Abstract: A component includes a component body and a contact-connection element composed of sheet metal having a contact region, which has an outer contour line and at least one hole. The contact region is arranged on a side of the component body having a side edge and the outer contour line has straight regions running along straight regions of the side edge. The straight regions of the outer contour line are connected by rounded corners.

Abstract: The present invention relates to a component (BE) which has a first duplexer operating with acoustic waves and a second duplexer operating with acoustic waves, wherein the first and second duplexers are arranged in a single SMD housing. In addition, the invention relates to a module (MO), which interconnects such a component (BE) and at least three 90° hybrids (HYB1-HYB3) to form an enhanced duplexer. A further aspect of the invention relates to a 2in1 hybrid, in which two 90° hybrids (HYB3, HYB4) or one 90° hybrid (HYB3) and one 180° hybrid (BAL) are arranged on a single chip.