the apparatus imparts angles of rotation on the wafers in different stages of wafer processing. The rotation angles of each wafer are collected as data along with the wafer's location in the process. The combined wafer location and angle of rotation data are used to map the path the wafer has traveled from the onset of processing. An important advantage to this apparatus is the increased control and improved yields that the apparatus brings to wafer processing.

Abstract: The present invention is generally directed to a fault detection control system using dual bus architecture, and methods of using same. In one illustrative embodiment, the system comprises a plurality of process tools, each of the tools adapted to perform at least one process operation on at least one workpiece, at least one sensor that is operatively coupled to each of the process tools and adapted to sense at least one parameter associated with at least one process operation, an initial fault detection unit coupled to an instrument bus, the initial fault detection unit adapted to receive data from at least one sensor on each of the plurality of process tools via the instrument bus, and a primary fault detection unit operatively coupled to a manufacturing execution system and a system bus, the data from the sensors on each of the plurality of process tools being provided to the primary fault detection unit after the data is processed in the initial fault detection unit.

Abstract: A system for identifying wafers contained in a wafer carrier includes a wafer sorter. Each wafer includes a surface terminating in an edge and a plurality of sector identification codes disposed on the surface proximate the edge. The wafer sorter is adapted to scan at least a portion of a wafer extending from the carrier and to identify at least one of the sector identification codes on the wafer independent of the orientation of the wafer in the wafer carrier. A method for identifying wafers contained in a wafer carrier is provided. Each wafer includes a surface terminating in an edge and a plurality of sector identification codes disposed on the surface proximate the edge. The method includes scanning at least a portion of a wafer extending from the carrier and identifying at least one of the sector identification codes on the wafer independent of the orientation of the wafer in the wafer carrier.

Abstract: The detection of a processing deviation in a cluster tool of a wafer processing system is achieved by assigning individual wafers a set of positional coordinates each time the wafer moves within the cluster tool. In an example embodiment, a wafer is placed into a first chamber of the cluster tool and it is rotated to a certain angle of rotation. Each time the wafer moves within the cluster tool the wafer is given a different angle of rotation; both the rotation angle and the wafer location are then recorded as a set of positional coordinates. The wafer exits the cluster tool and is examined for structural or surface defects that indicate that there was a variation in the processing parameters. A wafer movement map is developed from the positional coordinates and the map is then used as an analysis tool to identify the processing location that caused defect to occur. An important advantage is the increased control and traceability that the tracking method brings to single wafer handling and processing.

Abstract: A method and apparatus for scheduled controller execution based upon impending lot arrival at a processing tool in an APC framework. It is determined which lot of processing pieces that is to be processed by a processing tool and the lot of processing pieces is retrieved from a remote location. A predefined set of calculations is initiated relating to the operation of the processing tool in anticipation of delivering the lot of processing pieces to the processing tool. The lot of processing pieces is delivered to the processing tool, and the processing pieces are processed by the processing tool using the predefined set of calculations.