Patents by Inventor Eric D. McAfee
Eric D. McAfee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240172393Abstract: Methods and apparatus for immersion cooling systems are disclosed herein. An example apparatus includes a base plate, fins extending from the base plate, a tube extending along an axis through the fins, the tube including an inlet, and a slot extending along the axis, the inlet, the slot, and the fins sequentially defining a flow pathway.Type: ApplicationFiled: January 31, 2024Publication date: May 23, 2024Inventors: Sandeep Ahuja, Yang Yao, Ming Zhang, Yuehong Fan, Xiang Que, Mark MacDonald, Casey Jamesen Carte, Yue Yang, Eric D. McAfee, Satyam Saini, Suchismita Sarangi, Drew Damm, Jessica Gullbrand
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Publication number: 20240063082Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.Type: ApplicationFiled: October 31, 2023Publication date: February 22, 2024Inventors: Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja, Eric D. McAfee, Jeffory L. Smalley, Minh T.D. Le, Ralph V. Miele, Marc Milobinski, Aaron P. Anderson, Brendan T. Pavelek, Carlos Alvizo Flores, Fernando Gonzalez Lenero
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Patent number: 11842943Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.Type: GrantFiled: August 5, 2020Date of Patent: December 12, 2023Assignee: INTEL CORPORATIONInventors: Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja, Eric D. McAfee, Jeffory L. Smalley, Minh T. D. Le, Ralph V. Miele, Marc Milobinski, Aaron P. Anderson, Brendan T. Pavelek, Fernando Gonzalez Lenero, Carlos Alvizo Flores
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Publication number: 20230309262Abstract: An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.Type: ApplicationFiled: May 31, 2023Publication date: September 28, 2023Applicant: Intel CorporationInventors: Liguang DU, Guangying ZHANG, Shaorong ZHOU, David PIDWERBECKI, Chuanlou WANG, Sandeep AHUJA, Mark MACDONALD, Sung Ki KIM, Xiang QUE, Haifeng GONG, Jessica GULLBRAND, Drew DAMM, Eric D. MCAFEE, Suchismita SARANGI
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Patent number: 11557529Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.Type: GrantFiled: March 30, 2018Date of Patent: January 17, 2023Assignee: Intel CorporationInventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
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Patent number: 11184997Abstract: Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.Type: GrantFiled: April 23, 2018Date of Patent: November 23, 2021Assignee: Intel CorporationInventors: Joseph Andrew Broderick, Barrett M. Faneuf, Eric D. McAfee, Juan G. Cevallos, Jaime A. Sanchez, Emery E. Frey
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Publication number: 20210043537Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.Type: ApplicationFiled: August 5, 2020Publication date: February 11, 2021Inventors: Barrett M. FANEUF, Phil GENG, Kenan ARIK, David SHIA, Casey WINKEL, Sandeep AHUJA, Eric D. MCAFEE, Jeffory L. SMALLEY, Minh T.D. LE, Ralph V. MIELE, Marc MILOBINSKI, Aaron P. ANDERSON, Brendan T. PAVELEK
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Publication number: 20190304870Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.Type: ApplicationFiled: March 30, 2018Publication date: October 3, 2019Applicant: Intel CorporationInventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
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Publication number: 20190045661Abstract: Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.Type: ApplicationFiled: April 23, 2018Publication date: February 7, 2019Inventors: Joseph Andrew Broderick, Barrett M. Faneuf, Eric D. McAfee, Juan G. Cevallos, Jaime A. Sanchez, Emery E. Frey
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Patent number: 10188931Abstract: Briefly, in accordance with one or more embodiments, a smart base for a baseball system or a softball system comprises a sensor to detect a first time at which a runner has touched the smart base, a radio-frequency (RF) receiver to receive a signal from a smart baseball that indicates a second time at which the smart baseball was caught, timing circuitry to detect if the second time occurs before or after the first time; and indicator circuitry to indicate a force out if the second time occurs before the first time.Type: GrantFiled: July 1, 2016Date of Patent: January 29, 2019Assignee: Intel CorporationInventors: Andrew Larson, Mark E. Sprenger, Ralph V. Miele, Eric D. McAfee, Mark MacDonald
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Publication number: 20180058777Abstract: Apparatuses and methods associated with heat exchanger puck design are disclosed herein. In embodiments, a heat exchanger puck may include a first plate with a cavity that extends into the first plate from a side of the first plate and a second plate. The second plate may be coupled to the side of the first plate, with the cavity located between the first plate and the second plate. The heat exchanger puck may further include a tube of a liquid coolant system located, at least partially, within the cavity, the tube formed to fit the cavity created by the first plate and the second plate. Other embodiments may be described and/or claimed.Type: ApplicationFiled: November 22, 2016Publication date: March 1, 2018Inventors: AARON P. ANDERSON, JOSEPH A. BRODERICK, BARRETT M. FANEUF, ERIC D. MCAFEE, BRIAN S. JARRETT, JUAN G. CEVALLOS, PEI-FANG SUNG, EMERY E. FREY
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Publication number: 20180001179Abstract: Briefly, in accordance with one or more embodiments, a smart base for a baseball system or a softball system comprises a sensor to detect a first time at which a runner has touched the smart base, a radio-frequency (RF) receiver to receive a signal from a smart baseball that indicates a second time at which the smart baseball was caught, timing circuitry to detect if the second time occurs before or after the first time; and indicator circuitry to indicate a force out if the second time occurs before the first time.Type: ApplicationFiled: July 1, 2016Publication date: January 4, 2018Applicant: Intel CorporationInventors: Andrew Larson, Mark E. Sprenger, Ralph V. Miele, Eric D. McAfee, Mark MacDonald
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Patent number: 9721871Abstract: Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.Type: GrantFiled: December 3, 2015Date of Patent: August 1, 2017Assignee: Intel CorporationInventors: Emery E. Frey, Eric D. McAfee, Shankar Krishnan, Juan G. Cevallos, Roger D. Flynn
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Publication number: 20170162475Abstract: Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.Type: ApplicationFiled: December 3, 2015Publication date: June 8, 2017Inventors: Emery E. Frey, Eric D. McAfee, Shankar Krishnan, Juan G. Cevallos, Roger D. Flynn
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Patent number: 9606589Abstract: Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.Type: GrantFiled: November 29, 2011Date of Patent: March 28, 2017Assignee: Intel CorporationInventors: Mark J. Gallina, Jason B. Chesser, Mike G. Macgregor, Mark J. Luckeroth, Brian S. Jarrett, Thu Huynh, Eric D. Mcafee, Barrett M. Faneuf, Michelle Goeppinger
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Patent number: 9433132Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.Type: GrantFiled: August 8, 2014Date of Patent: August 30, 2016Assignee: Intel CorporationInventors: Shankar Krishnan, Eric D. McAfee, Tod A. Byquist
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Publication number: 20160044833Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.Type: ApplicationFiled: August 8, 2014Publication date: February 11, 2016Inventors: Shankar Krishnan, Eric D. McAfee, Tod A. Byquist
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Publication number: 20150234437Abstract: Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.Type: ApplicationFiled: November 29, 2011Publication date: August 20, 2015Inventors: Mark J. Gallina, Jason B. Chesser, Mike G. Macgregor, Mark J. Luckeroth, Brian S. Jarrett, Thu Huynh, Eric D. Mcafee, Barrett M. Faneuf, Michelle Goeppinger
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Patent number: 7237333Abstract: A method and apparatus for holding a screw captive to a printed circuit board (PCB), with a channel formed through the apparatus and a mounting hole formed through the PCB being in alignment to allow a screw to pass therethrough.Type: GrantFiled: January 25, 2005Date of Patent: July 3, 2007Assignee: Intel CorporationInventor: Eric D. McAfee
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Patent number: 7083371Abstract: A method and apparatus for holding a screw captive to a printed circuit board (PCB), with a channel formed through the apparatus and a mounting hole formed through the PCB being in alignment to allow a screw to pass therethrough.Type: GrantFiled: December 13, 2001Date of Patent: August 1, 2006Assignee: Intel CorporationInventor: Eric D. McAfee