Abstract: Methods, systems, apparatuses, devices, and computer program products are described. A group-based communication system may support automatic layout updates for a document space. If a user adds an object into the document space, the system may generate a card representing the object. The card may include a link to a resource external to the document space and a preview image for the object, where the preview image may be rendered based on unfurling the link. The system may update a layout of the document space to include the generated card and may send, for display in a user interface (UI) of a user device, the updated layout. In some examples, a user may select to reposition the card within the UI (e.g., by dragging-and-dropping the card within the document space). The system may further update the layout of the document space based on the repositioning of the card.

Abstract: Disclosed are packaging methods for the fabrication of analytical device packages and fabricated analytical device packages. The methods include providing a sensor wafer and mounting individual plates or a plate wafer on the sensor wafer. The sensor wafer includes sensor chips with aperture regions and is treated with selective depositions, either prior to or during the fabrication of the analytical device packages, to produce different surface characteristics at different portions of the aperture regions. Before dicing the sensor wafer, openings of the individual plates or the plate wafer are covered by a protective layer to protect surface characteristics at different portions of the aperture regions. A fabricated analytical device package includes a sensor chip with different surface characteristics, a plate, a packaging substrate and an optional cover.

Abstract: Disclosed are packaging methods for the fabrication of analytical device packages and fabricated analytical device packages. The methods include providing a sensor wafer and mounting individual plates or a plate wafer on the sensor wafer. The sensor wafer includes sensor chips with aperture regions and is treated with selective depositions, either prior to or during the fabrication of the analytical device packages, to produce different surface characteristics at different portions of the aperture regions. Before dicing the sensor wafer, openings of the individual plates or the plate wafer are covered by a protective layer to protect surface characteristics at different portions of the aperture regions. A fabricated analytical device package includes a sensor chip with different surface characteristics, a plate, a packaging substrate and an optional cover.

Abstract: A method of attaching a die to a carrier using a temporary attach material is disclosed. The method comprises attaching the temporary attach material between a surface of the die and a surface of the carrier. The temporary attach material attaches the die to the carrier. The method comprises bonding at least one connector to the die and the carrier. The connector includes a first end bonded to the carrier and a second end bonded to the die. The method further comprises encapsulating at least a portion of the die and at least a portion of the at least one connector by an encapsulation material.

Abstract: A method of toning the facial muscles and tissues in selected target areas involves applying predetermined galvanic currents, frequencies, and polarities to the target areas in specific patters and with particular repetitions and movements selected to provide enhanced cosmetic effects, such as reduced lines and wrinkles, reduced depth of folds, and improved circulation to promote health and vitality.

Abstract: A method of toning the facial muscles and tissues in selected target areas involves applying predetermined galvanic currents, frequencies, and polarities to the target areas in specific patters and with particular repetitions and movements selected to provide enhanced cosmetic effects, such as reduced lines and wrinkles, reduced depth of folds, and improved circulation to promote health and vitality.

Abstract: Partitioning electronic sensor packages is provided. The electronic sensor package includes an electronic component, a sensor device, and electrical connections between the electronic component and the sensor device. A dam is written in the electronic sensor package to partition the package into two or more sections, where the sensor device is situated at least partially in one section and the electronic component is situated at least partially in another section. The partitioning of the dam allows the two sections to be filled with different fill materials. For example, the section with the sensor device can be filled with a soft gel-like material to provide some moisture protection to the sensor device without causing detrimental stresses to the sensor device, while the section with the electronic component can be filled with a highly moisture protective epoxy.

Abstract: The present invention provides a tire pressure sensor system that has multiple functions and is integrated into a small package. The system includes one or more Micro Electro Mechanical System (MEMS)-based sensors, including a MEMS-based pressure sensor; a MEMS-oscillator-based wireless signal transmitter; and a microcontroller, where the microcontroller processes the data generated by at least one of the MEMS-based sensors, controls at least one of the MEMS-based sensors, and controls the encoding and timing of transmission of data from the wireless signal transmitter. Preferably, the MEMS-based sensors, MEMS-oscillator-based wireless signal transmitter, and microcontroller are integrated onto one or more chips in one or more packages. The system also preferably includes a MEMS-based motion sensor, a low frequency (LF) receiver, an IC-based voltage sensor, a voltage regulator, a temperature sensor and a polarization voltage generator.

Abstract: Partitioning electronic sensor packages is provided. The electronic sensor package includes an electronic component, a sensor device, and electrical connections between the electronic component and the sensor device. A dam is written in the electronic sensor package to partition the package into two or more sections, where the sensor device is situated at least partially in one section and the electronic component is situated at least partially in another section. The partitioning of the dam allows the two sections to be filled with different fill materials. For example, the section with the sensor device can be filled with a soft gel-like material to provide some moisture protection to the sensor device without causing detrimental stresses to the sensor device, whilst the section with the electronic component can be filled with a highly moisture protective epoxy.

Abstract: Improved sensor packaging is provided with a hybrid integration approach. In one example, an application specific integrated circuit (ASIC) for sensor signal conditioning is packaged. The ASIC package has an aperture in it that exposes a chip to chip bonding interface of the ASIC chip. The rest of the ASIC chip is surrounded by the package, including the connections between the external package leads and the ASIC chip. A sensor chip, also having a chip to chip bonding interface, is disposed in the package aperture and bonded to the ASIC chip such that the two chip to chip bonding interfaces are connected. Flip chip bonding of the sensor chip to the ASIC chip is a preferred approach for chip to chip bonding. The vertical gap between the two chips can be filled in by an underfill process. The lateral gap between the sensor chip and the package can also be filled.

Abstract: Improved sensor packaging is provided with a hybrid integration approach. In one example, an application specific integrated circuit (ASIC) for sensor signal conditioning is packaged. The ASIC package has an aperture in it that exposes a chip to chip bonding interface of the ASIC chip. The rest of the ASIC chip is surrounded by the package, including the connections between the external package leads and the ASIC chip. A sensor chip, also having a chip to chip bonding interface, is disposed in the package aperture and bonded to the ASIC chip such that the two chip to chip bonding interfaces are connected. Flip chip bonding of the sensor chip to the ASIC chip is a preferred approach for chip to chip bonding. The vertical gap between the two chips can be filled in by an underfill process. The lateral gap between the sensor chip and the package can also be filled.

Abstract: The present invention provides a tire pressure sensor system that has multiple functions and is integrated into a small package. The system includes one or more Micro Electro Mechanical System (MEMS)-based sensors, including a MEMS-based pressure sensor; a MEMS-oscillator-based wireless signal transmitter; and a microcontroller, where the microcontroller processes the data generated by at least one of the MEMS-based sensors, controls at least one of the MEMS-based sensors, and controls the encoding and timing of transmission of data from the wireless signal transmitter. Preferably, the MEMS-based sensors, MEMS-oscillator-based wireless signal transmitter, and microcontroller are integrated onto one or more chips in one or more packages. The system also preferably includes a MEMS-based motion sensor, a low frequency (LF) receiver, an IC-based voltage sensor, a voltage regulator, a temperature sensor and a polarization voltage generator.

Abstract: Method and apparatus for remote peripheral software installation. A software system running in a local computer system used by a system administrator can install drivers, network utilities, and other peripheral software on a remote system connected to a network. The software system gathers system information from the remote system including the locations and names of system files. The software system also provides for the stopping and restarting of services which are associated with the peripheral software. In this way, installation can be completed without rebooting, or otherwise disrupting the operation of the remote system. Additionally, no special software is needed on the remote system, and no user need be logged into the remote system.

Abstract: The present invention relates to a dry immunoassay analytical element for assaying a ligand, comprising a support bearing: (a) a label zone comprising an enzyme labeled ligand or an enzyme labeled receptor; (b) a spreading zone; (c) a receptor zone comprising a fixed concentration of an immobilized receptor for the ligand; and (d) a gravure zone comprising a diaryl telluride. A prefered embodiment of the present invention further comprises a vanadyl salt. The present invention further relates to a method for performing an assay using an element as described above.

Abstract: Diaza-18-crown-6 compounds of the formula I: ##STR1## wherein X is a phenol, naphthol or quinolinol moiety selected from those of the formulae: ##STR2## R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 are independently selected from hydrogen, halo, cyano, nitro, (C.sub.1 -C.sub.6) alkyl, (C.sub.2 -C.sub.8) acyl, acetamido, mercapto, alkyl or arylsulfonyl, trifluoromethyl, aryl, and substituted aryl wherein the aryl moiety is selected from phenyl and naphthyl and the aryl substituent is selected from halo, cyano, nitro, (C.sub.1 -C.sub.6) alkyl, (C.sub.2 -C.sub.8) acyl, phenyl, acetamido, mercapto, alkyl or arylsulfonyl and trifluoromethyl; provided that when R.sub.1, R.sub.2, R.sub.3 and R.sub.5 are hydrogen and X is phenol, R.sub.4 is not nitro; and provided that when X is phenol and R.sub.5 is hydrogen, R.sub.1 (or R.sub.2) and R.sub.4 are not both nitro.

Abstract: A dry immunoassay analytical element for assaying a ligand, comprising a support bearing:1. an enzyme labeled ligand or an enzyme labeled receptor zone;2. a spreading zone; and3. a receptor zone containing a fixed concentration of an immobilized receptor for the ligand and the labeled ligand when present and the receptor is covalently bonded to polymeric beads having a diameter in the range of 0.1 to 5 .mu.m; characterized in that the element contains a diaryl telluride (DAT) compound and the zones can be in the same or separate layers.

Abstract: This method enables two components (1, 3) to be joined by soldering using heat generated by a laser beam, without the use of flux. A layer (5) of a material which has a lower melting point than the material of one of the components (3) is formed on that component and forms a bond therewith on resolidifying after melting. Solder (7) is interposed between the layer (5) and the other component (1) to form, on resolidification after melting, bonds with the material of the layer (5) and the other component (1). A coating (11) of a further material between the layer (5) and the solder (7) is dispersed when the adjacent layer material becomes molten and is not wetted by the solder (7) when molten. On applying heat to a region (15) of the layer using a laser beam, the layer is melted in this region (15) as is the adjacent solder (7) to form, on resolidification of the solder (7) and molten layer material (15 ), bonds between the solder (7) and the two components (1, 3).