Patents by Inventor Eng Goh

Eng Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8847002
    Abstract: An absorbent article that contains a topsheet having embossed regions is provided. The embossed regions propagate in a longitudinal direction of the article in the form of a wave having one or more alternating crests (peaks) and troughs (valleys). Such a wave pattern helps slow down the flow of bodily fluid by directing it along a tortuous path defined by the densified edges rather than in a straight line. Among other things, this reduction in flow rate can help provide sufficient time for the absorbent core to absorb the fluid, which is particularly helpful when it is already partially filled with fluid. Nevertheless, bodily fluids can still sometimes pool near the crests and/or troughs and result in leakage. To help counteract this tendency, the present inventors have discovered that a plurality of apertures can be employed in the topsheet that are arranged in a column that generally extends in a longitudinal direction of the article.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: September 30, 2014
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Priscilla Goh Eng Goh, YeinSze Ong, Meijia Ng, SangWook Lee, DooHong Kim, Franz Aschenbrenner
  • Publication number: 20070241492
    Abstract: Various embodiments and methods relating to a booklet maker are disclosed.
    Type: Application
    Filed: April 12, 2006
    Publication date: October 18, 2007
    Inventors: Abdolreza Movagher, Miquel Busquets, Eng Goh
  • Publication number: 20070164438
    Abstract: Embodiments include interconnect of electrically conductive material with a contact surface, and a dielectric layer overlying the contact surface with a trench and via in the dielectric layer, the via extending to the contact surface. An interlock material is in the via with an interlock opening extending through the interlock material and into the interconnect. A layer of electroless material is on the base of the trench and the surfaces of the via, interlock material, and interlock opening. An subsequent interconnect is formed on the electroless material, in the trench, via, and interlock openings. The structure can be repeated to form a stack or column of interconnects that resist delamination.
    Type: Application
    Filed: March 8, 2007
    Publication date: July 19, 2007
    Inventors: Jiun Sir, Eng Goh
  • Publication number: 20070102817
    Abstract: A method and apparatus is provided that pertains to resisting crack initiation and propagation in electrical interconnections between components and substrates in ball grid array microelectronic packages. A hybrid of dielectric defined and non-dielectric defined electrical interconnects reduces the potential for electrical interconnection failure without having to control the dielectric defined interconnect ratio of substrates. In addition selective orientation of the dielectric defined edge portion of the electrical interconnect away from the point where cracks initiate resists crack propagation and component failure.
    Type: Application
    Filed: December 26, 2006
    Publication date: May 10, 2007
    Inventors: Cheng Tay, Swee Cheng, Eng Goh
  • Publication number: 20060170148
    Abstract: This invention relates to an input tray media de-slouch apparatus, comprising; an input media tray, at least one pivotable media de-slouch arm operatively connected to the tray, and a releasable locking means operatively connected to the arm and the tray to lock the arm prior to media being placed against the arm to substantially keep the media from slouching and to release the arm when the media is being fed from the input tray.
    Type: Application
    Filed: January 31, 2005
    Publication date: August 3, 2006
    Inventors: Eng Goh, Mark Sutherland, Minh Duong, Danny Codd
  • Publication number: 20060022341
    Abstract: Embodiments include interconnect of electrically conductive material with a contact surface, and a dielectric layer overlying the contact surface with a trench and via in the dielectric layer, the via extending to the contact surface. An interlock material is in the via with an interlock opening extending through the interlock material and into the interconnect. A layer of electroless material is on the base of the trench and the surfaces of the via, interlock material, and interlock opening. An subsequent interconnect is formed on the electroless material, in the trench, via, and interlock openings. The structure can be repeated to form a stack or column of interconnects that resist delamination.
    Type: Application
    Filed: July 28, 2004
    Publication date: February 2, 2006
    Inventors: Jiun Sir, Eng Goh
  • Publication number: 20050104898
    Abstract: A method and apparatus for processing a primitive for potential display on a display device (having a plurality of pixels) determines if the primitive intersects at least a predetermined number of pixel fragments on the display device. The predetermined number is no less than one. The method and apparatus then cull the primitive as a function of whether the primitive intersects at least the predetermined number of pixel fragments. If it is culled, the primitive is not raster processed (i.e., not subjected to raster processing, whether or not complete).
    Type: Application
    Filed: November 18, 2003
    Publication date: May 19, 2005
    Inventors: Stephen Moffitt, Eng Goh