Abstract: A removable hot box is disclosed that includes a lower hot box portion, comprising: a lower housing comprising a plurality of lower clamping structures to clamp the lower housing to a press and locating structures to provide repeatable placing in the press; and a lower heating platen, received within the lower housing, wherein the lower housing or the lower heating platen comprises lower electrical connectors to provide a lower electrical connection to a heating system and lower cooling connectors to provide a lower cooling connection to a cooling system; and an upper hot box portion, positionable above the lower hot box portion and comprising: an upper housing comprising a plurality of upper clamping structures to clamp the upper housing to the press; an upper heating platen, received within the upper housing.

Abstract: A method for and a disassemblable prepackage arrangement for testing and burning-in an integrated circuit die which will be hermetically sealed within and form part of an overall integrated circuit package is herein disclosed. The die has a top and bottom surface and includes a plurality of die input/output terminals. The prepackage comprises a substrate including a top surface. The bottom of the die is disengagably attached to the top surface of the substrate. A lid is disengagably attached to the substrate in a way which hermetically seals the die within a space substantially defined by the substrate and the lid. Thereafter, the die input/output terminals are electrically connecting to external testing equipment for testing and burning-in the die while the die is in a hermetically sealed environment.