Patents by Inventor Elisabetta Matsumoto

Elisabetta Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180251649
    Abstract: A method of 4D printing comprises depositing a layer of filaments in a predetermined arrangement on a flexible substrate. Each filament comprises a hydrogel matrix and a plurality of anisotropic filler particles embedded therein. The filaments contact the flexible substrate at one or more contact regions. The layer of filaments is hydrated, and the filaments swell in size while remaining in contact with the flexible substrate at the contact regions. The flexible substrate is thereby induced to adopt a predetermined curved shape.
    Type: Application
    Filed: November 29, 2016
    Publication date: September 6, 2018
    Applicant: President and Fellows of Harvard College
    Inventors: Jennifer A. Lewis, Amelia Sydney Gladman, Elisabetta Matsumoto, Lakshminarayanan Mahadevan
  • Patent number: 8557341
    Abstract: Aspects of the present invention describe soft imprint lithography methods capable of preparing structural features on surfaces. Disclosed methods include surmounting a deformable substrate, having an original form, with a composition, wherein the deformable substrate is capable of achieving at least one predetermined deformed state; predictably deforming said deformable substrate from its original form to the at least one predetermined deformed state; and transferring at least a portion of the composition surmounting the deformed substrate to a receiving substrate.
    Type: Grant
    Filed: April 23, 2008
    Date of Patent: October 15, 2013
    Assignee: The Trustees Of The University Of Pennsylvania
    Inventors: Shu Yang, Ying Zhang, Randall Kamien, James Makoto Kikkawa, Elisabetta Matsumoto, Dinesh Chandra
  • Publication number: 20110033672
    Abstract: Aspects of the present invention describe soft imprint lithography methods capable of preparing structural features on surfaces. Disclosed methods include surmounting a deformable substrate, having an original form, with a composition, wherein the deformable substrate is capable of achieving at least one predetermined deformed state; predictably deforming said deformable substrate from its original form to the at least one predetermined deformed state; and transferring at least a portion of the composition surmounting the deformed substrate to a receiving substrate.
    Type: Application
    Filed: April 23, 2008
    Publication date: February 10, 2011
    Applicant: The Trustees of the University of Pennsylvania
    Inventors: Shu Yang, Ying Zhang, Randall Kamien, James Makoto Kikkawa, Elisabetta Matsumoto, Dinesh Chandra