Patents by Inventor Eric D. Baldwin

Eric D. Baldwin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular antenna array system with thermal management
    Patent number: 10694637
    Abstract: An antenna assembly includes a plurality of RF card assemblies, a backplane circuit board, a plurality of connectors, and a chassis. Each of the RF card assemblies includes a circuit board having a number of antenna elements. The backplane circuit board includes a top surface with at least one set of power supply rails. The connectors are arranged in rows along a top surface of the backplane circuit board. Each of the connectors has an inlet configured to receive one of the RF card assemblies along a plane perpendicular to the top surface of the backplane circuit board. The bottom surface includes power supply pins configured to engage the power supply rails. The chassis is configured to enclose the backplane circuit board, the RF card assemblies, and the connectors.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: June 23, 2020
    Assignee: Rockwell Collins, Inc.
    Inventors: Jeremiah D. Wolf, Scott J. Sellner, James B. West, Eric D. Baldwin