Patents by Inventor Eri MASUDA

Eri MASUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240157164
    Abstract: In order to provide a technical means that offers excellent convenience, usability, and safety for stellate ganglion block that can effectively suppress sympathetic overexcitation, this stellate ganglion magnetic stimulation device comprises: a head unit having a magnet for generating magnetism; and a neck unit that is removably worn around a wearer's neck and that presses the head unit against epidermis corresponding to the stellate ganglion so that stimulation by the magnetism acts on the stellate ganglion.
    Type: Application
    Filed: March 25, 2022
    Publication date: May 16, 2024
    Inventors: Masakazu YAGI, Yoshiki SAWA, Hirotada MASUDA, Kotaro YOSHIDA, Fumito MINAKAMI, Eri KANEDA
  • Patent number: 11938305
    Abstract: A syringe assembly includes a plate-shaped seal member that seals a distal opening of a distal nozzle portion of a syringe; and a tubular cover member. The cover member has a base portion and a mounting portion. The mounting portion has two claw portions, two first column portions arranged on both sides of one of the two claw portions, and two second column portions arranged on both sides of the other of the two claw portions. An outer peripheral portion of the mounting portion has two outer peripheral notch portions. An inner peripheral portion of the mounting portion has two inner peripheral recessed portions.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: March 26, 2024
    Assignee: TERUMO KABUSHIKI KAISHA
    Inventors: Manabu Arinobe, Yusuke Hyakkan, Eri Oya, Taeko Masuda, Junichi Ogawa, Yoichiro Iwase
  • Patent number: 11884813
    Abstract: There is provided an epoxy resin composition comprising a (meth)acrylic copolymer (A), an epoxy resin (B), and a curing agent (C), wherein the (meth)acrylic copolymer (A) has a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), and wherein a glass transition temperature (TgB) of a polymer obtained by polymerizing only the vinyl monomer (b) is 25° C. or less.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: January 30, 2024
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Eri Masuda, Junichi Nakamura, Kazuyoshi Odaka, Sora Tomita, Go Otani
  • Patent number: 11421065
    Abstract: Provided are an adhesive resin composition capable of forming an adhesive layer excellent in holding force, wet heat clouding resistance, and low corrosiveness; and an adhesive sheet. The adhesive resin composition includes a (meth)acrylic copolymer (A) having a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), in which the (meth)acrylic copolymer (A) has at least one of an amide bond and a radical polymerizable group.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: August 23, 2022
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Eri Masuda, Junichi Nakamura, Kazuyoshi Odaka, Hiroko Shinada
  • Publication number: 20200199352
    Abstract: There is provided an epoxy resin composition comprising a (meth)acrylic copolymer (A), an epoxy resin (B), and a curing agent (C), wherein the (meth)acrylic copolymer (A) has a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), and wherein a glass transition temperature (TgB) of a polymer obtained by polymerizing only the vinyl monomer (b) is 25° C. or less.
    Type: Application
    Filed: March 2, 2020
    Publication date: June 25, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Eri MASUDA, Junichi NAKAMURA, Kazuyoshi ODAKA, Sora TOMITA, Go OTANI
  • Patent number: 10479855
    Abstract: A (meth)acrylic acid copolymer (A) having a weight average molecular weight of 1000 to 1,000,000, and in which when the half-width of the primary scatter peak when measured by small angle X-ray scattering is defined as X, 0.12<X, is used as an adhesive. The (meth)acrylic copolymer (A) is obtained by polymerizing a monomer mixture containing a macromonomer (a) having a number average molecular weight of 500-100,000, and a vinyl monomer (b). The adhesive has sufficient holding force and adhesive force, and the occurrence of adhesive deposit can be prevented when peeled off.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: November 19, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Eri Masuda, Junichi Nakamura, Hiroko Shinada, Takayuki Kobayashi
  • Publication number: 20190276717
    Abstract: Provided are an adhesive resin composition capable of forming an adhesive layer excellent in holding force, wet heat clouding resistance, and low corrosiveness; and an adhesive sheet. The adhesive resin composition includes a (meth)acrylic copolymer (A) having a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), in which the (meth)acrylic copolymer (A) has at least one of an amide bond and a radical polymerizable group.
    Type: Application
    Filed: May 28, 2019
    Publication date: September 12, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Eri MASUDA, Junichi NAKAMURA, Kazuyoshi ODAKA, Hiroko SHINADA
  • Publication number: 20180142055
    Abstract: A (meth)acrylic acid copolymer (A) having a weight average molecular weight of 1000 to 1,000,000, and in which when the half-width of the primary scatter peak when measured by small angle X-ray scattering is defined as X, 0.12<X, is used as an adhesive. The (meth)acrylic copolymer (A) is obtained by polymerizing a monomer mixture containing a macromonomer (a) having a number average molecular weight of 500-100,000, and a vinyl monomer (b). The adhesive has sufficient holding force and adhesive force, and the occurrence of adhesive deposit can be prevented when peeled off.
    Type: Application
    Filed: June 1, 2016
    Publication date: May 24, 2018
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Eri MASUDA, Junichi NAKAMURA, Hiroko SHINADA, Takayuki KOBAYASHI