Patents by Inventor Emanoil Surducan

Emanoil Surducan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7746276
    Abstract: The multi-band antenna structure includes a first antenna having a band width about a middle frequency and a second antenna spaced and electrically isolated from the antenna. Ends of the second antenna are shorted to each other and the antenna floats electrically. The first and second antennas are planar and superimposed in parallel planes. At least two layers of dielectric material of a thickness is between the two antennas. A third layer of dielectric material of a third thickness is between the two antennas.
    Type: Grant
    Filed: February 2, 2006
    Date of Patent: June 29, 2010
    Assignee: Sandbridge Technologies, Inc.
    Inventors: Emanoil Surducan, Daniel Iancu, John Glossner
  • Publication number: 20090079658
    Abstract: The multi-band antenna structure includes a first antenna having a band width about a middle frequency and a second antenna spaced and electrically isolated from the antenna. Ends of the second antenna are shorted to each other and the antenna floats electrically. The first and second antennas are planar and superimposed in parallel planes. At least two layers of dielectric material of a thickness is between the two antennas. A third layer of dielectric material of a third thickness is between the two antennas.
    Type: Application
    Filed: February 2, 2006
    Publication date: March 26, 2009
    Applicant: SANDBRIDGE TECHNOLOGIES, INC.
    Inventors: Emanoil Surducan, Daniel Iancu, John Glossner
  • Publication number: 20060208956
    Abstract: A dipole antenna for a wireless communication device, which includes a first conductive element superimposed on a portion of and separated from a second conductive element by a first dielectric layer. A first conductive via connects the first and second conductive elements through the first dielectric layer. The second conductive element is generally U-shaped. The second conductive element includes a plurality of spaced conductive strips extending transverse from adjacent ends of the legs of the U-shape. Each strip is dimensioned for a different center frequency ?0. The first conductive element may be replaced by a coaxial feed directly to the second conductive element.
    Type: Application
    Filed: April 28, 2006
    Publication date: September 21, 2006
    Inventors: Emanoil Surducan, Daniel Iancu, John Glossner
  • Patent number: 7095382
    Abstract: A dipole antenna for a wireless communication device, which includes a first conductive element superimposed on a portion of and separated from a second conductive element by a first dielectric layer. A first conductive via connects the first and second conductive elements through the first dielectric layer. The second conductive element is generally U-shaped. The second conductive element includes a plurality of spaced conductive strips extending transverse from adjacent ends of the legs of the U-shape. Each strip is dimensioned for a different center frequency ?0. The first conductive element may be replaced by a coaxial feed directly to the second conductive element.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: August 22, 2006
    Assignee: Sandbridge Technologies, Inc.
    Inventors: Emanoil Surducan, Daniel Iancu, John Glossner
  • Patent number: 7034769
    Abstract: A dipole antenna for a wireless communication device, which includes a first conductive element superimposed on a portion of and separated from a second conductive element by a first dielectric layer. A first conductive via connects the first and second conductive elements through the first dielectric layer. The second conductive element is generally U-shaped. The second conductive element includes a plurality of spaced conductive strips extending transverse from adjacent ends of the legs of the U-shape. Each strip is dimensioned for a different center frequency ?0. The first conductive element may be L-shaped, and one of the legs of the L-shape being superimposed on one of the legs of the U-shape. The first conductive via connects the other leg of the L-shape to the other leg of the U-shape.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: April 25, 2006
    Assignee: Sandbridge Technologies, Inc.
    Inventors: Emanoil Surducan, Daniel Iancu, John Glossner
  • Publication number: 20050110698
    Abstract: A dipole antenna for a wireless communication device, which includes a first conductive element superimposed on a portion of and separated from a second conductive element by a first dielectric layer. A first conductive via connects the first and second conductive elements through the first dielectric layer. The second conductive element is generally U-shaped. The second conductive element includes a plurality of spaced conductive strips extending transverse from adjacent ends of the legs of the U-shape. Each strip is dimensioned for a different center frequency ?0. The first conductive element may be replaced by a coaxial feed directly to the second conductive element.
    Type: Application
    Filed: June 3, 2004
    Publication date: May 26, 2005
    Inventors: Emanoil Surducan, Daniel Iancu, John Glossner
  • Publication number: 20050110696
    Abstract: A dipole antenna for a wireless communication device, which includes a first conductive element superimposed on a portion of and separated from a second conductive element by a first dielectric layer. A first conductive via connects the first and second conductive elements through the first dielectric layer. The second conductive element is generally U-shaped. The second conductive element includes a plurality of spaced conductive strips extending transverse from adjacent ends of the legs of the U-shape. Each strip is dimensioned for a different center frequency ?0. The first conductive element may be L-shaped, and one of the legs of the L-shape being superimposed on one of the legs of the U-shape. The first conductive via connects the other leg of the L-shape to the other leg of the U-shape.
    Type: Application
    Filed: November 24, 2003
    Publication date: May 26, 2005
    Inventors: Emanoil Surducan, Daniel Iancu, John Glossner