Abstract: A vehicle seat includes a cushion material and a cover for covering the cushion material. The cover includes a load receiving portion configured to receive a load of a seated occupant. The load receiving portion includes a large thickness portion and a small thickness portion that are located next to each other in a first direction that intersects with a thickness direction of the cover. Each of the large and small thickness portions includes an elastic layer compressive in the thickness direction and a lower cover layer located closer to the cushion material than the elastic layer in the thickness direction. The elastic layer of the small thickness portion is compressed such that the thickness of the small thickness portion is smaller than the thickness of the large thickness portion. The lower cover layer of the large thickness portion is partially cut off to form a cutoff portion.

Abstract: A vehicle seat includes a cushion material and a cover for covering the cushion material. The cover includes a load receiving portion configured to receive a load of a seated occupant. The load receiving portion includes a large thickness portion and a small thickness portion that are located next to each other in a first direction that intersects with a thickness direction of the cover. Each of the large and small thickness portions includes an elastic layer compressive in the thickness direction and a lower cover layer located closer to the cushion material than the elastic layer in the thickness direction. The elastic layer of the small thickness portion is compressed such that the thickness of the small thickness portion is smaller than the thickness of the large thickness portion. The lower cover layer of the large thickness portion is partially cut off to form a cutoff portion.

Abstract: A method for forming a scribe line on a semiconductor wafer including the steps of: (a) providing a semiconductor substrate; and (b) sequentially providing a plurality of layers over the semiconductor substrate of alternating conductive and insulating types, where each of the layers is provided with an elongated opening is formed relative to a desired scribe line position, and where the openings of at least some of the plurality of layers are wider than openings of preceding layers such that at least one sidewall of a completed scribe line has a pronounced slope extending outwardly from its base. The structure of the present invention is, therefore, a scribe line having sloped sidewalls that greatly reduces scribe line contamination problems and enhances planarization during subsequent spin-on-material processes. The scribe lines can either be elongated openings in the layers, or an elongated mesa formed in the layers.

Abstract: A method for forming a scribe line on a semiconductor wafer including the steps of: (a) providing a semiconductor substrate; and (b) sequentially providing a plurality of layers over the semiconductor substrate of alternating conductive and insulating types, where each of the layers is provided with an elongated opening is formed relative to a desired scribe line position, and where the openings of at least some of the plurality of layers are wider than openings of preceding layers such that at least one sidewall of a completed scribe line has a pronounced slope extending outwardly from its base. The structure of the present invention is, therefore, a scribe line having sloped sidewalls that greatly reduces scribe line contamination problems and enhances planarization during subsequent spin-on-material processes. The scribe lines can either be elongated openings in the layers, or an elongated mesa formed in the layers.

Abstract: A method for forming a scribe line on a semiconductor wafer including the steps of: (a) providing a semiconductor substrate; and (b) sequentially providing a plurality of layers over the semiconductor substrate of alternating conductive and insulating types, where each of the layers is provided with an elongated opening is formed relative to a desired scribe line position, and where the openings of at least some of the plurality of layers are wider than openings of preceding layers such that at least one sidewall of a completed scribe line has a pronounced slope extending outwardly from its base. The structure of the present invention is, therefore, a scribe line having sloped sidewalls that greatly reduces scribe line contamination problems and enhances planarization during subsequent spin-on-material processes. The scribe lines can either be elongated openings in the layers, or an elongated mesa formed in the layers.

Abstract: This invention relates to a direct dispensing and self-contained surgical suture package. The package can comprise a first part having a strippable envelope, and a second part self-contained therein.