Abstract: A method for producing a pharmaceutical dose form includes depositing a measured quantity of a first coating material on an external surface of the dose form in a patterned configuration. A measured quantity of a second coating material is deposited on the surface of the dose form in a patterned configuration in relationship to the first coating material. The first and second coating materials form a coating layer in overlying relationship with at least a portion of the external surface of the dose form.

Abstract: A microtray for handling biosubstances comprises a fluid holding structure and a fluid ejection structure. The fluid holding structure includes an array of wells with each well configured to contain at least one biosubstance. The fluid ejection structure is in communication with the fluid holding structure and configured to dispense the at least one biosubstance onto a target media.

Abstract: A blister packaging production line preferably includes an unmarked supply of backing for blister packaging, a printer for selectively printing on the backing and a host system controlling the printer and providing a variety of desired designs to the printer. The design being printed on the backing can be changed on-demand by transmitting a new design from the host system to the printer. Additionally, a blister packaging production line may include an unmarked supply of material backing for blister packaging, a printer for selectively printing on the material and a shaping device for forming recesses in the material that will receive items being blister packaged. The printed design can be of any desired length.

Abstract: A blister packaging production line preferably includes an unmarked supply of backing for blister packaging, a printer for selectively printing on the backing and a host system controlling the printer and providing a variety of desired designs to the printer. The design being printed on the backing can be changed on-demand by transmitting a new design from the host system to the printer. Additionally, a blister packaging production line may include an unmarked supply of material backing for blister packaging, a printer for selectively printing on the material and a shaping device for forming recesses in the material that will receive items being blister packaged. The printed design can be of any desired length.

Abstract: A temporary chip attach (TCA) structure is made with two layers of thin films. The first layer contains capture pads to capture the positional error of the underlying chip carrier vias. The second layer contains smaller TCA pads of exposed metal which are accurately aligned to the grid of the chip BLM, as well as appropriate alignment features for use by a chip automatic placement tool.

Abstract: A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate.