Patents by Inventor Eli MOR
Eli MOR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978647Abstract: Embodiments disclosed herein include a method of calibrating a processing chamber. In an embodiment, the method comprises placing a sensor wafer onto a support surface in the processing chamber, wherein a process kit displaceable in the Z-direction is positioned around the support surface. In an embodiment, the method further comprises measuring a first gap distance between the sensor wafer and the process kit with a sensor on an edge surface of the sensor wafer. In an embodiment, the method further comprises displacing the process kit in the Z-direction. In an embodiment, the method further comprises measuring an additional gap distance between the sensor wafer and the process kit.Type: GrantFiled: November 3, 2022Date of Patent: May 7, 2024Assignee: Applied Materials, Inc.Inventors: Charles G Potter, Eli Mor, Sergio Lopez Carbajal
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Publication number: 20230305531Abstract: A cool cluster comprises one or more transfer chambers; a plurality of process chambers connected to the one or more transfer chambers; and a computing device of the tool cluster. The computing device is to receive first measurements generated by sensors of a first process chamber during or after a process is performed within the first process chamber; determine that the first process chamber is due for maintenance based on processing the first measurements using a first trained machine learning model; after maintenance has been performed on the first process chamber, receive second measurements generated by the sensors during or after a seasoning process is performed within the first process chamber; and determine that the first process chamber is ready to be brought back into service based on processing the second measurements using a second trained machine learning model.Type: ApplicationFiled: May 30, 2023Publication date: September 28, 2023Inventors: Priyadarshi Panda, Lei Lian, Pengyu Han, Todd J. Egan, Prashant Aji, Eli Mor, Alex J. Tom, Leonard Michael Tedeschi
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Patent number: 11709477Abstract: A substrate processing system comprises one or more transfer chambers; a plurality of process chambers connected to the one or more transfer chambers; and a computing device connected to each of the plurality of process chambers. The computing device is to receive first measurements generated by sensors of a first process chamber during or after a process is performed within the first process chamber; determine that the first process chamber is due for maintenance based on processing the first measurements using a first trained machine learning model; after maintenance has been performed on the first process chamber, receive second measurements generated by the sensors during or after a seasoning process is performed within the first process chamber; and determine that the first process chamber is ready to be brought back into service based on processing the second measurements using a second trained machine learning model.Type: GrantFiled: January 6, 2021Date of Patent: July 25, 2023Assignee: Applied Materials, Inc.Inventors: Priyadarshi Panda, Lei Lian, Pengyu Han, Todd J. Egan, Prashant Aji, Eli Mor, Alex J. Tom, Leonard Michael Tedeschi
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Publication number: 20230052210Abstract: Embodiments disclosed herein include a method of calibrating a processing chamber. In an embodiment, the method comprises placing a sensor wafer onto a support surface in the processing chamber, wherein a process kit displaceable in the Z-direction is positioned around the support surface. In an embodiment, the method further comprises measuring a first gap distance between the sensor wafer and the process kit with a sensor on an edge surface of the sensor wafer. In an embodiment, the method further comprises displacing the process kit in the Z-direction. In an embodiment, the method further comprises measuring an additional gap distance between the sensor wafer and the process kit.Type: ApplicationFiled: November 3, 2022Publication date: February 16, 2023Inventors: CHARLES G. POTTER, ELI MOR, SERGIO LOPEZ CARBAJAL
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Patent number: 11521872Abstract: Embodiments disclosed herein include a method of calibrating a processing chamber. In an embodiment, the method comprises placing a sensor wafer onto a support surface in the processing chamber, wherein a process kit displaceable in the Z-direction is positioned around the support surface. In an embodiment, the method further comprises measuring a first gap distance between the sensor wafer and the process kit with a sensor on an edge surface of the sensor wafer. In an embodiment, the method further comprises displacing the process kit in the Z-direction. In an embodiment, the method further comprises measuring an additional gap distance between the sensor wafer and the process kit.Type: GrantFiled: August 20, 2019Date of Patent: December 6, 2022Assignee: Applied Materials, Inc.Inventors: Charles G. Potter, Eli Mor, Sergio Lopez Carbajal
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Patent number: 11387122Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the edge surface, wherein each sensor region comprises a self-referencing capacitive sensor.Type: GrantFiled: October 19, 2020Date of Patent: July 12, 2022Assignee: Applied Materials, Inc.Inventors: Charles Potter, Eli Mor
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Publication number: 20220214662Abstract: A substrate processing system comprises one or more transfer chambers; a plurality of process chambers connected to the one or more transfer chambers; and a computing device connected to each of the plurality of process chambers. The computing device is to receive first measurements generated by sensors of a first process chamber during or after a process is performed within the first process chamber; determine that the first process chamber is due for maintenance based on processing the first measurements using a first trained machine learning model; after maintenance has been performed on the first process chamber, receive second measurements generated by the sensors during or after a seasoning process is performed within the first process chamber; and determine that the first process chamber is ready to be brought back into service based on processing the second measurements using a second trained machine learning model.Type: ApplicationFiled: January 6, 2021Publication date: July 7, 2022Inventors: Priyadarshi Panda, Lei Lian, Pengyu Han, Todd J. Egan, Prashant Aji, Eli Mor, Alex J. Tom, Leonard Michael Tedeschi
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Publication number: 20210035832Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the edge surface, wherein each sensor region comprises a self-referencing capacitive sensor.Type: ApplicationFiled: October 19, 2020Publication date: February 4, 2021Inventors: Charles Potter, Eli Mor
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Patent number: 10847393Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the edge surface, wherein each sensor region comprises a self-referencing capacitive sensor.Type: GrantFiled: September 4, 2018Date of Patent: November 24, 2020Assignee: Applied Materials, Inc.Inventors: Charles G. Potter, Eli Mor
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Patent number: 10794681Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface and a second surface opposite the first surface. In an embodiment, the sensor wafer further comprises a first conductive pad with a first surface area, wherein the first conductive pad has a surface that is substantially coplanar with the first surface of the substrate. In an embodiment, the sensor wafer further comprises a second conductive pad with a second surface area that is smaller than the first surface area, wherein the second conductive pad has a surface that is substantially coplanar with the first surface of the substrate.Type: GrantFiled: September 4, 2018Date of Patent: October 6, 2020Assignee: Applied Materials, Inc.Inventors: Charles G. Potter, Eli Mor
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Publication number: 20200075367Abstract: Embodiments disclosed herein include a method of calibrating a processing chamber. In an embodiment, the method comprises placing a sensor wafer onto a support surface in the processing chamber, wherein a process kit displaceable in the Z-direction is positioned around the support surface. In an embodiment, the method further comprises measuring a first gap distance between the sensor wafer and the process kit with a sensor on an edge surface of the sensor wafer. In an embodiment, the method further comprises displacing the process kit in the Z-direction. In an embodiment, the method further comprises measuring an additional gap distance between the sensor wafer and the process kit.Type: ApplicationFiled: August 20, 2019Publication date: March 5, 2020Inventors: Charles G. Potter, Eli Mor, Sergio Lopez Carbajal
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Publication number: 20200075368Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the edge surface, wherein each sensor region comprises a self-referencing capacitive sensor.Type: ApplicationFiled: September 4, 2018Publication date: March 5, 2020Inventors: Charles G. POTTER, Eli MOR
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Publication number: 20200072594Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface and a second surface opposite the first surface. In an embodiment, the sensor wafer further comprises a first conductive pad with a first surface area, wherein the first conductive pad has a surface that is substantially coplanar with the first surface of the substrate. In an embodiment, the sensor wafer further comprises a second conductive pad with a second surface area that is smaller than the first surface area, wherein the second conductive pad has a surface that is substantially coplanar with the first surface of the substrate.Type: ApplicationFiled: September 4, 2018Publication date: March 5, 2020Inventors: Charles G. POTTER, Eli MOR