Patents by Inventor Eric Dellinger

Eric Dellinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8504950
    Abstract: Disclosed herein is an ASIC having a base array of function blocks. Each function block includes a plurality of primitive cells. Each primitive cell is defined by a component from a standard cell library. The base array is prefabricated for use later with a custom circuit design.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: August 6, 2013
    Assignee: Otrsotech, Limited Liability Company
    Inventor: Eric Dellinger
  • Publication number: 20100299648
    Abstract: Disclosed herein is an ASIC having a base array of function blocks. Each function block includes a plurality of primitive cells. Each primitive cell is defined by a component from a standard cell library. The base array is prefabricated for use later with a custom circuit design.
    Type: Application
    Filed: July 23, 2010
    Publication date: November 25, 2010
    Inventor: Eric Dellinger
  • Patent number: 7770144
    Abstract: Disclosed herein is an ASIC having a base array of function blocks. Each function block includes a plurality of primitive cells. Each primitive cell is defined by a component from a standard cell library. The base array is prefabricated for use later with a custom circuit design.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: August 3, 2010
    Inventor: Eric Dellinger
  • Patent number: 7648912
    Abstract: Disclosed herein is an integrated circuit customized by mask programming using custom conducting layers and via layers interspersed with the custom conducting layers, where the via layers are defined by masks designed prior to receiving a custom circuit design.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: January 19, 2010
    Inventor: Eric Dellinger
  • Patent number: 7102237
    Abstract: Disclosed herein is an integrated circuit customized by mask programming using custom conducting layers and via layers interspersed with the custom conducting layers, where the via layers are defined by masks designed prior to receiving a custom circuit design.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: September 5, 2006
    Assignee: Lightspeed Semiconductor Corporation
    Inventor: Eric Dellinger
  • Patent number: 6885043
    Abstract: An embodiment of the invention includes a routing architecture with a plurality of predesigned layers and a custom layer. The structure includes a plurality of parallel vertical tracks. In one layer, the tracks include a pin coupled to an input/output of an underlying function block and the track also includes a first portion of an unbroken conductive path. A second portion of the unbroken conductive path is formed under the pin in at least a second predesigned layer. In some embodiments, the second portion of the unbroken conductive path is formed in the second predesigned layer for some tracks and a third predesigned layer for other tracks. Hence, pins and unbroken conductive paths are multiplexed in a single track. In addition, the second predesigned layer further includes long horizontal conductors.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: April 26, 2005
    Assignee: Lightspeed Semiconductor Corporation
    Inventors: Lyle Smith, Eric Dellinger, Eric West, Shridhar Mukund
  • Publication number: 20040243966
    Abstract: Disclosed herein is an ASIC having a base array of function blocks. Each function block includes a plurality of primitive cells. Each primitive cell is defined by a component from a standard cell library. The base array is prefabricated for use later with a custom circuit design.
    Type: Application
    Filed: May 28, 2003
    Publication date: December 2, 2004
    Inventor: Eric Dellinger
  • Patent number: 6696856
    Abstract: Described herein is an ASIC having an array of predesigned function blocks. The function blocks can be used to implement combinational logic, sequential logic, or a combination of both. The function blocks also have a selectable output drive strength. The output drive strength can be selected, in some embodiments, using mask programming.
    Type: Grant
    Filed: October 30, 2001
    Date of Patent: February 24, 2004
    Assignee: Lightspeed Semiconductor Corporation
    Inventors: Lyle Smith, Eric Dellinger, Eric West, Shridhar Mukund
  • Patent number: 6613611
    Abstract: A customizable ASIC routing architecture is provided. The architecture utilizes the uppermost metal layers of an ASIC composed of an array of function blocks for routing among function blocks while lower layers are used for local interconnections within the function blocks. The second-to-uppermost metal layer is fixed and generally includes a plurality of parallel segmented conductors extending in a first direction. The uppermost metal layer is customizable in a predesignated manner. Metal in the uppermost metal layer is selectively placed in tracks, which are substantially perpendicular to the segmented conductors in the layer below. Vias are provided between the two uppermost layers. One embodiment of the invention permits one-mask customization of an ASIC. Other embodiments allow a determination to be made of the ideal number of custom mask steps, taking into consideration performance, cost, time, and routability.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: September 2, 2003
    Assignee: Lightspeed Semiconductor Corporation
    Inventors: Dana How, Robert Osann, Jr., Eric Dellinger
  • Publication number: 20030155587
    Abstract: An embodiment of the invention includes a routing architecture with a plurality of predesigned layers and a custom layer. The structure includes a plurality of parallel vertical tracks. In one layer, the tracks include a pin coupled to an input/output of an underlying function block and the track also includes a first portion of an unbroken conductive path. A second portion of the unbroken conductive path is formed under the pin in at least a second predesigned layer. In some embodiments, the second portion of the unbroken conductive path is formed in the second predesigned layer for some tracks and a third predesigned layer for other tracks. Hence, pins and unbroken conductive paths are multiplexed in a single track. In addition, the second predesigned layer further includes long horizontal conductors.
    Type: Application
    Filed: January 18, 2002
    Publication date: August 21, 2003
    Inventors: Lyle Smith, Eric Dellinger, Eric West, Shridhar Mukund