Patents by Inventor Emily Ellen Hoffman

Emily Ellen Hoffman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having resin anti-bleed feature
    Patent number: 7183657
    Abstract: A device and a method for controlling resin bleed, the device comprising a substrate having a surface, wherein an interior region, a peripheral region, and an exterior region of the surface are generally defined. An adhesive generally resides on the surface of the substrate in the peripheral region thereof, wherein the adhesive comprises a plurality of components, such as a metal and a resin. A first barrier is formed on the surface of the substrate generally between the adhesive and the exterior region, wherein the first barrier generally prevents one or more of the plurality of components of the adhesive from bleeding onto the exterior region of the surface of the substrate.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: February 27, 2007
    Assignee: Texas Instruments Incorporated
    Inventors: Robert John Furtaw, John Henry Abbott, Emily Ellen Hoffman
  • Semiconductor device having resin anti-bleed feature
    Publication number: 20060060985
    Abstract: A device and a method for controlling resin bleed, the device comprising a substrate having a surface, wherein an interior region, a peripheral region, and an exterior region of the surface are generally defined. An adhesive generally resides on the surface of the substrate in the peripheral region thereof, wherein the adhesive comprises a plurality of components, such as a metal and a resin. A first barrier is formed on the surface of the substrate generally between the adhesive and the exterior region, wherein the first barrier generally prevents one or more of the plurality of components of the adhesive from bleeding onto the exterior region of the surface of the substrate.
    Type: Application
    Filed: September 23, 2004
    Publication date: March 23, 2006
    Inventors: Robert Furtaw, John Henry Abbott, Emily Ellen Hoffman
  • Semiconductor device and method of fabrication
    Patent number: 6372623
    Abstract: A process for the fabrication of an integrated circuit assembly, using thin film platinum metallization to provide edge-side contacts suitable for solder ball connections. Three-dimensional laser ablation may be used for patterning metal films. A multi-chip assembly may be formed using orthogonal edge-side mounting on a substrate.
    Type: Grant
    Filed: August 18, 1997
    Date of Patent: April 16, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Emily Ellen Hoffman, Robert E. Terrill, Wesley Michael Wolverton
  • Semiconductor device including stacked chips having metal patterned on circuit surface and one edge side of chip
    Patent number: 6033931
    Abstract: A three-dimensional microchip circuit assembly process, wherein a three-layer dry adhesive film sandwich is used to prepare a stacked circuit cube.
    Type: Grant
    Filed: January 18, 1999
    Date of Patent: March 7, 2000
    Assignee: Texas Instruments Incorporated
    Inventors: Emily Ellen Hoffman, Judith Sultenfuss Archer
  • Semiconductor device including stacked chips having metal patterned on circuit surface and on edge side of chip
    Patent number: 5892287
    Abstract: A three-dimensional semiconductor circuit assembly wherein each of several circuit chips is provided with patterned metal layers that extend from the circuit surface onto an edge side of the chip, then the chips are adhesively bonded to opposite surfaces of one or more dielectric spacers, respectively, whereby the edge sides of the resulting multiple-chip stack are readily connected to metal patterns on a substrate.
    Type: Grant
    Filed: August 18, 1997
    Date of Patent: April 6, 1999
    Assignee: Texas Instruments
    Inventors: Emily Ellen Hoffman, Judith Sultenfuss Archer