Patents by Inventor En-Jou Hsiao

En-Jou Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8703410
    Abstract: The present invention relates to a CO2 laser-transparent material having a mark on the surface thereof and the method for making the same. The method includes the following steps: providing a first substrate, which has a top surface and a bottom surface; providing a second substrate which has a top surface; putting the bottom surface of the first substrate on the top surface of the second substrate; irradiating a CO2 laser beam to the top surface of the second substrate by passing through the top surface and the bottom surface of the first substrate; and forming a mark on the bottom surface of the first substrate. The material of the mark is oxide of the second substrate or the same as the material of the second substrate. Whereby the cheap CO2 laser is utilized to form the mark on the first substrate, and the mark can be erased easily by a proper chemical for recycling the first substrate.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: April 22, 2014
    Assignee: National Cheng Kung University
    Inventors: Chen-Kuei Chung, Meng-Yu Wu, En-Jou Hsiao, Shih-Lung Lin
  • Publication number: 20140017463
    Abstract: The present invention relates to a CO2 laser-transparent material having a mark on the surface thereof and the method for making the same. The method includes the following steps: providing a first substrate, which has a top surface and a bottom surface; providing a second substrate which has a top surface; putting the bottom surface of the first substrate on the top surface of the second substrate; irradiating a CO2 laser beam to the top surface of the second substrate by passing through the top surface and the bottom surface of the first substrate; and forming a mark on the bottom surface of the first substrate. The material of the mark is oxide of the second substrate or the same as the material of the second substrate. Whereby the cheap CO2 laser is utilized to form the mark on the first substrate, and the mark can be erased easily by a proper chemical for recycling the first substrate.
    Type: Application
    Filed: September 11, 2013
    Publication date: January 16, 2014
    Applicant: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Chen-Kuei CHUNG, Meng-Yu WU, En-Jou HSIAO, Shih-Lung LIN
  • Patent number: 8557715
    Abstract: The present invention relates to a CO2 laser-transparent material having a mark on the surface thereof and the method for making the same. The method includes the following steps: providing a first substrate, which has a top surface and a bottom surface; providing a second substrate which has a top surface; putting the bottom surface of the first substrate on the top surface of the second substrate; irradiating a CO2 laser beam to the top surface of the second substrate by passing through the top surface and the bottom surface of the first substrate; and forming a mark on the bottom surface of the first substrate. The material of the mark is oxide of the second substrate or the same as the material of the second substrate. Whereby the cheap CO2 laser is utilized to form the mark on the first substrate, and the mark can be erased easily by a proper chemical for recycling the first substrate.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: October 15, 2013
    Assignee: National Cheng Kung University
    Inventors: Chen-Kuei Chung, Meng-Yu Wu, En-Jou Hsiao, Shih-Lung Lin
  • Publication number: 20100308441
    Abstract: The present invention relates to a CO2 laser-transparent material having a mark on the surface thereof and the method for making the same. The method includes the following steps: providing a first substrate, which has a top surface and a bottom surface; providing a second substrate which has a top surface; putting the bottom surface of the first substrate on the top surface of the second substrate; irradiating a CO2 laser beam to the top surface of the second substrate by passing through the top surface and the bottom surface of the first substrate; and forming a mark on the bottom surface of the first substrate. The material of the mark is oxide of the second substrate or the same as the material of the second substrate. Whereby the cheap CO2 laser is utilized to form the mark on the first substrate, and the mark can be erased easily by a proper chemical for recycling the first substrate.
    Type: Application
    Filed: July 19, 2010
    Publication date: December 9, 2010
    Inventors: Chen-Kuei CHUNG, Meng-Yu Wu, En-Jou Hsiao, Shih-Lung Lin
  • Publication number: 20080009093
    Abstract: The present invention relates to a silicon material having a mark on the surface thereof and the method for making the same. The method comprises the following steps: (a) providing a silicon material; (b) providing a glass substrate; (c) putting the silicon material on the glass substrate; and (d) focusing a CO2 laser beam on the silicon material as to form a mark on the bottom surface of the silicon material, wherein the material of the mark is silicon oxide. Whereby the cheap CO2 laser is utilized to form the mark on the silicon material, and the mark can be erased easily by a proper chemical for recycling the silicon material.
    Type: Application
    Filed: March 20, 2007
    Publication date: January 10, 2008
    Inventors: Chen-Kuei Chung, Meng-Yu Wu, En-Jou Hsiao