Patents by Inventor Eric G. Barnes

Eric G. Barnes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170106565
    Abstract: A system and method for producing a uniform continuous fiber filament. The system and method include a fiber tow with an axial magnet attached to an end of the fiber tow, a polymer tube, and a radial magnet that fits around a circumference of the polymer tube. The radial and axial magnets are used to feed the fiber tow through the polymer tube using magnetic forces to create the uniform continuous fiber filament.
    Type: Application
    Filed: October 14, 2015
    Publication date: April 20, 2017
    Inventors: DANIEL J. BRALEY, ANTHONY M. TAMAYO, ERIC G. BARNES
  • Publication number: 20170057155
    Abstract: A system is described for reinforcing a thermoplastic workpiece including a subject surface and an underlying workpiece body volume. At least one substantially linear Z-pin having proximal and distal pin ends longitudinally separated by a pin body is provided. The proximal pin end is in direct contact with the subject surface. An ultrasonic energy source applies ultrasonic energy to the Z-pin to ultrasonically heat the Z-pin and thus locally melt the workpiece material of the subject surface and/or the workpiece body to create a melted workpiece material. The proximal pin end and at least a portion of the pin body of the Z-pin are penetrated into the melted workpiece material to create an inserted Z-pin length. The inserted Z-pin length is maintained in the workpiece body volume by solidified melted workpiece material around the inserted Z-pin length to reinforce the workpiece. A method of reinforcing a workpiece is also provided.
    Type: Application
    Filed: September 2, 2015
    Publication date: March 2, 2017
    Applicant: Northrop Grumman Systems Corporation
    Inventors: ERIC G. BARNES, Park S. Sung, Pedro A. Gonzalez, Anthony Tamayo, Todd Lewis Szallay
  • Publication number: 20160316556
    Abstract: An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema® filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.
    Type: Application
    Filed: April 21, 2015
    Publication date: October 27, 2016
    Inventors: Daniel J. Braley, Eric G. Barnes, Pedro Gonzalez