Patents by Inventor Emi Mukai

Emi Mukai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9408307
    Abstract: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: August 2, 2016
    Assignee: Kyocera Corporation
    Inventors: Mahiro Tsujino, Eiichi Katayama, Emi Mukai, Atsushi Ogasawara
  • Publication number: 20150016074
    Abstract: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.
    Type: Application
    Filed: March 5, 2013
    Publication date: January 15, 2015
    Applicant: KYOCERA Corporation
    Inventors: Mahiro Tsujino, Eiichi Katayama, Emi Mukai, Atsushi Ogasawara
  • Patent number: 8581487
    Abstract: A light-emitting device includes a substrate, a pair of electrode layers disposed on the substrate, a light-emitting element disposed between the pair of electrode layers to keep a first space with each of the pair of electrode layers while electrically connecting with each of the pair of electrode layers, and a pair of reflection layers, each extending in overlapping relation from one to the other one of the pair of electrode layers as seen in a transparent plan view. The light-emitting element is disposed between the pair of reflection layers to keep a second space with each of the pair of reflection layers.
    Type: Grant
    Filed: November 25, 2010
    Date of Patent: November 12, 2013
    Assignee: KYOCERA Corporation
    Inventors: Takashi Sawai, Emi Mukai, Kousuke Katabe, Akira Miyake
  • Publication number: 20120212124
    Abstract: A light-emitting device includes a substrate, a pair of electrode layers disposed on the substrate, a light-emitting element disposed between the pair of electrode layers to keep a first space with each of the pair of electrode layers while electrically connecting with each of the pair of electrode layers, and a pair of reflection layers, each extending in overlapping relation from one to the other one of the pair of electrode layers as seen in a transparent plan view. The light-emitting element is disposed between the pair of reflection layers to keep a second space with each of the pair of reflection layers.
    Type: Application
    Filed: November 25, 2010
    Publication date: August 23, 2012
    Applicant: KYOCERA CORPORATION
    Inventors: Takashi Sawai, Emi Mukai, Kousuke Katabe, Akira Miyake