Patents by Inventor Emi Fuchi
Emi Fuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10326106Abstract: The present invention is a sealing sheet comprising at least a base resin layer and a sealing resin layer, the base resin layer having a microstructure that is provided to one surface of the base resin layer, the sealing resin layer being provided on a side of the base resin layer on which the microstructure is provided, and the microstructure having a protrusion that has a maximum difference in height (H) of 1 to 50 ?m and is arranged two-dimensionally on the surface of the base resin layer, and an electronic device member, and an electronic device. The sealing sheet according to the invention exhibits an excellent gas barrier capability that suppresses or reduces the entry of a gas (e.g., water vapor) not only in the vertical direction, but also in the horizontal direction (from the edge) with respect to the surface of the sealing sheet.Type: GrantFiled: November 14, 2014Date of Patent: June 18, 2019Assignee: LINTEC CORPORATIONInventors: Tsutomu Hara, Takeshi Kondo, Emi Fuchi
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Patent number: 10081741Abstract: The present invention provides: an adhesive composition comprising a diene-based rubber (A) that includes a radiation-curable functional group, a cured adhesive layer having a thickness of 60 ?m that is formed by curing the adhesive composition having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 30 g/(m2·day) or less; an adhesive sheet comprising a curable adhesive layer that is formed using the adhesive composition; and an electronic device comprising a sealing material, the sealing material being formed using the adhesive composition.Type: GrantFiled: November 29, 2013Date of Patent: September 25, 2018Assignee: LINTEC CORPORATIONInventors: Kenta Nishijima, Satoshi Naganawa, Emi Fuchi
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Publication number: 20180261800Abstract: The present invention is a sealing sheet comprising at least a base resin layer and a sealing resin layer, the base resin layer having a microstructure that is provided to one surface of the base resin layer, the sealing resin layer being provided on a side of the base resin layer on which the microstructure is provided, and the microstructure having a protrusion that has a maximum difference in height (H) of 1 to 50 ?m and is arranged two-dimensionally on the surface of the base resin layer, and an electronic device member, and an electronic device. The sealing sheet according to the invention exhibits an excellent gas barrier capability that suppresses or reduces the entry of a gas (e.g., water vapor) not only in the vertical direction, but also in the horizontal direction (from the edge) with respect to the surface of the sealing sheet.Type: ApplicationFiled: November 14, 2014Publication date: September 13, 2018Applicant: LINTEC CORPORATIONInventors: Tsutomu HARA, Takeshi KONDO, Emi FUCHI
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Patent number: 9809728Abstract: The present invention provides: an adhesive composition for sealing an electronic device, the adhesive composition comprising an isobutylene-isoprene copolymer as a main component, the isobutylene-isoprene copolymer having a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units; an adhesive sheet comprising a gas barrier film, and an adhesive layer that is formed on the gas barrier film, the gas barrier film having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 0.1 g/m2/day or less, and having a total light transmittance of 80% or more, and the adhesive layer comprising an adhesive composition that comprises an isobutylene-isoprene copolymer as a main component; and an electronic device or the like in which the adhesive composition and the adhesive sheet are used as a sealant for an organic electroluminescent element or the like.Type: GrantFiled: November 29, 2013Date of Patent: November 7, 2017Assignee: LINTEC CORPORATIONInventors: Kenta Nishijima, Satoshi Naganawa, Emi Fuchi
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Patent number: 9580625Abstract: Provided is a gas barrier pressure-sensitive adhesive sheet having at least one gas barrier layer and at least one pressure-sensitive adhesive layer, the at least one pressure-sensitive adhesive layer having a storage modulus at 23° C. of 1.5×104 to 1.0×107 Pa, and the gas barrier pressure-sensitive adhesive sheet not including a base layer.Type: GrantFiled: July 25, 2012Date of Patent: February 28, 2017Assignee: LINTEC CORPORATIONInventors: Emi Fuchi, Suguru Kenmochi, Satoshi Naganawa, Koichi Nagamoto
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Publication number: 20150307750Abstract: The present invention provides: an adhesive composition comprising a diene-based rubber (A) that includes a radiation-curable functional group, a cured adhesive layer having a thickness of 60 ?m that is formed by curing the adhesive composition having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 30 g/(m2·day) or less; an adhesive sheet comprising a curable adhesive layer that is formed using the adhesive composition; and an electronic device comprising a sealing material, the sealing material being formed using the adhesive composition.Type: ApplicationFiled: November 29, 2013Publication date: October 29, 2015Applicant: LINTEC CORPORATIONInventors: Kenta NISHIJIMA, Satoshi NAGANAWA, Emi FUCHI
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Publication number: 20150299524Abstract: The present invention provides: an adhesive composition comprising an isobutylene-based polymer (A), a diene-based rubber (B) that includes a hydroxyl group, and a crosslinking agent (C); an adhesive sheet comprising an adhesive layer that is formed using the adhesive composition; and an electronic device comprising a sealing material, the sealing material being formed using the adhesive composition, or the adhesive. According the present invention, provided are; an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability, and exhibits adhesion and holding power in a well-balanced manner; an adhesive sheet that includes an adhesive layer that is formed using the adhesive composition; and an electronic device that includes a sealing material that is formed using the adhesive composition.Type: ApplicationFiled: November 29, 2013Publication date: October 22, 2015Applicant: LINTEC CORPORATIONInventors: Kenta NISHIJIMA, Satoshi NAGANAWA, Emi FUCHI
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Publication number: 20150299519Abstract: The present invention provides: an adhesive composition for sealing an electronic device, the adhesive composition comprising an isobutylene-isoprene copolymer as a main component, the isobutylene-isoprene copolymer having a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units; an adhesive sheet comprising a gas barrier film, and an adhesive layer that is formed on the gas barrier film, the gas barrier film having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 0.1 g/m2/day or less, and having a total light transmittance of 80% or more, and the adhesive layer comprising an adhesive composition that comprises an isobutylene-isoprene copolymer as a main component; and an electronic device or the like in which the adhesive composition and the adhesive sheet are used as a sealant for an organic electroluminescent element or the like.Type: ApplicationFiled: November 29, 2013Publication date: October 22, 2015Applicant: LINTEC CORPORATIONInventors: Kenta Nishijima, Satoshi Naganawa, Emi Fuchi
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Publication number: 20150299518Abstract: The present invention provides an adhesive composition comprising a diene-based rubber (A) that includes a carboxylic acid-based functional group, and a crosslinking agent (B), an adhesive layer having a thickness of 60 ?m that is obtained by crosslinking the adhesive composition having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 60 g/(m2·day) or less; an adhesive sheet comprising an adhesive layer that is formed using the adhesive composition; and an electronic device comprising a sealing material, the sealing material being formed using the adhesive composition, or the adhesive sheet.Type: ApplicationFiled: November 29, 2013Publication date: October 22, 2015Applicant: LINTEC CorporationInventors: Kenta NISHIJIMA, Satoshi NAGANAWA, Emi FUCHI
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Publication number: 20140178622Abstract: The present invention is a gas barrier pressure-sensitive adhesive sheet comprising at least one gas barrier layer and at least one pressure-sensitive adhesive layer, the at least one pressure-sensitive adhesive layer having a storage modulus at 23° C. of 1.5×104 to 1.0×107 Pa, and the gas barrier pressure-sensitive adhesive sheet not including a base layer.Type: ApplicationFiled: July 25, 2012Publication date: June 26, 2014Applicant: LINTEC CORPORATIONInventors: Emi Fuchi, Suguru Kenmochi, Satoshi Naganawa, Koichi Nagamoto