Abstract: A semiconductor package includes a lead frame that includes a die pad and a first lead extending away from the die pad, a semiconductor die mounted on the die pad, a load path connection that electrically connects a first load terminal of the semiconductor die with the first lead, and a magnetic sensor arrangement mounted directly on a region of the lead frame which forms part of the load path connection, wherein the magnetic sensor arrangement comprises a magnetic current sensor that is configured to measure a current flowing through the load path connection and an electrical isolation layer that electrically isolates the magnetic current sensor from the lead frame.

Abstract: A DC-DC converter includes: a transformer; first and second switching circuits, each coupled to one of two sides of the transformer, respectively, and each including at least two switches; a first current detection module, coupled to one side of the transformer and detecting a current at the side; a first conversion module, coupled to an output of the first current detection module, and converting a signal of the current received from the output to a voltage signal; a first comparison module comparing the voltage signal received from the output with a reference voltage signal, and generating a first modulation signal based on the comparison result; and a first controller generating a first control signal which is used for at least one switch in the second switching circuit and based on the first modulation signal and a drive signal of at least one switch in the first switching circuit.

Abstract: A DC-DC converter includes: a transformer; first and second switching circuits, each coupled to one of two sides of the transformer, respectively, and each including at least two switches; a first current detection module, coupled to one side of the transformer and detecting a current at the side; a first conversion module, coupled to an output of the first current detection module, and converting a signal of the current received from the output to a voltage signal; a first comparison module comparing the voltage signal received from the output with a reference voltage signal, and generating a first modulation signal based on the comparison result; and a first controller generating a first control signal which is used for at least one switch in the second switching circuit and based on the first modulation signal and a drive signal of at least one switch in the first switching circuit.