Patents by Inventor Elizar Andres

Elizar Andres has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with a lead and method of manufacture thereof
    Patent number: 9035440
    Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent to the package paddle; depositing a lead conductive cap on the lead, the lead conductive cap includes a nickel layer having a thickness between 2.55 ?m to 8.00 ?m deposited on the lead, a palladium layer deposited on the nickel layer, and a gold layer deposited on the palladium layer; mounting an integrated circuit over the package paddle; attaching an electrical connector between the lead conductive cap and the integrated circuit; and forming an encapsulation over the integrated circuit, a portion of the lead, and a portion of the package paddle.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: May 19, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Emmanuel Espiritu, Elizar Andres, Henry Descalzo Bathan, Zigmund Ramirez Camacho
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A LEAD AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20120326285
    Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent to the package paddle; depositing a lead conductive cap on the lead, the lead conductive cap includes a nickel layer having a thickness between 2.55 ?m to 8.00 ?m deposited on the lead, a palladium layer deposited on the nickel layer, and a gold layer deposited on the palladium layer; mounting an integrated circuit over the package paddle; attaching an electrical connector between the lead conductive cap and the integrated circuit; and forming an encapsulation over the integrated circuit, a portion of the lead, and a portion of the package paddle.
    Type: Application
    Filed: June 23, 2011
    Publication date: December 27, 2012
    Inventors: Emmanuel Espiritu, Elizar Andres, Henry Descalzo Bathan, Zigmund Ramirez Camacho