Abstract: A multi-layer printed circuit board provides at least two sections thereon. One section has a grouping of high-impedance traces and another adjacent section, separated by a dividing line, has a mainly low-impedance signal traces. The high-impedance section has at least one of a ground and power plane separated from a grouping of central layers, containing the high-impedance traces, by at least one empty or “void” layer. The void layer is likewise filled by the ground and power planes in the within low-impedance section by stepping the ground/power plane inwardly toward the central layers while providing another low-impedance signal trace in the layer above and below the respective ground and power planes. In a preferred embodiment there are at least nine layers of circuit board material with high-impedance traces on a central grouping of at least three central board layers with three layers disposed respectively above and below the central board layers.