Patents by Inventor Emmanuel Demuizon

Emmanuel Demuizon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pad metallization over active circuitry
    Patent number: 6787908
    Abstract: Metal bond pads are formed over active circuitry in a semiconductor chip in a reliable and cost effective manner. According to an example embodiment of the present invention, a metal bond pad is formed over circuitry in the semiconductor chip. A metal layer is formed over the circuitry and the metal bond pad, and a diffusion barrier layer is formed between the metal layer and the metal bond pad. In this manner, additional metal can be formed on the pad site using only one additional mask step, and thicker metal at the pad site improves the reliability of the chip by providing for a metal cushion at the pad useful in subsequent wire bonding processes.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: September 7, 2004
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Steven L Skala, Subhas Bothra, Emmanuel Demuizon
  • Pad metallization over active circuitry
    Publication number: 20010026018
    Abstract: Metal bond pads are formed over active circuitry in a semiconductor chip in a reliable and cost effective manner. According to an example embodiment of the present invention, a metal bond pad is formed over circuitry in the semiconductor chip. A metal layer is formed over the circuitry and the metal bond pad, and a diffusion barrier layer is formed between the metal layer and the metal bond pad. In this manner, additional metal can be formed on the pad site using only one additional mask step, and thicker metal at the pad site improves the reliability of the chip by providing for a metal cushion at the pad useful in subsequent wire bonding processes.
    Type: Application
    Filed: June 5, 2001
    Publication date: October 4, 2001
    Applicant: Philips Semiconductors, Inc.
    Inventors: Stephen L. Skala, Subhas Bothra, Emmanuel Demuizon
  • Pad metallization over active circuitry
    Patent number: 6261939
    Abstract: Metal bond pads are formed over active circuitry in a semiconductor chip in a reliable and cost effective manner. According to an example embodiment of the present invention, a metal bond pad is formed over circuitry in the semiconductor chip. A metal layer is formed over the circuitry and the metal bond pad, and a photoresist mask is patterned over the metal layer. The metal layer is etched and the portion of the metal layer not masked with the photoresist is removed. In this manner, additional metal can be formed on the pad site using only one additional mask step, and the thicker metal at the pad site improves the reliability of the chip by providing for a metal cushion at the pad useful in subsequent wire bonding processes.
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: July 17, 2001
    Assignee: Philips Semiconductors, Inc.
    Inventors: Stephen L. Skala, Subhas Bothra, Emmanuel Demuizon