Patents by Inventor EMI IWATANI

EMI IWATANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition
    Patent number: 9932473
    Abstract: An encapsulating resin composition contains a thermosetting resin component, a curing accelerator, an inorganic filler, an ion trapping agent, and an aromatic monocarboxylic acid having one or more electron-withdrawing functional groups selected from a nitro group and a cyano group. The encapsulating resin composition is solid at 25° C., and has a sulfur content, measured by X-ray fluorescence analysis, of 0.1 mass % or less in terms of SO3.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: April 3, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Emi Iwatani, Kazuto Ogawa, Kota Ishikawa, Takayuki Tsuji
  • Sealing epoxy resin composition, hardened product, and semiconductor device
    Patent number: 9633922
    Abstract: A sealing epoxy resin composition contains a phosphonium salt shown in Formula (1), an epoxy resin, a hardening agent, and an inorganic filler. In Formula (1), R1-R3 each represent an aryl group having 6 to 12 carbon atoms, R4 represents an alkyl group having 1 to 4 carbon atoms, R6 and R8 each represent either a carboxyl group or a hydroxyl group, R5 and R7 each represent either hydrogen or an alkyl group having 1 to 4 carbon atoms, R9 and R11 represent hydrogen, R10 represents either a carboxyl group or a hydroxyl group, and the relation of r?1 is satisfied.
    Type: Grant
    Filed: May 14, 2016
    Date of Patent: April 25, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuto Ogawa, Kyoko Nishidono, Emi Iwatani, Keigo Takagi
  • ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING THE ENCAPSULATING RESIN COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE ENCAPSULATING RESIN COMPOSITION
    Publication number: 20160289443
    Abstract: An encapsulating resin composition contains a thermosetting resin component, a curing accelerator, an inorganic filler, an ion trapping agent, and an aromatic monocarboxylic acid having one or more electron-withdrawing functional groups selected from a nitro group and a cyano group. The encapsulating resin composition is solid at 25° C., and has a sulfur content, measured by X-ray fluorescence analysis, of 0.1 mass % or less in terms of SO3.
    Type: Application
    Filed: March 21, 2016
    Publication date: October 6, 2016
    Inventors: EMI IWATANI, KAZUTO OGAWA, KOTA ISHIKAWA, TAKAYUKI TSUJI
  • SEALING EPOXY RESIN COMPOSITION, HARDENED PRODUCT, AND SEMICONDUCTOR DEVICE
    Publication number: 20160260645
    Abstract: A sealing epoxy resin composition contains a phosphonium salt shown in Formula (1), an epoxy resin, a hardening agent, and an inorganic filler. In Formula (1), R1-R3 each represent an aryl group having 6 to 12 carbon atoms, R4 represents an alkyl group having 1 to 4 carbon atoms, R6 and R8 each represent either a carboxyl group or a hydroxyl group, R5 and R7 each represent either hydrogen or an alkyl group having 1 to 4 carbon atoms, R9 and R11 represent hydrogen, R10 represents either a carboxyl group or a hydroxyl group, and the relation of r?1 is satisfied.
    Type: Application
    Filed: May 14, 2016
    Publication date: September 8, 2016
    Inventors: KAZUTO OGAWA, KYOKO NISHIDONO, EMI IWATANI, KEIGO TAKAGI