Abstract: Systems and methods for electroplating are provided. An electroplating system may include an electroplating cell configured to contain an anode and an electroplating solution, a wafer holder configured to support a wafer within the electroplating cell, a reservoir configured to contain at least a portion of the electroplating solution, a recirculation flowpath that fluidically connects the reservoir and the electroplating cell, in which the recirculation flowpath includes a pump and is configured to circulate the electroplating solution between the reservoir and the electroplating cell, and a frother fluidically connected to one or more of the electroplating cell, the reservoir, and the recirculation flowpath. The frother may be configured to generate bubbles in the electroplating solution when the electroplating solution is present in the electroplating system, interfaced with the frother, and the frother is activated.