Abstract: Carbon nanotube-based multi-sensors for packaging applications and methods to form the carbon nanotube-based multi-sensors are capable of simultaneously measuring at least two measurands including temperature, strain, and humidity via changes in its electrical properties.

Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

Abstract: Carbon nanotube-based multi-sensors for packaging applications and methods to form the carbon nanotube-based multi-sensors are capable of simultaneously measuring at least two measurands including temperature, strain, and humidity via changes in its electrical properties.

Abstract: Carbon nanotube-based multi-sensors for packaging applications and methods to form the carbon nanotube-based multi-sensors are capable of simultaneously measuring at least two measurands including temperature, strain, and humidity via changes in its electrical properties.

Abstract: Carbon nanotube-based multi-sensors for packaging applications and methods to form the carbon nanotube-based multi-sensors are capable of simultaneously measuring at least two measurands including temperature, strain, and humidity via changes in its electrical properties.

Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

Abstract: The present invention is a process for making an olefin product from an oxygen-containing organic feedstock comprising: providing a mixture of said oxygen-containing feedstock, an hydrocarbon and optionally an inert diluent, contacting said mixture in a reaction zone having an inner surface (the MTO reactor) with a zeolitic catalyst at conditions effective to convert at least a part of the oxygen-containing organic feedstock to olefin products (the MTO reactor effluent), recovering a reactor effluent comprising light olefins, a heavy hydrocarbon fraction and undesired by-products, wherein: at least a part of the inner surface is passivated such that the undesired by-products are reduced by comparison with a non passivated inner surface and/or one or more sulphur compound is co-injected with the said oxygen-containing feedstock and the hydrocarbon and said sulphur compound is capable to reduce the undesired by-products by comparison with a non injection of sulphur compound.

Abstract: The present invention discloses a method for transforming a single reactor line into a double reactor line wherein the existing single reactor line is equipped with a flash tank for separating the solid polymer product from the flash vapor and wherein the vapor is sent to a system of at least two separating columns allowing the separation of its constituents into monomer, diluent and comonomer.

Abstract: The present invention discloses a method for transforming a single reactor line into a double reactor line wherein the existing single reactor line is equipped with a flash tank for separating the solid polymer product from the flash vapour and wherein the vapour is sent to a system of at least two separating columns allowing the separation of its constituents into monomer, diluent and comonomer.

Abstract: The present invention discloses a method for transforming a single reactor line into a double reactor line wherein the existing single reactor line is equipped with a flash tank for separating the solid polymer product from the flash vapor and wherein the vapor is sent to a system of at least two separating columns allowing the separation of its constituents into monomer, diluent and comonomer.

Abstract: The present invention is a process for making an olefin product from an oxygen-containing organic feedstock comprising: providing a mixture of said oxygen-containing feedstock, an hydrocarbon and optionally an inert diluent, contacting said mixture in a reaction zone having an inner surface (the MTO reactor) with a zeolitic catalyst at conditions effective to convert at least a part of the oxygen-containing organic feedstock to olefin products (the MTO reactor effluent), recovering a reactor effluent comprising light olefins, a heavy hydrocarbon fraction and undesired by-products, wherein: at least a part of the inner surface is passivated such that the undesired by-products are reduced by comparison with a non passivated inner surface and for one or more sulphur compound is co-injected with the said oxygen-containing feedstock and the hydrocarbon and said sulphur compound is capable to reduce the undesired by-products by comparison with a non injection of sulphur compound.

Abstract: The present invention discloses a method for transforming a single reactor line into a double reactor line wherein the existing single reactor line is equipped with a flash tank for separating the solid polymer product from the flash vapour and wherein the vapour is sent to a system of at least two separating columns allowing the separation of its constituents into monomer, diluent and comonomer.

Abstract: A method of removing and/or reducing undesirable contaminants removes residues including graphitic layers, fluorinate layers, calcium sulfate (CaSO4) particles, tin oxides and organotin, from a chip passivation layer surface. The method uses a plasma process with an argon and oxygen mixture with optimized plasma parameters to remove both the graphitic and fluorinated layers and to reduce the level of the inorganic/tin oxides/organotin residue from an integrated circuit wafer while keeping the re-deposition of metallic compounds is negligible. This invention discloses the plasma processes that organics are not re-deposited from polymers to solder ball surfaces and tin oxide thickness does not increase on solder balls. The ratio of argon/oxygen is from about 50% to about 99% Ar and about 1% to about 50% O2 by volume. Incoming wafers, after treatment, are then diced to form individual chips that are employed to produce flip chip plastic ball grid array packages.

Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.

Abstract: A method of removing and/or reducing undesirable contaminants removes residues including graphitic layers, fluorinate layers, calcium sulfate (CaSO4) particles, tin oxides and organotin, from a chip passivation layer surface. The method uses a plasma process with an argon and oxygen mixture with optimized plasma parameters to remove both the graphitic and fluorinated layers and to reduce the level of the inorganic/tin oxides/organotin residue from an integrated circuit wafer while keeping the re-deposition of metallic compounds is negligible. This invention discloses the plasma processes that organics are not re-deposited from polymers to solder ball surfaces and tin oxide thickness does not increase on solder balls. The ratio of argon/oxygen is from about 50% to about 99% Ar and about 1% to about 50% O2 by volume. Incoming wafers, after treatment, are then diced to form individual chips that are employed to produce flip chip plastic ball grid array packages.

Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.

Abstract: The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. In another aspect, a soldering method for joining objects is provided comprising the following steps. A flux composition and a solder compound are applied to at least a portion of one or more of the objects. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. The objects are then joined.

Abstract: Utilizing an appropriately configured laser interferometer, the warpage of a silicon chip can be easily monitored during the solder reflow attachment process in an effort to determine the amount of stress encountered by the chip. Warpage measurements can then be continuously monitored throughout the process and related data can be stored to easily suggest the level of warpage generated by various processing parameters. By dynamically monitoring warpage in conjunction with processing parameters, a correlation can be established between the various parameters chosen, and resulting warpage. Based upon this correlation, the evaluators can easily identify those parameters which produce minimum stress, thus avoiding potential for breakage and damage during reflow operations.