Abstract: A semiconductor package includes a transmissive support plate and includes at least one elongate hole. An integrated circuit semiconductor device is mounted on a rear face of the support plate. The semiconductor device includes first and second optical elements oriented towards the rear face of the support plate, where the first and second optical elements are placed on either side of the elongate hole. An encapsulation material made of an opaque material encapsulates the semiconductor device and fills the elongate hole so as to form an optical insulation partition between the first and second optical elements. A cavity is left, however, between each optical element and a rear face of the support plate.

Abstract: An optical element or module is designed to be placed in front of an optical sensor of a semiconductor component. At least one optically useful part of the element or module is provided through which the image to be captured is designed to pass. A method for obtaining such an optical element or module includes forming at least one through passage between a front and rear faces of the element or module. The front and rear faces are covered with a mask. Ion doping is introduced through the passage. As a result, the element or module has a refractive index that varies starting from a wall of the through passage and into the optically useful part. An image capture apparatus includes an optical imaging module having at least one such element or module.

Abstract: A camera module includes a sensor die, a glass plate, peripheral spacer, an optical element, an outer surface having a shoulder extending in a direction substantially parallel to the sensor die, and a metal layer at least partially covering the outer surface. A method of manufacturing a camera module includes providing an assembly including a sensor dice wafer, a spacer wafer in front of the sensor dice wafer, and an optical element wafer in front of the spacer wafer. The method includes sawing a top cut, using a first saw blade of a first thickness, proceeding in a direction from the optical element wafer toward the sensor dice wafer, stopping before the sensor dice wafer is reached, and sawing a bottom cut, using a second saw blade of a second thickness, proceeding in a direction from the sensor dice wafer toward the optical element wafer.

Abstract: An imaging optical module is designed to be placed in front of an optical image sensor of a semiconductor component. The module includes at least one element which has a refractive index that varies between its optical axis and its periphery, over at least an annular part and/or over its central part. The element may be a tablet in front of the semiconductor sensor or a lens in front of the semiconductor sensor. The direction of variation in refractive index may be oppositely oriented with respect to the table and lens.

Abstract: A semiconductor package includes a transmissive support plate and includes at least one elongate hole. An integrated circuit semiconductor device is mounted on a rear face of the support plate. The semiconductor device includes first and second optical elements oriented towards the rear face of the support plate, where the first and second optical elements are placed on either side of the elongate hole. An encapsulation material made of an opaque material encapsulates the semiconductor device and fills the elongate hole so as to form an optical insulation partition between the first and second optical elements. A cavity is left, however, between each optical element and a rear face of the support plate.

Abstract: An optical die, which is intended to be placed in front of an optical sensor of a semiconductor component, has an optically useful zone having an optical axis and exhibiting a variable refractive index. Specifically the refractive index of the die is variable in an annular peripheral zone lying between a radius Ru enveloping the useful zone and a smaller radius Ro. The index varies as a function of radial distance from a lower value near the smaller radius Ro to a higher value near the radius Ru. The function of the variable refractive index lies between a maximum and minimum profile.

Abstract: A camera module includes a sensor die, a glass plate, peripheral spacer, an optical element, an outer surface having a shoulder extending in a direction substantially parallel to the sensor die, and a metal layer at least partially covering the outer surface. A method of manufacturing a camera module includes providing an assembly including a sensor dice wafer, a spacer wafer in front of the sensor dice wafer, and an optical element wafer in front of the spacer wafer. The method includes sawing a top cut, using a first saw blade of a first thickness, proceeding in a direction from the optical element wafer toward the sensor dice wafer, stopping before the sensor dice wafer is reached, and sawing a bottom cut, using a second saw blade of a second thickness, proceeding in a direction from the sensor dice wafer toward the optical element wafer.

Abstract: A process for fabricating semiconductor devices provides a wafer of integrated circuits, permanently attaches an optical wafer to the wafer of integrated circuits, and temporarily attached a supporting wafer to the optical wafer. The supporting wafer provides structural support during further fabrication processes where a back side of the wafer of integrated circuits is thinned and through silicon vias are formed. The supporting wafer is then removed and the wafer of integrated circuits with the optical wafer is singulated into individual integrated-circuit chips.

Abstract: An optical element or module is designed to be placed in front of an optical sensor of a semiconductor component. At least one optically useful part of the element or module is provided through which the image to be captured is designed to pass. A method for obtaining such an optical element or module includes forming at least one through passage between a front and rear faces of the element or module. The front and rear faces are covered with a mask. Ion doping is introduced through the passage. As a result, the element or module has a refractive index that varies starting from a wall of the through passage and into the optically useful part. An image capture apparatus includes an optical imaging module having at least one such element or module.

Abstract: An optical die, which is intended to be placed in front of an optical sensor of a semiconductor component, has an optically useful zone having an optical axis and exhibiting a variable refractive index. Specifically the refractive index of the die is variable in an annular peripheral zone lying between a radius Ru enveloping the useful zone and a smaller radius Ro. The index is varies as a function of radial distance from a higher value near the smaller radius Ro to a lower value near the radius Ru. The function of the variable refractive index lies between a maximum and minimum profile.

Abstract: An imaging optical module is designed to be placed in front of an optical image sensor of a semiconductor component. The module includes at least one element which has a refractive index that varies between its optical axis and its periphery, over at least an annular part and/or over its central part. The element may be a tablet in front of the semiconductor sensor or a lens in front of the semiconductor sensor. The direction of variation in refractive index may be oppositely oriented with respect to the table and lens.

Abstract: An imaging optical module is designed to be placed in front of an optical image sensor of a semiconductor component. The module includes at least one element which has a refractive index that varies between its optical axis and its periphery, over at least an annular part and/or over its central part. The element may be a tablet in front of the semiconductor sensor or a lens in front of the semiconductor sensor. The direction of variation in refractive index may be oppositely oriented with respect to the table and lens.

Abstract: An optical die, which is intended to be placed in front of an optical sensor of a semiconductor component, has an optically useful zone having an optical axis and exhibiting a variable refractive index. Specifically the refractive index of the die is variable in an annular peripheral zone lying between a radius Ru enveloping the useful zone and a smaller radius Ro. The index is varies as a function of radial distance from a higher value near the smaller radius Ro to a lower value near the radius Ru. The function of the variable refractive index lies between a maximum and minimum profile.

Abstract: An optical die, which is intended to be placed in front of an optical sensor of a semiconductor component, has an optically useful zone having an optical axis and exhibiting a variable refractive index. Specifically the refractive index of the die is variable in an annular peripheral zone lying between a radius Ru enveloping the useful zone and a smaller radius Ro. The index is varies as a function of radial distance from a lower value near the smaller radius Ro to a higher value near the radius Ru. The function of the variable refractive index lies between a maximum and minimum profile.

Abstract: An imaging optical module is designed to be placed in front of an optical image sensor of a semiconductor component. The module includes at least one element which has a refractive index that varies between its optical axis and its periphery, over at least an annular part and/or over its central part. The element may be a tablet in front of the semiconductor sensor or a lens in front of the semiconductor sensor. The direction of variation in refractive index may be oppositely oriented with respect to the table and lens.

Abstract: An optical unit including a glass substrate supporting a diaphragm intended to receive a lens with a circular base, the surface of the diaphragm having one or several protruding elements for guiding the lens in horizontal positioning, and its manufacturing method.

Abstract: An optical device includes a stack having a transparent block with a rear face fixed on a front face of an integrated chip support. A front face of the transparent block that is parallel to its rear face is affixed to a rear face of a converging lens. The lens has a convex frontal surface. A diaphragm is interposed and fixed between the block and the lens. A housing for the optical device is made of an opaque material. A peripheral wall of the housing encloses the stack. An annular front part of the peripheral wall bears on a periphery of the convex frontal surface of the lens so as to define a frontal opening located in front of a central part of the lens.

Abstract: An optical package for integrated circuit chips including optical microsensors and its manufacturing method, an encapsulation resin thickness smaller than the thickness provided straight above connecting wires being provided at least straight above the microsensors between the upper surface of the chip and a substrate supporting it.

Abstract: An optical unit including a glass substrate supporting a diaphragm intended to receive a lens with a circular base, the surface of the diaphragm having one or several protruding elements for guiding the lens in horizontal positioning, and its manufacturing method.

Abstract: An optical device includes a stack having a transparent block with a rear face fixed on a front face of an integrated chip support. A front face of the transparent block that is parallel to its rear face is affixed to a rear face of a converging lens. The lens has a convex frontal surface. A diaphragm is interposed and fixed between the block and the lens. A housing for the optical device is made of an opaque material. A peripheral wall of the housing encloses the stack. An annular front part of the peripheral wall bears on a periphery of the convex frontal surface of the lens so as to define a frontal opening located in front of a central part of the lens.