Abstract: A salvage system for on-site removal and recovery of electrical components such as IC's from PC boards. The unit may be mobile having at least two heating stations, each of which includes a mounting apparatus which positions the PCB above an array of infrared heating sources. Initial heating occurs at the first station and subsequent heating to above the eutectic point of the solder occurs at the second station. The unit is designed so that a minimum of workers can attend to the initial sorting, cleaning, sequential heating, extracting and storing of removed components. The heating apparatus includes a fan, baffle and deflector arrangement which helps to maintain even heating and avoidance of hot spots.