Abstract: The present invention teaches a novel method of making ultrasonic fine wire interconnections between pads on a semiconductor chip and lead out terminals which may be performed with commercially available computer controlled automatic wire bonding machines having an ultrasonic bonding tool holder. A capillary wedge bonding tool is employed which has an annular working face similar in cross-section to a conventional narrow face bonding wedge. When the second bond of an interconnecting wire is made, the capillary wedge bonding tool is moved away from the second bond to leave a small portion of the wire exposed out of the capillary wedge bonding tool. The wire is clamped and the bonding tool is then moved in a predetermined direction away from the second bond to break the wire and form a wire bonding tail.