Patents by Inventor Eric A. Eckstein
Eric A. Eckstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230242282Abstract: Stacked satellite dispensing systems are described herein. The disclosed systems have diagonal struts that stabilize satellite stacks horizontally and vertically without adding performance-reducing mass. The diagonal struts increase the number of bracing points and improve stability. The improved stability can allow for the satellite stack to be made heavier and taller, such as by having more satellites than a dispensing system with vertical struts. The diagonal struts, which provide the improved stability, can also allow for sub-stacks to be used. The sub-stacks include batches of satellites retained by the stacked satellite dispensing system. Therefore, the stacked satellite dispending system can release single satellites batches at once, rather than all the satellites at once.Type: ApplicationFiled: April 6, 2023Publication date: August 3, 2023Inventor: Eric Eckstein
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Patent number: 11649074Abstract: Stacked satellite dispensing systems are described herein. The disclosed systems have diagonal struts that stabilize satellite stacks horizontally and vertically without adding performance-reducing mass. The diagonal struts increase the number of bracing points and improve stability. The improved stability can allow for the satellite stack to be made heavier and taller, such as by having more satellites than a dispensing system with vertical struts. The diagonal struts, which provide the improved stability, can also allow for sub-stacks to be used. The sub-stacks include batches of satellites retained by the stacked satellite dispensing system. Therefore, the stacked satellite dispending system can release single satellites batches at once, rather than all the satellites at once.Type: GrantFiled: August 12, 2021Date of Patent: May 16, 2023Assignee: BLUE ORIGIN, LLCInventor: Eric Eckstein
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Patent number: 8099335Abstract: A method for determining billing information for a tag application process for billing a customer using the tag application process, includes the steps of determining a cost component of said tag fabrication process and determining billing information in accordance with said cost component. The customer is billed in accordance with said determined billing information.Type: GrantFiled: November 29, 2004Date of Patent: January 17, 2012Assignee: Checkpoint Systems, Inc.Inventors: Eric Eckstein, Andre Cote
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Patent number: 7856708Abstract: A process for forming a portion of a package or envelope bearing printed indicia, a label bearing printed indicia or a sheet bearing printed indicia includes providing a substrate which constitutes a portion of the package, label or sheet to a printing apparatus, and utilizing the printing apparatus or an adjunct to the printing apparatus to form at least one electrically conductive component of an EAS and/or RFID tag on the substrate substantially contemporaneously with the printing of the indicia on the substrate. The forming of the electrically conductive component on the substrate is accomplished slightly prior to the printing of the indicia on the substrate, slightly after the printing of the indicia on the substrate and at the same time as the printing of the indicia on the substrate.Type: GrantFiled: September 18, 2006Date of Patent: December 28, 2010Assignee: Checkpoint Systems, Inc.Inventors: Eric Eckstein, Andre Cote
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Publication number: 20100218899Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.Type: ApplicationFiled: April 13, 2010Publication date: September 2, 2010Applicant: CHECKPOINT SYSTEMS, INC.Inventors: Thomas J. Clare, Andre Cote, Eric Eckstein
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Patent number: 7709294Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.Type: GrantFiled: June 24, 2005Date of Patent: May 4, 2010Assignee: Checkpoint Systems, Inc.Inventors: Thomas J. Clare, Andre Cote, Eric Eckstein
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Publication number: 20100052865Abstract: A multiple frequency detection system allows the seamless integration of an almost ideal EAS function with an RFID function. While not being limited to a particular theory, the preferred embodiments integrate EAS technology at, for example, 8.2 MHz or 14 MHz, and RFID technology at, for example, 13.56 MHz in a common antenna package. The use of standard RFID frequencies as forcing functions will allow for the easy packaging of EAS with RFID and have a true roadmap of a scalable technology.Type: ApplicationFiled: November 12, 2009Publication date: March 4, 2010Applicant: CHECKPOINT SYSTEMS, INC.Inventor: Eric Eckstein
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Patent number: 7642915Abstract: A multiple frequency detection system allows the seamless integration of an almost ideal EAS function with an RFID function. While not being limited to a particular theory, the preferred embodiments integrate EAS technology at, for example, 8.2 MHz or 14 MHz, and RFID technology at, for example, 13.56 MHz in a common antenna package. The use of standard RFID frequencies as forcing functions will allow for the easy packaging of EAS with RFID and have a true roadmap of a scalable technology.Type: GrantFiled: January 17, 2006Date of Patent: January 5, 2010Assignee: Checkpoint Systems, Inc.Inventor: Eric Eckstein
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Patent number: 7489285Abstract: A stowable antenna system for a security system is providing which includes an electronic radiating element in the form of a furlable flexible sheet, a power supply to power the electronic radiating element and a housing to receive and store the radiating element in a furled condition. The radiating element may be extended to an unfurled condition for use in the security system. One or more risers may extend from the housing for supporting the radiating element in the unfurled condition. The electronic radiating element may be received in the housing and stored in the housing in a rolled up, windowshade configuration.Type: GrantFiled: October 18, 2005Date of Patent: February 10, 2009Assignee: Checkpoint Systems, Inc.Inventors: Eric Eckstein, Michael Rapp
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Patent number: 7384496Abstract: A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.Type: GrantFiled: November 24, 2004Date of Patent: June 10, 2008Assignee: Checkpoint Systems, Inc.Inventors: Andre Cote, Eric Eckstein, Thomas J. Clare
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Patent number: 7368033Abstract: A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.Type: GrantFiled: April 6, 2006Date of Patent: May 6, 2008Assignee: Checkpoint Systems, Inc.Inventors: Eric Eckstein, Andre Cote
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Publication number: 20070146985Abstract: Embodiments of systems include a capsule that houses one or more peripheral devices, such as radios, capable of being used with hand-held computing devices such as RFID tag readers. A receptacle can be mounted on the hand-held computing device. The receptacle receives the capsule. Electrical connectors on the capsule and the receptacle mate when the receptacle is received by the receptacle, to electrically connect the peripheral device and the hand-held computing device. A seal is provided to prevent infiltration of water, dust, and other contaminates into the electrical connectors. A portion of the capsule is exposed when the capsule is located in the receptacle, to accommodate external antennas, connectors, optical ports, etc. that may be required by the peripheral device.Type: ApplicationFiled: August 31, 2006Publication date: June 28, 2007Applicant: Two Technologies, IncInventors: Roger Mick, Vincent Turco, Michael Walsh, Daniel Dolan, Eric Eckstein
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Publication number: 20070113966Abstract: A process for forming a portion of a package or envelope bearing printed indicia, a label bearing printed indicia or a sheet bearing printed indicia includes providing a substrate which constitutes a portion of the package, label or sheet to a printing apparatus, and utilizing the printing apparatus or an adjunct to the printing apparatus to form at least one electrically conductive component of an EAS and/or RFID tag on the substrate substantially contemporaneously with the printing of the indicia on the substrate. The forming of the electrically conductive component on the substrate is accomplished slightly prior to the printing of the indicia on the substrate, slightly after the printing of the indicia on the substrate and at the same time as the printing of the indicia on the substrate.Type: ApplicationFiled: September 18, 2006Publication date: May 24, 2007Applicant: CHECKPOINT SYSTEMS, INC.Inventors: Eric Eckstein, Andre Cote
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Patent number: 7187289Abstract: A system is disclosed for detecting the presence of an article. The system includes a transmitter for radiating a first electromagnetic signal at a predetermined primary frequency and a resonant tag secured to the article. The resonant tag generates a second electromagnetic signal in response to receiving the first electromagnetic signal. The second electromagnetic signal has components at the primary frequency and at a predetermined secondary frequency different from the primary frequency. The system also includes a receiver for receiving the second electromagnetic signal and a computer connected to an output of the receiver. The computer processes the received second electromagnetic signal and generates an output signal when the secondary frequency is detected in the second electromagnetic signal.Type: GrantFiled: May 6, 2005Date of Patent: March 6, 2007Assignee: Checkpoint Systems, Inc.Inventors: Eric Eckstein, John D. Paranzino, Nimesh Shah
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Patent number: 7168150Abstract: A method of making a resonant frequency tag which resonates at a predetermined frequency. The method involves providing a first conductive pattern having an inductive element and a first land and a second conductive pattern having a second land and a third land which are joined together by a link. The second conductive pattern is overlaid the first conductive pattern such that the second land is positioned over the first land. The third land is in electrical communication with the inductive element of the first conductive pattern. The formed resonant frequency tag is energized to determine if the tag resonates at the predetermined frequency. If the tag resonates properly, the third land is electrically coupled to the inductive element. If it does not, the second conductive pattern is adjusted so that overlapping portions of the first and second lands are changed, altering the capacitance to adjust the resonant tag frequency.Type: GrantFiled: October 19, 2004Date of Patent: January 30, 2007Assignee: Checkpoint Systems, Inc.Inventors: Eric Eckstein, Gary Mazoki, Peter Lendering, Luis Francisco Soler Bonnin, Takeshi Matsumoto, Lawrence Appalucci
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Patent number: 7119685Abstract: A circuit element the presence of the circuit element includes first and second capacitor plates disposed over the surface of the substrate in an aligned relationship with each other. The aligned relationship has manufacturing variations in the relative positioning of the first and second capacitor plates and a dielectric layer disposed between the first and second capacitor plates. At least one of the first and second capacitor plates is formed substantially smaller relative to the other of the first and second capacitor plates. The at least one of the capacitor plates is disposed at a predetermined offset in at least one planar direction from an edge of the other of the first and second capacitor plates. The predetermined offset is selected according to the manufacturing variations to prevent variations in the value of capacitance of the capacitor due to the manufacturing variations.Type: GrantFiled: November 29, 2004Date of Patent: October 10, 2006Assignee: Checkpoint Systems, Inc.Inventors: Eric Eckstein, Andre Cote
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Patent number: 7116227Abstract: A tag having a substrate having a surface with a preformed first patterned adhesive disposed over the surface thereof and a first layer of electrically conductive material having a shape corresponding to a desired final pattern for a first electrically conductive trace secured to the surface of the substrate. The preformed first patterned adhesive corresponds to the desired final pattern. A second patterned adhesive is disposed over a portion of a surface area of the tag. An electrically conductive trace is disposed over the second patterned adhesive to adhere the second electrically conductive trace thereto. An electrical connection is provided for electrically coupling portions of the first and second electrically conductive traces to form a tag circuit. The tag circuit can be an LC resonant circuit. The preformed first patterned adhesive can be a flexographic printed layer.Type: GrantFiled: November 24, 2004Date of Patent: October 3, 2006Assignee: Checkpoint Systems, Inc.Inventors: Eric Eckstein, Andre Cote
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Publication number: 20060185790Abstract: A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.Type: ApplicationFiled: April 6, 2006Publication date: August 24, 2006Inventors: Eric Eckstein, Andre Cote
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Publication number: 20060175003Abstract: A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.Type: ApplicationFiled: April 6, 2006Publication date: August 10, 2006Inventors: Eric Eckstein, Andre Cote
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Patent number: 7081818Abstract: A tracking system uses RFID (radio frequency identification) tag technology to facilitate the identification and tracking of items in an environment through a technique known as shadowing. As an object or target moves within a pre-described detection zone with communicating antenna and RFID sensors, the object or target blocks the line of sight between respective antenna and sensors, preventing electromagnetic coupling between the sensor and the antenna and thus casting an electromagnetic shadow along the line of sight. One approach of this invention uses this shadow technique to perform functions such as theft (shrink) deterrence/detection; tracking the motion of objects through an environment by monitoring the shadow; and correlation analysis of people shadows to tagged items (e.g., merchandise, articles) to foster marketing and merchandizing effectiveness.Type: GrantFiled: May 17, 2004Date of Patent: July 25, 2006Assignee: Checkpoint Systems, Inc.Inventors: Eric Eckstein, Gary T. Mazoki, William S. Richie, Jr.