Patents by Inventor Eli Vronsky
Eli Vronsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240173961Abstract: In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.Type: ApplicationFiled: February 7, 2024Publication date: May 30, 2024Applicant: Kateeva, Inc.Inventors: Christopher R. Hauf, Eli Vronsky, Alexander Sou-Kang Ko
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Patent number: 11945219Abstract: In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.Type: GrantFiled: March 7, 2023Date of Patent: April 2, 2024Assignee: Kateeva, Inc.Inventors: Christopher R. Hauf, Eli Vronsky, Alexander Sou-Kang Ko
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Publication number: 20230202163Abstract: In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.Type: ApplicationFiled: March 7, 2023Publication date: June 29, 2023Applicant: Kateeva, Inc.Inventors: Christopher R. Hauf, Eli Vronsky, Alexander Sou-Kang Ko
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Patent number: 11628666Abstract: In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.Type: GrantFiled: August 25, 2021Date of Patent: April 18, 2023Assignee: Kateeva, Inc.Inventors: Christopher R. Hauf, Eli Vronsky, Alexander Sou-Kang Ko
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Patent number: 11296049Abstract: A solder reflow oven includes a processing chamber that defines an enclosure. The enclosure includes a spindle configured to support a substrate and rotate the substrate about a central axis of the processing chamber. The spindle is also configured to move vertically along the central axis and position the substrate at different locations within the enclosure. The oven further includes a chemical delivery tube configured to direct a chemical vapor into the enclosure, a lamp assembly configured to heat a top surface of the substrate, and a lift assembly configured to move the spindle along the central axis.Type: GrantFiled: August 31, 2021Date of Patent: April 5, 2022Assignee: YIELD ENGINEERING SYSTEMS, INC.Inventors: Christopher Lane, Eli Vronsky, Taylor Nguyen, Ronald R Stevens, Gabriel Ormonde, Jed Hsu
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Publication number: 20210379888Abstract: In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.Type: ApplicationFiled: August 25, 2021Publication date: December 9, 2021Applicant: Kateeva, Inc.Inventors: Christopher R. HAUF, Eli VRONSKY, Alexander Sou-Kang KO
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Patent number: 11135835Abstract: In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.Type: GrantFiled: December 16, 2019Date of Patent: October 5, 2021Assignee: Kateeva, Inc.Inventors: Christopher R. Hauf, Eli Vronsky, Alexander Sou-Kang Ko
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Publication number: 20200198327Abstract: In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.Type: ApplicationFiled: December 16, 2019Publication date: June 25, 2020Applicant: Kateeva, Inc.Inventors: Christopher R. HAUF, Eli VRONSKY, Alexander Sou-Kang KO
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Publication number: 20070069634Abstract: A device having a static image capable of self-illumination when activated, and comprising constituent pixels printed using a light emitting ink on a layer of an organic light emitting diode (OLED) device so as to form a pattern whose contour is determined only by the pixels and does not require pre-shaping of the layer. The pixels may be printed using ink jet technology on a layer of the OLED, such as the PEDOT layer or cathode of the OLED requiring only a single anode and cathode for activating all the pixels simultaneously thus avoiding a need for separate addressing of selected pixels. Colored pixels may be formed by using different colored light emitting inks.Type: ApplicationFiled: November 28, 2004Publication date: March 29, 2007Applicant: PIXDRO LTD.Inventors: Amiram Carmon, Eli Vronsky
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Publication number: 20070014974Abstract: In a method and system for producing a geometry (24, 35) of desired dimension on a substrate, successive droplets (43) of a material are dropped on to the substrate so as to form a pattern (22, 32) that is of sufficient dimension to accommodate the geometry within a boundary thereof; and a redundant area of the pattern that surrounds an intermediate portion of the pattern defining the geometry is removed. The redundant material may be removed by curing those portions of the pattern that define the pattern and then flushing the surplus; or by ablation of the surplus material.Type: ApplicationFiled: September 2, 2004Publication date: January 18, 2007Inventor: Eli Vronsky