Abstract: A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly. The flexible strip has one or more routing circuits carried thereon. The die assembly and the substrate are arranged to be electrically connected through the one or more routing circuits carried on the flexible strip.

Abstract: A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly. The flexible strip has one or more routing circuits carried thereon. The die assembly and the substrate are arranged to be electrically connected through the one or more routing circuits carried on the flexible strip.

Abstract: A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly. The flexible strip has one or more routing circuits carried thereon. The die assembly and the substrate are arranged to be electrically connected through the one or more routing circuits carried on the flexible strip.

Abstract: An integrated circuit package includes a flexible laminar substrate 1. The substrate 1 has a flexible layer 5 of heat conductive material on one of its faces. The layer 5 extends across an aperture 9 in the flexible substrate 1. A first integrated circuit 11 is mounted on the layer 5 within the aperture 9, and wire bonded to the substrate 1. A flip chip 21 is mounted on the first integrated circuit 11. The two integrated circuits 11, 21 are embedded in a resin body 23.

Abstract: Electronic component (1; 20) has at least one stack (2; 21, 23) with at least two semiconductor chips (8, 9; 32, 33; 42, 43). Each semiconductor chip (8, 9; 32, 33; 42, 43) includes an active surface including integrated circuits (11; 35) and chip contact pads (10; 34) at least one being a ground cell (13; 37) and a passive surface. The electronic component (1; 20) further includes at least one intermediate spacer (14; 38; 44) with a thermally conductive and electrically conductive material. The intermediate spacer block (14; 38; 44) is positioned between the active surface of a semiconductor chip (9; 33; 43) and the passive surface of an adjacent semiconductor chip (8; 32; 42) in the stack (2; 21, 23). The intermediate spacer (14; 38; 44) and the ground cells (13; 37) of the semiconductor chips (9; 33; 43) are electrically connected and have a common ground.

Abstract: An integrated circuit package is proposed in which a laminar substrate 41 is provided with an aperture 43. A heat-spreader member 1 is mounted to cover this aperture 43, and contains a cavity 3 opening towards the aperture 43 in the substrate 41. A stack of integrated circuit circuits 11, 21, are located with one integrated circuit 21 of the stack inserted into the cavity 3, and one integrated circuit 11 of the stack electrically connected to the substrate 41.

Abstract: A new method is provided for the connection of heat conducting copper pads, eliminating the need for these heat conducting pads to be connected directly to the ground ring, further eliminating the need for the ground ring to be the external ring that is provided on a surface of the package.