Patents by Inventor Eric E. Bouchard

Eric E. Bouchard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS
    Publication number: 20090294090
    Abstract: An apparatus for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided an apparatus for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.
    Type: Application
    Filed: August 12, 2009
    Publication date: December 3, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Eric E. Bouchard, Guy Brouillette, David H. Danovitch, Peter A. Gruber, Jean-Luc Landreville
  • MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS
    Publication number: 20080156849
    Abstract: An apparatus and a method for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.
    Type: Application
    Filed: January 3, 2007
    Publication date: July 3, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Eric E. Bouchard, Guy Brouillette, David H. Danovitch, Peter A. Gruber, Jean-Luc Landreville